• Journal of Mechanical Science and Technology
• /
• 제14권7호
• /
• pp.744-751
• /
• 2000

To achieve lower flying height for high areal recording density, the laser zone texturing of the disk needs to be designed to reduce glide height. One problem of the laser bump design is that the regular laser bump pattern often produces glide resonance phenomenon, which leads to failure of the glide height test. However, it was found in this study that glide resonance is an intrinsic problem of the glide head used and resonance phenomenon depends on the type of the head slider, that is, the natural frequency of the slider body. Therefore, higher glide height or glide failure caused by glide resonance does not lead to head/media interface problem in the real drive operating conditions in which the data head is used. Pseudo-random bump pattern greatly reduces the glide resonance. Smaller bump pitch will also help to reduce the glide resonance. However, as bump spacing becomes smaller, glide height will be increased due to increased air pressure developed around the bumps. Lowering bump height is the most effect way to reduce glide avalanche.

• 한국전기전자재료학회논문지
• /
• 제14권11호
• /
• pp.874-878
• /
• 2001

Solder bump was electroplated on wafer for flip chip application. The process is as follows. Ti/Cu were sputtered and thick PR was formed by several coating PR layer. Fine pitch vias were opened using via mask and then Cu stud and solder bump were electroplated. Finally solder bump was formed by reflow process. In this paper, we opened 40㎛ vias on 57㎛ thick PR layer and electroplated solder bump with 70㎛ height and 40㎛ diameter. After reflow process, we could form solder bump with 53㎛ height and 43㎛ diameter. In plating process, we improved the plating uniformity within 3% by using ring contact instead of conventional multi-point contact.

• 마이크로전자및패키징학회지
• /
• 제21권2호
• /
• pp.37-41
• /
• 2014

차세대 전자 소자 기술에서 전력전달은 소자의 전력을 낮추고 발열로 인한 문제 해결을 위해서 매우 중요한 기술로 대두되고 있다. 본 연구에서는 직사각형 ABL 전력 범프를 이용한, Cu-to-Cu 플립 칩 본딩 공정의 신뢰성 문제에 대해 살펴보았다. 다이 내 범프 높이 차이는 전기도금 후 CMP 공정을 진행했을 경우 약 $0.3{\sim}0.5{\mu}m$ 이었고, CMP 공정을 진행하지 않았을 경우는 약 $1.1{\sim}1.4{\mu}m$으로 나타났다. 또한 면적이 큰 ABL 전력 범프가 입출력 범프 보다 높이가 높게 나타났다. 다이 내 범프 높이 차이로 인해 플립 칩 본딩 공정 시 misalignment 문제가 발생하였고, 이는 본딩 quality 에도 영향을 미쳤다. Cu-to-Cu 플립 칩 공정을 위해선 다이 내 범프 높이 균일도와 Cu 범프의 평탄도 조절이 매우 중요한 요소라 하겠다.

• 한국광학회지
• /
• 제7권4호
• /
• pp.434-439
• /
• 1996

본 연구에서는 가우스 진폭을 갖는 입사광의 단락된 정도와 광학 디스크 상의 bump의 형태가 재생신호에 미치는 영향과 디스크 bump에 맺히는 회절광 PSF(point spread function)와의 관계를 알아보기 위해 스칼라 회절 이론을 사용하였다. 단락된 가우스 진폭으로 .sigma.=0, 0.5, 1.5, 2.5인 경우를 고려하였으며 bump의 높이는 n.DELTA.$_{o}$ =.lambda./4로서 이는 위상 높이 .PHI.$_{o}$ =.pi.가 된다. 또한 본 연구에서 고려한 bump 형태 즉 직사각형(.DELTA.p$_{o}$ =0)과 준 원추형(.DELTA.p$_{o}$ /2) 그리고 원추형(.DELTA.p$_{o}$ =p$_{o}$ )의 세 가지 경우이다. 본 연구에서 고려한 입사광의 단락된 정도가 작을 수록 bump에 맺는 중심 회절상의 반경이 작게 나타났으며 이때 재생 신호의 극대치는 입사광의 단락된 정도가 작을수록 bump에 맺는 중심 회절상의 반경이 작계 나타났으며 이때 재생 신호의 극대치는 입사광의 단락된 정도가 큰 경우보다 크게 나타났고 bump의 크기도 작게 나타났다. 이러한 결과들로부터 입사광의 단락된 정도가 작을수록 광학 디스크로부터 큰 재생 신호를 얻을 수 있으며 cross-talk가 줄어듬을 알 수 있었다. 그러므로 실제 광학 디스크에 가능한 단락된 정도가 작은 가우스 진폭을 갖는 레이저 광을 입사광으로 사용하면 유용하리라 생각된다.

