• Title/Summary/Keyword: Breakdown voltage

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Fabrication and Analysis of Multilayer Ceramic Capacitors for Medium and High Voltage (중, 고압용 적층 세라믹 캐패시터 제작 및 분석)

  • Yoon, Jung-Rag;Kim, Min-Ki;Lee, Heun-Young;Lee, Serk-Won
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.18 no.8
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    • pp.685-689
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    • 2005
  • In the fabrication and design of MLCCs (Multilayer Ceramic Capacitors) with Ni inner electrode for medium and high voltage, reliability and dielectric breakdown mode have been investigated. For thickness of green sheet, the relationship between the rated voltage versus the thickness of green sheet. Increasing the thickness of green sheet increases the dielectric breakdown voltage. However, a practical limit to this linear relationship occurs at 30 urn and above. As the thickness of green sheet increased, dielectric breakdown voltage and weibull coefficient is increased, but abruptly decrease at 30 urn and 36 urn. When 24 urn of green sheet thickness, weibull coefficient and dielectric breakdown voltage were 13.58 and 70 V/um respectively. The results enabling the MLCCs to demonstrate high levels of reliability at medium and high voltage.

Prediction of Life-Time on the Macroscopic Interface between Solid Materials with Analysis of V-t Characteristics (V-t 특성 분석에 의한 고체 거시계면의 수명 평가)

  • 오재한;이경섭;배덕권;김충혁;이준웅
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.13 no.7
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    • pp.607-611
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    • 2000
  • The characteristics on the interface between Epoxy and EPDM which are materials of the underground insulation systems of power delivery have studied. The breakdown strength of specimens are observed by applying high AC voltage at the room temperature. The breakdown times under the constant voltage below the breakdown voltage were gained. As constant voltage is applied the breakdown time is proportion to the breakdown strength. The life exponent n is gained by inverse power law and the long breakdown life time can be evaluated. AC breakdown strength and life time is improved by oiling to the interface. When the low viscosity oil is spread interface has the highest life time.

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Study on Electrical Characteristics According Process Parameters of Field Plate for Optimizing SiC Shottky Barrier Diode

  • Hong, Young Sung;Kang, Ey Goo
    • Transactions on Electrical and Electronic Materials
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    • v.18 no.4
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    • pp.199-202
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    • 2017
  • Silicon carbide (SiC) is being spotlighted as a next-generation power semiconductor material owing to the characteristic limitations of the existing silicon materials. SiC has a wider band gap, higher breakdown voltage, higher thermal conductivity, and higher saturation electron mobility than those of Si. When using this material to implement Schottky barrier diode (SBD) devices, SBD-state operation loss and switching loss can be greatly reduced as compared to that of traditional Si. However, actual SiC SBDs exhibit a lower dielectric breakdown voltage than the theoretical breakdown voltage that causes the electric field concentration, a phenomenon that occurs on the edge of the contact surface as in conventional power semiconductor devices. Therefore in order to obtain a high breakdown voltage, it is necessary to distribute the electric field concentration using the edge termination structure. In this paper, we designed an edge termination structure using a field plate structure through oxide etch angle control, and optimized the structure to obtain a high breakdown voltage. We designed the edge termination structure for a 650 V breakdown voltage using Sentaurus Workbench provided by IDEC. We conducted field plate experiments. under the following conditions: $15^{\circ}$, $30^{\circ}$, $45^{\circ}$, $60^{\circ}$, and $75^{\circ}$. The experimental results indicated that the oxide etch angle was $45^{\circ}$ when the breakdown voltage characteristics of the SiC SBD were optimized and a breakdown voltage of 681 V was obtained.

Junction termination technology for 4H-SiC devices (Junction termination 기법에 따른 4H-SiC 소자의 항복전압 특성 분석)

  • Kim, H.Y.;Bahng, W.;Song, G.H.;Kim, N.K.;Kim, E.D.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.07a
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    • pp.286-289
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    • 2003
  • In the case of high voltage devices, junction termination plays an important role in determining the breakdown voltage of the device. The mesa junction termination has been demonstrated to yield nearly ideal breakdown voltage for 6H-SiC p-n junctions. However, such an approach may not be attractive because of the nonplanar surface, which is difficult to passivate. Moreover, In case of 4H-SiC, ideal breakdown voltage could not be achieved using mesa junction termination. For 4H-SiC planar junction termination technique is more useful one rather than mesa junction termination. In this paper, breakdown characteristics of the 4H-SiC device with planar junction termination, such as FLR(Field Limiting Ring), FP(Field Plate) and JTE(Junction Termination Extension), is presented. In the case of the FLR, breakdown voltage of 1800V is obtained. And breakdown voltage of 1000V and 1150V is also obtained for the case of FP and JTE case, respectively.

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The Calculation Method of the Breakdown Voltage for the Drain Region with the Spherical Structure in High Voltage Analog CMOS (Spherical 구조를 갖는 고전압용 Analog CMOS의 Drain 역방향 항복전압의 계산 방법)

  • Lee, Un Gu
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.62 no.9
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    • pp.1255-1259
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    • 2013
  • A calculation method of the breakdown voltage for the Drain region with the spherical structure in high voltage analog CMOS is proposed. The Drain depletion region is divided into many sub-regions and the doping concentration of each sub-region is assumed to be constant. The field in each sub-region is calculated by the integration of the net charge and the breakdown voltage is calculated using the ionization integral method. The breakdown voltage calculated using the proposed method shows the maximum relative error of 3.3% compared with the result of the 2-dimensional device simulation using BANDIS.

