• Asian Journal of Atmospheric Environment
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• 제6권2호
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• pp.83-95
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• 2012

China has been a top producer and exporter of refined lead products in the world since the year 2000. After the phasing-out of leaded gasoline in the late 1990s, non-ferrous metallurgy and coal combustion have been identified as potential major sources of aerosol lead in China. This paper presents the single particle analytical results of ambient aerosol particles collected near a lead smelter using a scanning electron microscopy- energy dispersive x-ray spectroscopy (SEM-EDX). Aerosol particle samples were collected over a 24-hour period, starting from 8 pm on 31 May 2002, using a high volume TSP sampler. For this near source sample, 73 particles among 377 particles analyzed (accounting for 19.4%) were lead-containing particles mixed with other species (S, Cl, K, Ca, and/or C), which probably appeared to be from a nearby lead smelter. Lead-containing particles of less than $2{\mu}m$ size in the near source sample were most frequently encountered with the relative abundances of 42%. SEM-EDX analysis of individual standard particles, such as PbO, PbS, $PbSO_4$, $PbCl_2$, and $PbCO_3$, was also performed to assist in the clear identification of lead-containing aerosol particles. Lead-containing particles were frequently associated with arsenic and zinc, indicating that the smelter had emitted those species during the non-ferrous metallurgical process. The frequently encountered particles following the lead-containing particles were mineral dust particles, such as aluminosilicates (denoted as AlSi), $SiO_2$, and $CaCO_3$. Nitrate- and sulfate-containing particles were encountered frequently in $2-4{\mu}m$ size range, and existed mostly in the forms of $Ca(NO_3,SO_4)/C$, $(Mg,Ca)SO_4/C$, and $AlSi+(NO_3,SO_4)$. Particles containing metals (e.g., Fe, Cu, and As) in this near source sample had relative abundances of approximately 10%. Although the airborne particles collected near the lead smelter contained elevated levels of lead, other types of particles, such as $CaCO_3$-containing, carbonaceous, metal-containing, nitrates, sulfates, and fly-ash particles, showed the unique signatures of samples influenced by emissions from the lead smelter.

• 한국재료학회지
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• 제6권7호
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• pp.700-708
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• 1996

