• Korean Journal of Optics and Photonics
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• v.7 no.4
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• pp.434-439
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• 1996

To investigate influence of the incident beams which have the truncated Gaussian amplitude and of the shapes of bump on read-out signal is an optical disc, and the point spread function on bump, the scalar diffraction theory is used in this paper. We consider the truncated Gaussian amplitudes which are $\sigma$=0, 0.5, 1.5, and 2.5, the height of bump which is given by $n{\Delta}_0={\lambda}/4$, and the phase height of bump which is then given by ${\Phi}_0={\pi}$. We also consider the shapes of the bump which are a rectangular shape, a frustoconical shape, and a conical shape. It is shown that as the truncation of incident beam reduces the radius of central spot on bump decreases, the maximum value of read-out signal increases, and that the size of bump decreases. From these results, we get better read-out signal and the reduced cross-talk in optical disc when the truncation of incident beam reduces. Therefore a laser beam having less truncated Gaussian amplitude may useful for an actual optical disc.

• Laser Solutions
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• v.4 no.3
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• pp.40-44
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• 2001

Microbump formation during CO$_2$ laser texturing of glass substrates is examined in this paper. Experimental results show that different bump shapes (dome-shaped, with a central dimple, and with a peripheral rim) are generated depending on the laser fluence. A theoretical model for the process is suggested based on thermoelastic behavior but limited only to the dome-shaped bump. The dimensions (maximum height and base area) of the bump shows a logarithmic dependence on laser fluence as expected from the theory. Numerical computation reveals that the effect of thermal diffusion is not negligible for relatively long laser pulses.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2007.05a
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• pp.833-836
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• 2007

Load/Unload technology has more benefits than the conventional CSS technology. However, it remains unsolved technical problem on the unloading process. While the slider climbs up the ramp at the outer edge of the disk, the possibility of the slider-disk contact by lift-off force and rebound of the slider increases. This paper focuses on no slider-disk contact. To prevent the slider-disk contact, we apply the disk bump on disk outer edge proceeding unload. Firstly, in the simulation, the bump dimension is determined by changing bump design parameters. Secondly, dynamic stability of slider have to be checked on disk bump before unload analysis, and unload analysis is performed by applying stable bump shapes to unload simulation. Thirdly, we select optimal bump shape to improve unload performance by unload analysis. Finally, in the experiment, the disk bump is mechanically manufactured by pressing disk surface using diamond tip. That is variously processed by changing pressing pressure. After confirming bump shape by nano-scanner, proper bump shape is applied to real experimental unload process. Through this investigation, we propose the optimal bump design to prevent the slider-disk contact, and then we can realize improved unloading performance.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.1
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• pp.33-38
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• 2001

We investigate the via-size dependance of as-electroplated- and reflow-bump shapes for realizing both high-density and high-aspect ratio of solder bump. The solder bump is fabricated by subsequent processes as follows. After sputtering a TiW/Al electrode on a 5-inch Si-wafer, a thick photoresist for via formation it obtained by multiple-codling method and then vias with various diameters are defined by a conventional photolithography technique using a contact alinger with an I-line source. After via formation the under ball metallurgy (UBM) structure with Ti-adhesion and Cu-seed layers is sputtered on a sample. Cu-layer and Sn/pb-layer with a competition ratio of 6 to 4 are electroplated by a selective electroplating method. The reflow-bump diameters at bottom are unchanged, compared with as-electroplated diameters. As-electroplated- and reflow-bump shapes, however, depend significantly on the via size. The heights of as-electroplated and reflow bumps increase with the larger cia, while the aspect ratio of bump decreases. The nearest bumps may be touched by decreasing the bump pitch in order to obtain high-density bump. The touching between the nearest bumps occurs during the overplating procedure rather than the reflowing procedure because the mushroom diameter formed by overplating is larger than the reflow-bump diameter. The arrangement as zig-zag rows can be effective for realizing the flip-chip-interconnect bump with both high-density and high-aspect ratio.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2007.11a
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• pp.1276-1279
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• 2007

The main objectives of the Load/Unload are no slider-disk contact and no media damage. But, it remains unsolved technical problems on the unloading process. While the slider climbs up the ramp at the outer edge of the disk, the possibility of the slider-disk contact by lift-off force and rebound of the slider increases. Keeping in mind of these points, to prevent the slider-disk contact, we apply the disk bump on disk outer edge proceeding unload. First, referring to the simulation results, we select the optimal bump shapes to improve unload performance by unload analysis. Second, the disk bump is mechanically manufactured by pressing disk surface using tungsten tips. The bumps are variously processed by changing pressing pressure of tungsten tips. After confirming bump shape by nano-scanner, the optimal bump shape is applied to experimental unload process. Through this experiment, it is conformed that the unload performance was improved by using the optimal disk bump to prevent the slider-disk contact.

