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Longitudinal Ultrasonic Bonding of Strip-type Au Bumps  

김병철 (한국과학기술원, 기계공학과)
김정호 (한국과학기술원, 기계공학과)
이지혜 (한국과학기술원, 기계공학과)
유중돈 (한국과학기술원, 기계공학과)
최두선 (한국기계연구원, 지능형 정밀기계연구부)
Publication Information
Journal of Welding and Joining / v.22, no.3, 2004 , pp. 62-68 More about this Journal
Abstract
The strip Au bumps are bonded using longitudinal ultrasonic far the electronic package. Au bumps on the chip and substrate are aligned in a crossed shape, and the ultrasonic is imposed on the chip to form the solid-state bond between the Au bumps. Deformed bump shapes are calculated using the finite element method, and the bond strength is measured experimentally. The crossed strip Au bumps are deformed similar to the saddle, which provides larger contact surface area and higher friction force. Compared with the previous bonding method between the Au bump and planar pad, higher bond strength is obtained using the crossed strip bumps.
Keywords
Longitudinal ultrasonic; Au bumps; Crossed strip; Deformed bump shape; Electronic packaging;
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