Effect of Joule Heating on Electromigration Characteristics of Sn-3.5Ag Flip Chip Solder Bump
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Lee, Jang-Hee
(School of Materials Science and Engineering, Andong National University)
Yang, Seung-Taek (Package R&D Division, Hynix Semiconductor Inc.) Suh, Min-Suk (Package R&D Division, Hynix Semiconductor Inc.) Chung, Qwan-Ho (Package R&D Division, Hynix Semiconductor Inc.) Byun, Kwang-Yoo (Package R&D Division, Hynix Semiconductor Inc.) Park, Young-Bae (School of Materials Science and Engineering, Andong National University) |
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