• Korean Journal of Optics and Photonics
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• v.12 no.4
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• pp.270-275
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• 2001

We have studied effects of annular phase apodizer and bump shapes on the read-out signal in an optical disc system, using scalar diffraction theory. In order to detennine the optimum parameters of annular phase apodizer which will minimize the influence of spherical aberration, we defined WR as the ratio between the maximum wavefront aberration and some absolute value of wavefront aberration at any position r in the pupil. A cylindric bump, a semi-conic bump and a conic bump were$.$ also considered as different types of bump shape. As the radius and shape of bump varies, the read-out signal from an optical disc system with an annular phase apodizer was similar to that from an optical disc system without apodizer. When spherical aberration increases, the maximum read-out signal of an optical disc system with an annular phase apodizer and minimum bump radii giving read-out signal higher than 0.6 rarely varied. Especially, the optimum parameters at $W_R$ = 0.4 , 0.6 gave the most compensated effect of a spherical aberration.ration.

• Korean Journal of Optics and Photonics
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• v.10 no.6
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• pp.443-447
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• 1999

To investigate the effect of a shaded apodizer on the read-out signal in an optical disc system, we consider the is apodizer in which the amplitude transmittance decreases gradually from the center of pupil toward its edge and the iH apodizer in which the amplitude transmittance increases gradually from the center of pupil toward its edge, using the scalar diffraction theory. We also consider the bump shapes which are a cylindric, a semi-conic, and a conic bump, and bump height which is given by $\lambda/4$ and occurs to the phase change $(\pi)$). The read-out signal of is apodizer increases from S = 0 upto maximum value, and then decreases for increasingly larger values of bOo While the iH apodizer has two maximum values. When an optical disc system has a spherical aberration $(W_{40}=0.5\lambda)$, the maximum read-OUt signal of is apodizer is higher than that of iv apodizer which has no apodizer.odizer.

• Journal of Biosystems Engineering
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• v.30 no.6 s.113
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• pp.366-372
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• 2005

The objective of this study was to evaluate the bump crossing and loading stability of a proto-type mini-forwarder under development. The evaluation was performed by computer simulation using a multi-body dynamic analysis program, Recur- Dyn 5.21. The proto-type was modeled and its properties such as mass, mass center, and mass moment of inertia were determined using 3D CAD modeler, Solid Edge 8.0. The $\%$ errors of masses, mass center, mass moment of inertia, and vertical motion of the model were within less than $10\%$ and the model's behavior agreed relatively well with those of the proto-type when traversing over a rectangular bump. Using the validated model, bump crossing of the proto-type was simulated and the loading limit was determined. It was found that effects of the shapes of bump on the bump crossing performance was insignificant within the practical heights of bumps. Stability of bump crossing increased with loading. However, loading of longer logs than 2.7 m made the crossing unstable because the ends of logs contacted ground when traversing over the bump. The maximum loading capacity of the proto-type was estimated to be 7.8 kN of 2.7 m long logs.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.2
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• pp.43-50
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• 2009

Although thin PCBs(Printed Circuit Boards) have recently been required for high density interconnection, high electrical performance, and low manufacturing cost, the utilization of thin PCBs is severely limited by warpage and reliability issues. Warpage of the thin PCB leads to failure in solder-joints and chip. The $B^2it$(Buried Bump Interconnection Technology) for PCB has been developed to achieve a competitive manufacturing price. In this study, chip temperature, package warpage, chip stress and solder-joints stress characteristics of the PCB prepared with $B^2it$ process have been calculated using thermo-mechanical coupled analysis by the FEM(Finite Element Method). FEM computation was carried out with the variations in bump shapes and kinds of materials under 1.5W power of chip and constant convection heat transfer. The results show that chip temperature distribution reached more quickly steady-state status with PCB prepared with $B^2it$ process than PCB prepared with conventional via interconnection structure. Although $B^2it$ structures are effective on low package warpage and chip stress, with high strength bump materials arc disadvantage for low stress of solder-joints. Therefore, it is recommended that optimized bump shapes and materials in PCB design should be considered in terms of reliability characteristics in the packaging level.

• Journal of Welding and Joining
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• v.22 no.3
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• pp.62-68
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• 2004

The strip Au bumps are bonded using longitudinal ultrasonic far the electronic package. Au bumps on the chip and substrate are aligned in a crossed shape, and the ultrasonic is imposed on the chip to form the solid-state bond between the Au bumps. Deformed bump shapes are calculated using the finite element method, and the bond strength is measured experimentally. The crossed strip Au bumps are deformed similar to the saddle, which provides larger contact surface area and higher friction force. Compared with the previous bonding method between the Au bump and planar pad, higher bond strength is obtained using the crossed strip bumps.