Longitudinal Ultrasonic Bonding of Strip-type Au Bumps |
김병철
(한국과학기술원, 기계공학과)
김정호 (한국과학기술원, 기계공학과) 이지혜 (한국과학기술원, 기계공학과) 유중돈 (한국과학기술원, 기계공학과) 최두선 (한국기계연구원, 지능형 정밀기계연구부) |
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Yield modeling of MCM assembly with Flip-Chip Thermocompression bonding
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Thermosonic Bonding for Flip-Chip Assembly
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Thermosonic flip-chip bonding system with a self-planarization feature using polymer
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Effects of ultrasound on deformation characteristics of metals
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Modeling and Experimental Studies on Thermosonic Flip-Chip Bonding
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DOI ScienceOn |
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Ultrasonic bonding of In/Au and AI/AI for hermitic sealing of MEMS packaging
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Thermosonic flip-chip bonding using longitudinal ultrasonic vibration
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DOI |
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evelopment of gold to gold interconnection flip chip bonding for chip on suspension assemblies
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Thermosonic Bonding: An Alternative to Area-Array Solder Connections
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