• Journal of the Microelectronics and Packaging Society
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• v.21 no.3
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• pp.1-6
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• 2014

The demand for fine-pitch devices is increasing due to an increase in I/O pin count, a reduction in power consumption, and a miniaturization of chip and package. In addition non-scalability of Cu pillar/Sn cap or Pb-free solder structure for fine-pitch interconnection leads to the development of bumpless interconnection system. Few bumpless interconnect systems such as BBUL technology, SAB technology, SAM technology, Cu-toCu thermocompression technology, and WOW's bumpless technology using an adhesive have been reviewed in this paper: The key requirements for Cu bumpless technology are the planarization, contamination-free surface, and surface activation.

• Journal of Institute of Control, Robotics and Systems
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• v.15 no.7
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• pp.655-660
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• 2009

In many real applications, the discrepancy problem between controller outputs and plant inputs or the abrupt variation problem of controller outputs can occur. These problems have a negative effect on control performance and stability. It is well-known that two phenomena called 'windup' and 'bump' cause these problems. So far these problems have been studied separately in each side of the anti-windup and the bumpless transfer. This paper proposes a new unified method combines the anti-windup and the bumpless transfer method using the linear quadratic minimization and a proper state space model representation for the anti-windup controller. The proposed method has a feature that it takes account of both the anti-windup and the bumpless transfer in one formula. Finally, we exemplify the performance of the proposed method via numerical examples using the controller switching between the anti-windup PID controller and the anti-windup LQ controller.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.4
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• pp.71-78
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• 2012

This paper describes trends in conventional scaling compared with advanced technologies such as 3D integration (3DI) and bumpless through-silicon via (TSV) processes, as well as the characteristics of CMOS (Complementary Metal Oxide Semiconductor) Logic device after thinning the wafers to less than $10{\mu}m$. Each module process including thinning, stacking, and TSV, is optimized for 3D Wafer-on-Wafer (WOW) application. Optimization results are discussed with valuable data in detail. Since vertical wiring of bumpless TSV can be connected directly to the upper and lower substrates by self-alignment, bumps are not necessary when TSV interconnects are used.

• Journal of Institute of Control, Robotics and Systems
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• v.15 no.10
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• pp.982-987
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• 2009

On the controller switching time, even though on-line/off-line controller outputs are the same, a problem which deteriorates the performance of bumpless transfer can happen in case that any discrepancy between the two controller inputs is transferred directly to the controller output. In this paper, we analyze the cause of that phenomenon in existing research results and propose a new method which improves that problem. In order to solve this problem, the off-line controller is augmented to an anti-windup structure and an improved bumpless transfer method is derived by using the changed input of the off-line controller instead of the plant input. We exemplify the performance of the proposed method by comparing with the performance of the existing method via numerical examples.

• Proceedings of the KIEE Conference
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• 1998.11c
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• pp.1037-1040
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• 1998

In this research a fault-tolerant and bumpless switching control is proposed for boiler systems used in the power plants. Firstly, three operating points are selected to control the nonlinear boiler through the full operational range, and the $H_{\infty}$ loop shaping controller and the model-based predictive controller(MBPC) are designed. To prevent the windup and bump problems which are caused by the actuator saturation and the controller switching, an anti-windup and bumpless transfer technique is adopted to the $H_{\infty}$ loop shaping controller. Also the constrained gain-scheduling technique is applied to MBPC to achieve the same objective. Secondly, the fault-tolerant control technique is proposed to continue the control action without stopping the boiler operation even in case of some faults. Through various simulation studies, the performances of the proposed control techniques are demonstrated.

• Journal of Institute of Control, Robotics and Systems
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• v.6 no.4
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• pp.247-253
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• 2000

In this paper, we deal with the full range control problem of nonlinear boiler systems subject to complex actuator constraints. Firstly, $H\infty$ loop shaping design procedure［10］ is used for the controller design. Secondly, modified high-gain feedback［11］ for the loop shaping controller is adopted for the anti-windup function and the bumpless transfer technique between controllers is proposed for the full range control of nonlinear systems. Finally, the performance of the proposed controller is demonstrated through the simulation studies.

• Proceedings of the KIEE Conference
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• 1998.11a
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• pp.369-372
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• 1998

In this research a fault-tolerant and bumpless switching control is proposed for boiler systems used in the power plants. Firstly, three operating points are selected to control the nonlinear boiler through the full operational range, and the $H_{\infty}$ loop shaping controller and the model-based predictive controller(MBPC) are designed. To prevent the windup and bump problems which are caused by the actuator saturation and the controller switching, an anti-windup and bumpless transfer technique is adopted to the $H_{\infty}$ loop shaping controller. Also the constrained gain-scheduling technique is applied to MBPC to achieve the same objective. Secondly, the fault-tolerant control technique is proposed to continue the control action without stopping the boiler operation even in case of some faults. Through various simulation studies, the performances of the proposed control techniques are demonstrated.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.131-132
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• 2009

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.36 no.6
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• pp.574-580
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• 2008

This paper has proposed a controller switching scheme for full-envelope aircraft control using the bumpless transfer implementation algorithm developed recently. This switching scheme has combined by proper rules the common existing method which switches the controller according to attitude and mach number of the aircraft with an optimization method which uses the cost function relating to bump phenomenon by means of controller switching criterion. This paper exemplifies the control performance improvement via simulations applied to a high performance aircraft benchmark problem in a wide operating range to test the proposed controller switching scheme.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.34 no.11
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• pp.35-41
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• 2006

This paper proposes an algorithm for switching LQ(Linear Quadratic) controllers designed at each flight envelope without a bump phenomenon. This algorithm is derived to apply to LQ controller more easily than existing implementation algorithm and is proposed to consider trim points of nonlinear models, which is adequate to real applications. This paper exemplifies the control performance improvement via simulations applied to LQ control of a supersonic test aircraft as a benchmark problem to test the proposed algorithm performance.