• Title/Summary/Keyword: Bonding test

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Study of Metal(Au) Bump for Transverse Ultrasonic Bonding (금속(Au)범프의 횡초음파 접합 조건 연구)

  • Ji, Myeong-Gu;Song, Chun-Sam;Kim, Joo-Hyun;Kim, Jong-Hyeong
    • Journal of Welding and Joining
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    • v.29 no.1
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    • pp.52-58
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    • 2011
  • In this paper, the direct bonding process between FPCB and HPCB was studied. By using an ultrasonic horn which is mounted on the ultrasonic bonding machine, it is alternatively possible to bond the gold pads attached on the FPCB and HPCB at room temperature without an adhesive like ACA or NCA. The process condition for obtaining more bonding strength than 0.6 Kgf, which is commercially required, was carried out as 40 kHz of frequency, 0.6 MPa of bonding pressure and 2 second of bonding time. The peel off test was performed for evaluating bonding strength which results in more than 0.8 Kgf.

EFFECTS OF THE DIFFERENT CERAMIC BRACKET BASES ON SHEAR BOND STRENGTH (도재브라켓 접착면의 처리방식이 전단결합강도에 미치는 영향)

  • Kim, Jin-Oh;Lee, Ki-Soo
    • The korean journal of orthodontics
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    • v.24 no.4 s.47
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    • pp.957-967
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    • 1994
  • The purpose of this study was to evaluate the effects of different bases of ceramic brackets on shear bond strength and to observe failure patterns of bracket bondings. Lower bicuspid brackets whose bases designed for the macromechanical and silane treated chemical bonding those for silane treated chemical bonding, those for micromechanical bonding, and those for macromechanical bonding were tested as experimental groups, and foil mesh-backed metal brackets as a control group. All the brackets were bonded with $Mono-Lok\;2^{(TM)}$ on the labial surface of extracted human lower bicuspids after etching the enamel with $38\%$ phosphoric acid solution for 60 seconds. The shear bond strengths were measured on the universal test machine after 24 hours passed in the $37^{\circ}C$ water bath. The gathered data were evaluated and tested by ANOVA and Duncan's multiple range test, and those results were as follows. The shear bond strengths of brackets for macromechanical and chemical bonding, those for chemical bonding, and those for micromechanical bonding were not different (p>0.05), but showed statistically higher than those of metal bracket and those of ceramic bracket for micromechanical bonding(p<0.05). The shear bond strengths of ceramic bracket for micromechanical bonding showed statistically lower than those of metal bracket(p<0.05). The enamel fractures and/or ceramic bracket fractures were observed in the cases of higher bond strength than that of metal bracket. These results supported that silane treated base of ceramic bracket show higher shear bond strength than that of metal bracket, and suggested that micromechanical form of ceramic bracket bases show higher shear bond strength than that of macromechanical form.

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Effect of Post-Annealing Conditions on Interfacial Adhesion Energy of Cu-Cu Bonding for 3-D IC Integration (3차원 소자 집적을 위한 Cu-Cu 접합의 계면접착에너지에 미치는 후속 열처리의 영향)

  • Jang, Eun-Jung;Pfeiffer, Sarah;Kim, Bi-Oh;Mtthias, Thorsten;Hyun, Seung-Min;Lee, Hak-Joo;Park, Young-Bae
    • Korean Journal of Materials Research
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    • v.18 no.4
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    • pp.204-210
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    • 2008
  • $1.5\;{\mu}m$-thick copper films deposited on silicon wafers were successfully bonded at $415^{\circ}C$/25 kN for 40 minutes in a thermo-compression bonding method that did not involve a pre-cleaning or pre-annealing process. The original copper bonding interface disappeared and showed a homogeneous microstructure with few voids at the original bonding interface. Quantitative interfacial adhesion energies were greater than $10.4\;J/m^2$ as measured via a four-point bending test. Post-bonding annealing at a temperature that was less than $300^{\circ}C$ had only a slight effect on the bonding energy, whereas an oxygen environment significantly deteriorated the bonding energy over $400^{\circ}C$. This was most likely due to the fast growth of brittle interfacial oxides. Therefore, the annealing environment and temperature conditions greatly affect the interfacial bonding energy and reliability in Cu-Cu bonded wafer stacks.

Variations of micro-structures and mechanical properties of Ti/SUS321L joint using brazing method (브레이징을 이용한 Ti/SUS321L 접합체의 기계적 특성과 미세조직의 변화)

  • 구자명;정우주;한범석;정승부
    • Proceedings of the KWS Conference
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    • 2002.05a
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    • pp.285-287
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    • 2002
  • This study is investigated in variations of micro-structures and mechanical properties of Ti/SUS321L joint with bonding temperature and time using brazing method. According to increasing bonding temperature and time, it was observed the thickness of their reaction layer increased. In tensile test, it was examined that the tensile strength had maximum value at the bonding time of 5min and decreased after bonding time over 5min because of increasing their oxides and intermetallic compounds.