• Tribology and Lubricants
• /
• 제19권2호
• /
• pp.102-108
• /
• 2003

The height of laser bumps has been considered as the limit of the minimum flying height in the contact start-stop (CSS) of hard disk drives. In this paper, tribological interactions at flying height under laser bumps are investigated in a spin stand for development of ultra-low flying head-disk interface. With the reduction of the spinning speed in a spin stand, the flying height is decreased under the height of laser bumps and, then, head-disk interactions are investigated using AE and stiction/friction signals. During seek tests and 20000 cycle-sweep tests, AE and stiction/friction signals are not significantly changed and there are no catastrophic failures of head-disk interface. Bearing analysis and AFM analysis show that there are signs of wear and plastic deformation on the disks. It is suggested that flying height could be as low as and, sometimes, lower than laser bump height.

• 한국레이저가공학회지
• /
• 제4권3호
• /
• pp.40-44
• /
• 2001

Microbump formation during CO$_2$ laser texturing of glass substrates is examined in this paper. Experimental results show that different bump shapes (dome-shaped, with a central dimple, and with a peripheral rim) are generated depending on the laser fluence. A theoretical model for the process is suggested based on thermoelastic behavior but limited only to the dome-shaped bump. The dimensions (maximum height and base area) of the bump shows a logarithmic dependence on laser fluence as expected from the theory. Numerical computation reveals that the effect of thermal diffusion is not negligible for relatively long laser pulses.

• 한국소음진동공학회:학술대회논문집
• /
• 한국소음진동공학회 2006년도 추계학술대회논문집
• /
• pp.140-143
• /
• 2006

Load/Unload(L/UL) technology includes the benefits, that is, increased areal density, reduced power consumption and improved shock resistance. The main issues of L/UL are no slider-disk contact and no media damage. To make sure L/UL stability, we consider many design parameters in L/UL systems. This paper is focused on disk design parameters through designing a disk bump in outer guard band(OGB). In the case of bump design on the disk, we create a bump by changing bump design parameters as like size and amplitude. From dynamic analysis, we choose optimal bump model with the highest flying height and the longest rising time. When a slider passes over a bump in dynamic system, the slider rise above bump according to bump shape. On the basis of this rising effect on the bump, we apply bump design to classical L/UL system having slider-disk contact possibility. This study is based on the simulation, we finally realize improved slider unloading performance by applying slider dynamic result on unload simulation.

• 마이크로전자및패키징학회지
• /
• 제16권3호
• /
• pp.67-73
• /
• 2009

Cu pillar 범프를 사용한 플립칩 접속부는 솔더범프 접속부에 비해 칩과 기판사이의 거리를 감소시키지 않으면서 미세피치 접속이 가능하기 때문에, 특히 기생 캐패시턴스를 억제하기 위해 칩과 기판사이의 큰 거리가 요구되는 RF 패키지에서 유용한 칩 접속공정이다. 본 논문에서는 칩에는 Cu pillar 범프, 기판에는 Sn 범프를 전기도금하고 이들을 플립칩 본딩하여 Cu pillar 범프 접속부를 형성 한 후, Sn 전기도금 범프의 높이에 따른 Cu pillar 범프 접속부의 접속저항과 칩 전단하중을 측정하였다. 전기도금한 Sn 범프의 높이를 5 ${\mu}m$에서 30 ${\mu}m$로 증가시킴에 따라 Cu pillar 범프 접속부의 접속저항이 31.7 $m{\Omega}$에서 13.8 $m{\Omega}$로 향상되었으며, 칩 전단하중이 3.8N에서 6.8N으로 증가하였다. 반면에 접속부의 종횡비는 1.3에서 0.9로 저하하였으며, 접속부의 종횡비, 접속저항 및 칩 전단하중의 변화거동으로부터 Sn 전기도금 범프의 최적 높이는 20 ${\mu}m$로 판단되었다.

• KSTLE International Journal
• /
• 제3권2호
• /
• pp.114-118
• /
• 2002

In this work, head-disk interactions are studied when flying height becomes lower than laser bump height on the landing zone of a disk. With the reduction of the spinning speed in a spin stand, the flying height is decreased under the height of laser bumps. Conventional and padded pico sliders sweep between landing Bone and data zone and, then, the dynamic behavior of the pico sliders and head-disk impacts are investigated using AE and stiction/friction signals. After 200n cycle-sweep tests, bearing analysis and AFM analysis indicate that there are some signs of wear and plastic deformation in the landing zone of a disk, although AE and stiction/friction signals are not significantly changed during the sweep tests. The experimental results of this paper suggest that in CSS tests at component level, more rigorous examination methods of wear and plastic deformation might be necessary as flying height becomes getting lower.

• 소성∙가공
• /
• 제24권6호
• /
• pp.387-394
• /
• 2015

Air springs are designed to support loads using the volume elasticity in a cylindrical shaped air bag made of a composite material with a rubber matrix and two plies of reinforced fibers. Recently, applications of these springs have been expanded from railway vehicles to passenger cars. The current study presents a finite element analysis of a manufactured air spring for a passenger car. The analysis was conducted including the mounting steps of the air bag using a static loading condition. A method for controlling the internal pressure and displacements during the mounting step was developed. The characteristic load curve and the shape of the air bag were in good agreement with the experimental data with respect to the design height, the bump height and the rebound height. Results indicate that ply angles of fibers vary from 38 degrees to 56 degrees during static loading.