Flip chip bonding에 무전해도금기술을 적용하여 solder bumper형성의 최적 조건을 규명하였다. 시편은 AI 패턴된 4 inch Si 웨이퍼를 사용하고, 활성화 처리시 zincate 용액을 사용하였으며, 무전해 도금은 Ni-P 도금액고 Au immersion 용액을 사용하였다. 활성화 물질의 AI 침식정도 및 Zn 석출 정도를 알아보기 위하여 EDS측정을 하였고, 각 공전에서의 표면형상을 알아보기 위해 SEM 분석을 하였다. 열처리 후 금도금층의 주 결정성장 방향은 XRD를 이용하여 측정하였다. 산처리에서 질산과 황산 중 질산에 의한 산화막제거 정도가 더 우수하게 나타났다. 활성화 처리시 zincate 용액을 희석시킬수록 입자 크기가 미세해 지고, 활성화 물질은 pH 13-13.5, 상온, 농도 15-25%의조건에서 크기가 작은 Zn 활성화 물질이 균일하게 분포하였다. Ni과 Auan전해도금 속도는 온도와 pH가 증가할수록 증가하였다. Ni 무전해 도금 조건은 pH 4.5, 온도 $90^{\circ}C$, 시간 20분이며, Au 무전해 도금조건은 pH7, 온도 $80^{\circ}C$, 시간 10분이었다. 상온에서 $400^{\circ}C$까지 30분동안 열처리 한 후 금도금막의 결정 방향은 pH 7, 온도 $80^{\circ}C$, 시간 10분이었다. 상온에서 $400^{\circ}C$까지 30분 동안 열처리 한 후 금도금막의 결정 방향은 pH 7에서 (111), pH 9에서는 (200)과 (111)이 주 peak로 나타났으며, 열처리에 의한 결정 방향의 변화는 없었다. 전체 공정에서 최종적인 표면 형상에 영향을 주는 단계는 활성화 처리로서 flip chip의 bonding layer형성에 가장 중요한 요소임을 알 수 있었다.보다 자생지(自生地)에서 높은 함량(含量)을 보였다. 5. 무기성분함양(無機成分含量)의 차이(差異)는 K의 경우(境遇) 자생지(自生地)에서 보다 재배지(栽培地)에서 평균적(平均的)으로 10배이상(倍以上) 정도(程度) 높은 함량(含量)의 차이(差異)를 보였으나 Mn, Zn, Na, Cu 등(等)은 일정(一定)한 경향(傾向)을 보이지 않는 것으로 나타났다. 6. 유리(遊離) 아미노산(酸)의 함량(含量)은 자생지(自生地은)보다 재배지(栽培地)에서 전반적(全般的)으로 높은 함량(含量)을 나타내었고, 특(特)히 Arginine은 다른 성분(成分)들과 비교(比較)해 볼 때 가장 높은 조성(組成)의 차이(差異)를 나타내었다. 7. 야생(野生)더덕과 재배(栽培)더덕의 정유성분수율(精油成分收率)은 자생지재배(自生地栽培)에서는 모두 0.004% 였고 재배지(栽培地)에서는 야생(野生)더덕이 0.005%였다. 8. 더덕의 재배장소(栽培場所)에 따른 향기성분(香氣成分)은 총(總) 21종(種)이었으며 自生地(自生地)에서 야생(野生)더덕은 16종(種), 재배(栽培)더덕은 18종(種)이었고, 재배지(栽培地)에서 야생(野生) 더덕은 14종(種), 재배(栽培)더덕은 20(種)이었다. 9. Trans-2-hexanol은 야생(野生)더덕의 자생지(自生地) 재배(栽培)에서 피이크 면적(面積) 당(當) 50.3%, 재배지(栽培地)에서 피이크 면적(面積) 당(當) 43.3%를 보였으며 amylalcohol, furfuryl acetate, 2-methoxy-4-vinyl phenol(MVP)는 재배(栽培)더덕에서만 확인(確認)되었다.는 KI, BMI와 유의적인 양의 상관관계를 보였고 (p<0.01), HCL-C은 비체중, BMI, LBM, TBM와 유의적인 음의 상관관계를 보였으며, (p<0.01), KI, SBP와도 음의 상관관계를 보였다. (p<0.05), LCL-C는 KI와 유의적이인 양의

• 한국결정성장학회:학술대회논문집
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• 한국결정성장학회 1998년도 PROCEEDINGS OF THE 14TH KACG TECHNICAL MEETING AND THE 5TH KOREA-JAPAN EMGS (ELECTRONIC MATERIALS GROWTH SYMPOSIUM)
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• pp.91-95
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• 1998

Exchange anisotropy between IrMn antiferromagnetic layer and NiFe ferromagnetic layer has been studied in IrxMn(100-x)/NiFe/Buffr/Si(100) films deposited by D. C. magnetron sputtering method. Among Zr, Ta, and Cu used as buffer layer, Zr and Ta enhanced the fcc(111) texture of NiFe and IeMn layer, but Cu did not affect microstructure of those layer. Strong fcc(111) texture of IrMn layer was confirmed to be the origin of exchange anisotropy of IrMn. Ir composition control in IrMn layer showed that {{{{ gamma -phase}}}} IrMn is stabilized between 10 and 30 at % Ir, an 21 at. % Ir in IrMn layer was optimum composition that showed maximum exchange anisotropy field. above 200 ${\AA}$ thickness of IrMn, antiferromagnetic property is stabilzed to show saturated exchange anisotropy field. Based pressure was confirmed to be critical requisite in IrMn-based spin-valve GMR system.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집
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• pp.474-477
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• 2002

We performed a continuous heat treatment experiment for long Si$_2$Sr$_2$CaCuO$_{x}$ (Bi2212) superconductor tapes on copper substrates. A precursor that contains a mixture of Bi$_2$O$_3$, SrCO$_3$, and CaCO$_3$ powders was prepared and screen-printed on Cu tapes. The screen- printed tapes were thermally treated by consecutive processes with various temperature settings using an air-filled tube furnace. The diffraction patterns and the microstructures of the high temperature superconductor thick films were analyzed by X-ray diffractometry (XRD) and optical Microscopy respectively, and the critical temperatures of the superconducting thick films were measured. The critical temperatures of the superconducting films were measured to be about 77K, and the films'crystallographic c-axes were confirmed to be normal to the film surfaces by XRD and morphology observation. We also observed that the thick superconducting layer is formed and aligned on the copper substrate via partial melted state that consists of a liquid phase and a secondary phase.e.