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A study on bonding characteristics of SoQ bonding according to surface treatment process conditions (표면처리 공정 조건에 따른 SoQ 접합의 접합 특성에 관한 연구)

  • Kim, Jong-Wan;Song, Eun-Seok;Kim, Yong-Kweon;Baek, Chang-Wook
    • Proceedings of the KIEE Conference
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    • 2009.07a
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    • pp.1501_1502
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    • 2009
  • Plasma treatment time was optimized to maximize the bonding strength between silicon and quartz. Bonding strength between the silicon and quartz is related to a surface energy which can be calculated by contact angle measurement. It was found that optimized time to get maximized surface energy was 15 sec. Silicon and quartz wafers were treated with $O_2$ plasma under different time splits and then bonded together. Bonding strength of the bonded wafers was measured by shear test. It was verified that the highest bonding strength was obtained when the silicon and quartz wafers were treated for 15 seconds. The maximum bonding strength exceeded the fracture strength of silicon.

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Effects of Bonding Conditions on Joint Property between FPCB and RPCB using Thermo-Compression Bonding Method (열압착법을 이용한 경.연성 인쇄회로기판 접합부의 접합 강도에 미치는 접합 조건의 영향)

  • Lee, Jong-Gun;Ko, Min-Kwan;Lee, Jong-Bum;Noh, Bo-In;Yoon, Jeong-Won;Jung, Seung-Boo
    • Journal of the Microelectronics and Packaging Society
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    • v.18 no.2
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    • pp.63-67
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    • 2011
  • We investigated effects of bonding conditions on the peel strength of rigid printed circuit board (RPCB)/ flexible printed circuit board (FPCB) joints bonded using a thermo-compression bond method, The electrodes on the FPCB were coated with Sn by a dipping process. We confirmed that the bonding temperature and bonding time strongly affected the bonding configuration and strength of the joints. Also, the peel strength is affected by dipping conditions; the optimum dipping condition was found to be temperature of $270^{\circ}C$ and time of 1s. The bonding strength linearly increased with increasing bonding temperature and time until $280^{\circ}C$ and 10s. The fracture energy calculated from the F-x (Forcedisplacement) curve during a peel test was the highest at bonding temperature of $280^{\circ}C$.

Effect of Shear Key and U strip on Flexural Behavior of Reinforced Concrete Beams Strengthened by CFS(Carbon Fiber Sheet) (탄소섬유쉬트로 보강된 철근콘크리트 보의 휨거동에 전단키와 U 스터립이 미치는 영향)

  • Choi, Hong-Shik;Lee, Chin-Yong;Yi, Seong-Tae;Lee, Si-Woo;Heo, Gweon
    • Proceedings of the Korea Concrete Institute Conference
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    • 2004.05a
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    • pp.88-91
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    • 2004
  • It is generally known that the bonding strength of RC(Reinforced Concrete) flexural members strengthened by fiber sheet composites are sufficient and the bonding failure does not occur until the sheet failed. However, many researchers have been reported that, before the failure of the sheet, the bonding failure happens even though the bonding length is sufficient. This study was carried out to evaluate the effectiveness of shear key and U strip on flexural behavior of reinforced concrete beam structures. The ply number of CFS(Carbon Fiber Sheet), location of shear key, and existence or not of U strip were selected as the main test variables. Test results show that the behavior of a beam of which shear key is located in the nearby. of support and U strip is not existent, and having CFS of 1 ply is mostly improved.

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Mechanical Properties and Fracture Behavior of Cylindrical Shell Type for Unidirectional CFRP Composite Material under Tension Load (원통형 셀 구조를 갖는 한방향 CFRP 적층 복합재료의 정적인장파괴거동)

  • 오환섭
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 1998.10a
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    • pp.273-278
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    • 1998
  • In this paper, basic micro-mechanical properties of unidirectional CFRP composite shell such as bonding strength, fiber volume fraction and void fraction are measured and tensile strength test is performed with a fixture. And then fracture surfaces are observed by SEM. In case of basic micro-mechanical properties, bonding strength is reduce with decreasing of radius of each ply in a shell for the effect of residual stress, fiber volume fraction is smaller than plate, and void fraction is vise versa. For these reason, tensile strength of shell is smaller than plate fabricated with same prepreg. For failure mode shell has many splitted part along its length, and it is assumed that this phenomenon is caused by the difference of bonding strength for residual stress.

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The Study on Compressive Behavior of Connection Member between Steel Pipe Pile and Concrete Footing (강관말뚝 기초 두부 연결부의 압축거동에 관한 연구)

  • Youn, IL-Ro;Hong, Ki-Nam
    • Journal of the Korean Society of Industry Convergence
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    • v.9 no.3
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    • pp.183-190
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    • 2006
  • Generally, application of steel pile as deep foundation member needs specials requirement for the connection method between steel pipe and concrete footing. To investigate real compressive behavior of connection member between steel pipe pile and concrete footing, three specimens were tested with carefully designed experimental system. Main test variable is the connection method between steel pipe pile and concrete footing. The bolted bonding method and hook bonding method was considered as the connection method in this study. From the test results gained from experiment, it was conformed that two types of connection method have the almost same compressive resistance capacity. Therefore, we can conclude that these two connection methods can be used as the strengthening method to verify the compressive composite action of concrete and steel pipe pile.

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