Breakdown Characteristics of Liquid Nitrogen Induced by Quench (Quench에 의해 유도되는 액체 $N_2$의 절연파괴 특성)

  • Kim, Yeong-Seok;Jeong, Jong-Man;Gwak, Min-Hwan;Jeong, Sun-Yong;Kim, Sang-Hyeon
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.48 no.1
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    • pp.23-28
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    • 1999
  • Electrical breakdown characteristics of liquid nitrogen($LN_2$) used as both coolant and insulator for high $T_c$ superconductor system are very important. This paper presents dynamic breakdown characteristics fo $LN_2$ by quench phenomena of thermal bubble under high electric field. Experimental results revealed dynamic breakdown voltage fell down drastically compared with the static breakdown voltage without the quench. Because of increasing heat power, bubble size becomes big and breakdown voltage decreases. The breakdown voltage mechanism of $LN_2$ depends on thermal bubble effect. In the Electrode arrangement, electrical breakdown voltage of horizontal arrangement appears lower than that of vertical arrangement. Also, we observed the behavior of thermal bubbles in $LN_2$ which were generated after quench using camera.

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A Study Comparison and Analysis of Electrical Characteristics of IGBTs with Variety Gate Structures (다양한 게이트 구조에 따른 IGBT 소자의 전기적 특성 비교 분석 연구)

  • Kang, Ey Goo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.29 no.11
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    • pp.681-684
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    • 2016
  • This research was carried out experiments of variety IGBTs for industrial inverter and electric vehicle. The devices for this paper were planar gate IGBT, trench gate IGBT and dual gate IGBT and we designed using same design and process parameters. As a result of experiments, the electrical characteristics of planar gate IGBT were 1,459 V of breakdown voltage, 4.04 V of threshold voltage and 4.7 V of on-state voltage drop. And the electrical characteristics of trench gate IGBT were 1,473 V of breakdown voltage, 4.11 V of threshold voltage and 3.17 V of on-state voltage drop. Lastly, the electrical characteristics of dual gate IGBT were 1,467 V of breakdown voltage, 4.14 V of threshold voltage and 3.08V of on-state voltage drop. We almost knew that the trench gate IGBT was superior to dual gate IGBT in terms of breakdown voltage. On the other hand, the dual gate IGBT was better than the trench gate IGBT in terms of on state voltage drop.

Breakdown Properties in Physiological Saline by High Voltage Pulse Generator

  • Byeon, Yong-Seong;Song, Ki-Baek;Uhm, Han-Sup;Shin, Hee-M.;Choi, Eun-Ha
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.08a
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    • pp.333-333
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    • 2011
  • We have investigated the breakdown properties in liquids by high voltage pulse system. High voltage pulse power system is consisted of the Marx-generator with two capacitors (0.5 ${\mu}F$, withstanding voltage is 40 kV), to which the charging voltage can be applied to maximum 30 kV DC, spark gap switch and charging resistor of 20 $M{\Omega}$. We have made use of tungsten pin electrodes of anode-cathode (A-K), which are immersed into the liquids. The breakdown voltage and current signals are measured by high voltage probe (Tektronix P6015A) and current monitor (IPC CM-1.S). Especially the high speed breakdown or plasma propagation characteristics in the pulsed A-K gap have been investigated by using the high speed ICCD camera. We have measured the electron temperature through the Boltzmann plot method from the breakdown spectrums. Here the A-K gap has been changed by 1 mm, 2 mm, and 3 mm. The used liquids are distilled water and solution of salt (0.9 %). The output voltage and current signals at breakdown in distilled water are shown to be bigger than those in saline solution. The breakdown voltage and current characteristics in liquids will be discussed in accordance with A-K gap distances. It is also found that the electron temperatures and plasma densities in liquids are decreased in conformity with A-K gap.

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The Algorithm for Calculating the Base-Collector Breakdown Voltage of NPN BJT for Integrated Circuits (직접회로용 NPN BJT의 베이스-컬렉터간 역방향 항복전압 추출 알고리즘)

  • 이은구;김철성
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.52 no.2
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    • pp.67-73
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    • 2003
  • The algorithm (or calculating the base-collector breakdown voltage of NPN BJT(Bipolar Junction Transistor) for integrated circuits is Proposed. The method for calculating the electric field using the solution of Poisson's equation is presented and the method for calculating the breakdown voltage using the integration of ionization coefficients is presented. The base-collector breakdown voltage of NPN BJT using 20V process obtained from the proposed method shows an averaged relative error of 8.0% compared with the measured data and the base-collector breakdown voltage of NPN BJT using 30V process shows an averaged relative error of 4.3% compared with the measured data

Design and fabrication for high breakdown voltage on 1000V bipolar junction transistor (1000V 급 바이폴라 접합 트랜지스터에 대한 고내압화의 설계 및 제작)

  • 허창수;추은상;박종문;김상철
    • The Transactions of the Korean Institute of Electrical Engineers
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    • v.44 no.4
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    • pp.490-495
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    • 1995
  • A bipolar junction transistor which exihibits 1000V breakdown voltage is designed and fabricated using FLR (Field Limiting Rings). Three dimensional effects on the breakdown voltage is investigated in the cylindrical coordinate and the simulation results are compared with the results in the rectangular coordinate. Breakdown voltage of the device with 3 FLR is simulated to be 1420V in the cylindrical coordinate while it is 1580V in rectangular coordinate. Bipolar junction transistor has been fabricated using the epitaxial wafer of which resistivity is 86 .OMEGA.cm and thickness is 105 .mu.m. Si$_{3}$N$_{4}$ and glass are employed for the passivation. Breakdown of the fabricated device is measured to be 1442V which shows better greement with the simulation results in cylindrical coordination.

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