• 한국재료학회지
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• 제17권2호
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• pp.91-95
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• 2007

Electromigration characteristics of Sn-3.5Ag flip chip solder bump were analyzed using flip chip packages which consisted of Si chip substrate and electroplated Cu under bump metallurgy. Electromigration test temperatures and current densities peformed were $140{\sim}175^{\circ}C\;and\;6{\sim}9{\times}10^4A/cm^2$ respectively. Mean time to failure of solder bump decreased as the temperature and current density increased. The activation energy and current density exponent were found to be 1.63 eV and 4.6, respectively. The activation energy and current density exponent have very high value because of high Joule heating. Evolution of Cu-Sn intermetallic compound was also investigated with respect to current density conditions.

• 소성∙가공
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• 제12권6호
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• pp.588-596
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• 2003

The relationships between evolution of microstructure and mechanical properties of porous Al-3Si-2Mg-2Cu alloy after the foaming and various heat treating were investigated. The foamed alloy having various densities were manufactured by powder compact foaming and heat treated. Then compression test was performed with deformation rate of 0.5/s. The ultimate compression strength was not changed after solution heat treatment but the flow curve after ultimate strength showed very smooth and uniform plateau region. This change of flow curve means that the deformation mechanism is altered from brittle fracture to ductile deformation and the energy absorption property of Al foam is dramatically improved. The improvement of energy absorption without any detriment of mechanical properties is due to that the very brittle precipitation like Al-Cu and Al-Mg was uniformly dissolved in Al matrix after solution heat treatment. And various mechanical properties of Al alloy porous material were improved by 40% with aging of $200^{\circ}C$ and 50min. These improvements are ascribe to the various fine precipitates like $\Omega$ and $\theta$'.

• 대한화학회지
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• 제31권6호
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• pp.503-508
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• 1987

3,4 : 9,10-dibenzo-1,12-diaza-5,8-dioxacyclotetradecane $(NenOenH_4)$과 전이금속이온$(Cu^{2+},\;Ni^{2+},\;Co^{2+},\;Zn^{2+},\;Mn^{2+})$과의 착물의 안정도상수를 50%다이옥산-수용액에서 이온강도를 0.1로 하고, 전위차법적정으로 측정한 결과, 전이금속이온과 리간드가 만드는 착물의 안정도상수의 순서는 Williams-Irving서열과 일치한다.

• 한국항해항만학회:학술대회논문집
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• 한국항해항만학회 2000년도 추계학술대회논문집
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• pp.97-100
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• 2000

Si$_2$Sr$_2$CuO$\sub$x/(Bi(2201)) thin films are fabricated by atomic layer by layer deposition using ion beam sputtering(IBS) method. During the deposition, 10 %-ozone/oxygen mixture gas of typical 5.0 ${\times}$ 10$\^$-5/ Torr is applied with ultraviolet light irradiation for oxidation. XRD and RHEED investigations reveal out that a buffer layer with some different compositions is formed at the early deposition stage of less than 10 units cell and then c-axis oriented Bi(2201) is grown.

• 한국분말재료학회지
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• 제15권1호
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• pp.18-22
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• 2008

The electromagnetic (EM) wave absorption properties with a variation of crystallization annealing temperature have been investigated in a sheet-type absorber using the $Fe_{73}Si_{16}B_7Nb_3Cu_1$ alloy powder. With increasing the annealing temperature the complex permeability (${\mu}_r$), permittivity (${\varepsilon}_r$) and power absorption changed. The EM wave absorber shows the maximum permeability and permittivity after the annealing at $610^{\circ}C$ for 1 hour, and its calculated power absorption is above 80% of input power in the frequency range over 1.5 GHz.

• 한국진공학회:학술대회논문집
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• 한국진공학회 1997년도 제13회 학술발표회 논문개요집
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• pp.114-114
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• 1997