• Journal of the Korean Society for Precision Engineering
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• v.22 no.6 s.171
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• pp.144-151
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• 2005

Spin coater is regarded as a major module rotating at high speed to be used build up polymer resin thin film layer fur bonding process of GaAs wafer. This module is consisted of spin unit for spreading uniformly, align device, resin spreading nozzle and et. al. Specially, spin unit which is a component of module can cause to vibrate and finally affect to the uniformity of polymer resin film layer. For the stability prediction of rotation velocity and uniformity of polymer resin film layer, it is very important to understand the dynamic characteristics of assembled spin coater module and the dynamic response mode resulted from rotation behavior of spin chuck. In this paper, stress concentration mode and the deformed shape of spin chuck generated due to angular acceleration process are presented using analytical method for evaluation of structural safety according to the revolution speed variation of spin unit. And also, deformation form of GaAs wafer due to dynamic behavior of spin chuck is presented fur the comparison of former simulated results.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.3
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• pp.53-58
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• 2008

In this study, we fabricated embedded IC (Double Pole Double throw switch chip) polymer substrate and evaluate it for 2.4 GHz WiFi application. The switch chips were laminated using FR4 and ABF(Ajinomoto build up film) as dielectric layer. The embedded DPDT chip substrate were interconnected by laser via and Cu pattern plating process. DSC(Differenntial Scanning Calorimetry) analysis and SEM image was employed to calculate the amount of curing and examine surface roughness for optimization of chip embedding process. ABF showed maximum peel strength with Cu layer when the procuring was $80\sim90%$ completed and DPDT chip was laminated in a polymer substrate without void. An embedded chip substrate and wire-bonded chip on substrate were designed and fabricated. The characteristics of two modules were measured by s-parameters (S11; return loss and S21; insertion loss). Insertion loss is less than 0.55 dB in two presented embedded chip board and wire-bonded chip board. Return loss of an embedded chip board is better than 25 dB up to 6 GHz frequency range, whereas return loss of wire-bonding chip board is worse than 20 dB above 2.4 GHz frequency.

• Journal of the Korean Society of Food Science and Nutrition
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• v.28 no.2
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• pp.429-437
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• 1999

A mathematical model was established for estimating changes in pressure and volume of permeable kimchi packages. The model comprises the CO2 gas production from kimchi and permeation of O2, CO2 and N2 through the permeable film or sheet. Using the developed model, the effects of various packaging variables on the pressure and volume changes were analyzed for rigid and flexible packag es of kimchi(3% salt content) at 15oC, and then effect of storage temperature was also looked into. In case of rigid pack of 400g, using the plastic sheet of high CO2 permeability and initial vacuumizing can help to relieve the problem of pressure build up. The lower fill weight can further reduce the pressure, but will result in higher packaging cost. For the flexible package of 3 kg, highly permeable films such as low density polyethylene(LDPE) and polypropylene can reduce the volume expansion. Higher ratio of CO2 permeability to O2 and N2 permeabilities are effective in reducing the volume expansion. Increased surface area cannot contribute to reduction of volume expansion for highly permeable flexible packages of kimchi. For the impermeable packages, pressure and volume at over ripening stage (acidity 1.0%) increase with decreased temperature, while those at optimum ripening stage(acidity 0.6%) change little with temperature. Pressure of permeable rigid LDPE package increases with tem perature at any ripening stage, and temperature affects the volume of flexible LDPE package very slightly. Experimental verification of the present results and package design with economical consid eration are needed as a next step for practical application.

• Journal of the Korean Ceramic Society
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• v.48 no.6
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• pp.499-503
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• 2011

Recently, variety of organic and inorganic hybrid materials have recently investigated as alternative routes to SiOC, $SiO_2$ thin film formation at low temperatures for applications in electronic ceramics. Specially, silicon based polymers, such as polycarbosilane, polysilane and polysilazane derivatives have been studied for use in electronic ceramics and have been applied as dielectric or insulating materials. In this study, Polycarbosilane(PCS), which Si-$CH_2$-Si bonds build up the backbone of the polymer, has been investigated as low-k materials using a solution process. After heat treatment at 350$^{\circ}C$ under $N_2$ atmosphere, chemical composition and dielectric constant of the thin film were $SiO_{0.27}C_{1.94}$ and 1.2, respectively. Mechanical property measured using nanoindentor shows 1.37 GPa.

• Transactions of the Korean Society of Mechanical Engineers
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• v.17 no.8
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• pp.1921-1930
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• 1993

In order to evaluate the inlet pressure correctly, the full Navier-Stokes equations are solved numerically for the computational domain which covers the cavity region between pads as well as the bearing film. A nonuiform grid system is adopted to reduce the number of grid points, and the numerical solutions are obtained for a wide range of Reynolds number in laminar regime with various values of the distance between pads. The numerical results show that the inlet pressure is significantly affected by Reynolds number and the distance between pads. An expression for the loss coefficient in terms of Reynolds number and non-dimensional distance between pads is obtained on the basis of the numerical results. It is found that the inlet pressure over the whole range of numerical solutions can be fairly accurately estimated by applying the formula for the loss coefficient to the extended Bernoulli equation.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.1652-1655
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• 2008

A new high contrast LCD structure for TN mode TFT-LCD, of which the contrast ratio is 1.2 times hi gher than that of the conventional one, has been developed. The contrast ratio of TFT-LCD display can be improved by some modified materials, which like as polarizer, liquid crystal, color filter and light enhancement film. In order to know which condition can get the major contribution for the upgrade of the contrast ratio, we used Taguchi method and analyzed the contribution ratio for each composition and succeed to build up the formula of contrast ratio. From this study, we could achieve the highest CR value as 1200:1 of TN mod e TFT-LCD nowadays.

• Macromolecular Research
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• v.10 no.4
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• pp.194-203
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• 2002

In resin infusion process(RIP), the fiber and the resin are in contact with each other for an impregnation step and often results in flow-induced defects such as poor fiber wetting and void formation. Resin flow characteristics in transverse direction and process modeling for woven fabric were studied, and the process modeling was applied to the manufacturing of hybrid composite materials. This study also considered the compressibility of woven fabrics in a series of compression force, and it was fitted well to an elastic model equation. Void formation was varied with the processing conditions in the stage of manufacturing composites using RIP. It was concluded from this study that proper combination of pressure build-up and dynamic heating condition makes important factor for flow-induced composite processing.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.7
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• pp.4405-4410
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• 2015

Two-dimensional displacements are obtained from the sandwiched patterns, which superpose two linearly-periodic patterns orthogonally, respectively. The transparent top pattern is identified by deflection of the laser beam due to a difference of refractivity and the opaque bottom pattern is identified by deviation of the beam intensity due to a difference of reflectance. In the sample setup, the top pattern made up of build-up film is manufactured by UV laser machining and the bottom pattern is manufactured by ultra-precision trench machining and deposition for aluminum plate. The proposed decoding method is verified experimentally using the $10{\mu}m$ equally spaced sample patterns and the devised optical system. The Korea Academia-Industrial cooperation Society.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.165-165
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• 2009

현재 반도체나 이동통신 분야는 사용자의 요구에 따라 PCB의 회로선폭이 갈수록 좁아지고 있다. 이러한 정밀 부품을 제조하기 위한 제조공정에서 각광받기 시작한 기술 중 하나가 대기압 플라즈마 기술이다. 본 연구에서는 미세패턴 형성이 가능한 에폭시 본딩 필름위에 무전해 도금공정을 통한 패턴 도금법을 이용하여 패턴을 형성하였고, 형성된 패턴에 대기압 플라즈마 처리 횟수에 따른 접촉각(Contact Angle)과 Peel Strength의 변화를 분석하였다. 또한 에폭시 본딩 필름을 이용한 Build-up공정을 거쳐 Micro Via를 형성하여 대기압 플라즈마 처리 횟수에 따른 Via 표면을 분석하였다. 대기압 플라즈마 기술은 진공식에 비해 소규모 장비를 이용한 전처리가 가능하고, 초기 설비비용을 절감하는데 탁월한 효과가 있어 널리 사용하는 기술 중 하나이다. 이 연구를 통하여 대기압 플라즈마 처리 횟수에 따른 표면에너지의 변화로 인한 접촉각이 좋아지는 것을 알 수 있으며, 대기압 플라즈마 처리를 한 패턴표면이 친수성으로 변하면서 현상된 드라이 필름 사이로 도금액이 원활히 공급되어서 미세패턴 모양이 우수하게 구현되었음을 알 수 있었다. 또한 Via Filling에도 뛰어난 효과가 있었음을 확인할 수 있었다.

• Trans-
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• v.3
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• pp.87-107
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• 2017

In this paper, we tried to find out what is the cinematographic reality conceived by André Bazin. To this end, we examined the process of his long exploration of realism, focusing on his film criticism. Through this, we read his deep concern that the film medium, which is more imitative than any other medium, would not become artistic but rather stimulating mimicry. When photographs or movies first appear, people have been interested in saving money by simply storing scenes in front of them or imitating stimulating scenes before realizing their artistic value. In this way, Bazin warned us that when the cheap pleasure derived from the simple imitation of fact is concatenated with the logic of capitalism, the film falls into a subordinate medium and drops the value of human beings indescribably. He therefore argues that cinema must transcend simple imitative dimensions by exploiting various abstract expressions in its own language. His works about the realism in cinema is meaningful in that the value of true realism of the movie is important to build up humanism today in respect that the movie raises extensively the logic of capitalism through visual pleasure.