• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2009년도 추계학술대회 논문집
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• pp.721-722
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• 2009

• 한국정밀공학회지
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• 제27권7호
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• pp.21-27
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• 2010

The effect of COG bonding parameters, especially the bonding temperature, on the bonding quality and reliability was investigated in this paper. We measured the bubble area formed in the ACF resin during the bonding process and tried to investigate the relationship between bubble area and bonding peel strength. 85/85 test which exposes a sample to a 85% humidity and $85^{\circ}C$ temperature condition was also carried out. The bubble area was dramatically increased under ~$10^{\circ}C$ lower than recommended bonding temperature. The bubble area formed at the edge of IC chip was larger than the other parts of IC chip. But the peel strength was not associated with the bubble area. High temperature and humid condition made the bubble area larger, but we could not find clear trend of change in the peel strength.

• 한국전기전자재료학회논문지
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• 제16권8호
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• pp.700-704
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• 2003

This paper describes on characteristics of 2" 3C-SiC wafer bonding using PECVD (plasma enhanced chemical vapor deposition) oxide and HF (hydrofluoride acid) for SiCOI (SiC-on-Insulator) structures and MEMS (micro-electro-mechanical system) applications. In this work, insulator layers were formed on a heteroepitaxial 3C-SiC film grown on a Si (001) wafer by thermal wet oxidation and PECVD process, successively. The pre-bonding of two polished PECVD oxide layers made the surface activation in HF and bonded under applied pressure. The bonding characteristics were evaluated by the effect of HF concentration used in the surface treatment on the roughness of the oxide and pre-bonding strength. Hydrophilic character of the oxidized 3C-SiC film surface was investigated by ATR-FTIR (attenuated total reflection Fourier transformed infrared spectroscopy). The root-mean-square suface roughness of the oxidized SiC layers was measured by AFM (atomic force microscope). The strength of the bond was measured by tensile strength meter. The bonded interface was also analyzed by IR camera and SEM (scanning electron microscope), and there are no bubbles or cavities in the bonding interface. The bonding strength initially increases with increasing HF concentration and reaches the maximum value at 2.0 ％ and then decreases. These results indicate that the 3C-SiC wafer direct bonding technique will offers significant advantages in the harsh MEMS applications.ions.

• 대한소아치과학회지
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• 제31권1호
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• pp.26-33
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• 2004

Bonding Agent는 1세대에서 5세대에 거치기까지 많은 발전을 하였고, 최근에는 임상술식과정의 단축에 있어 비약적인 발전을 보였다. 최근에 개발되어 소개된 self-etching priming/bonding agent는 6세대 bonding agent로 분류되며, 이를 이용하여 법랑질 및 상아질에 대한복합 레진의 충전시 발생하는 미세누출을 methylene blue를 이용하여 관찰한 결과, 상아질에서는 기존의 4세대 5세대 접착제와 유의 한 차이가 없었으나, 법랑질에서는 6세대 bonding agent가 통계학적으로 높은 미세누출 양상을 보였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.874-877
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• 2001

SOI(Silicon-On-Insulator) technology is proposed as an alternative to bulk silicon for MEMS(Micro Electro Mechanical System) manufacturing. In this paper, we fabricated the SOI wafer with uniform active layer thickness by silicon direct bonding and mechanical polishing processes. Specially-designed electrostatic bonding system is introduced which is available for vacuum packaging and silicon-glass wafer bonding for SOG(Silicon On Glass) wafer. We demonstrated thermopile sensor and RF resonator using the SOI wafer, which has the merits of simple process and uniform membrane fabrication.

• 한국염색가공학회지
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• 제20권4호
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• pp.21-30
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• 2008

To understand the complex hydrogen bonding structure, several phenolic derivatives and benzoxazine model compounds are synthesized and characterized by Fourier transform infrared spectroscopy (FT-IR). The estimation of molar extinction coefficients for various types of hydrogen bonding species is systematically carried out by the curve-resolving of FT-IR spectra. The distribution of hydrogen bonding species in benzoxazine model dimers is quantitatively analyzed. It is revealed that benzoxazine dimers and BA-a polybenzoxazine are mainly composed of intramolecular interaction rather than intermolecular interaction.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2007년도 제38회 하계학술대회
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• pp.736-737
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• 2007

The single point bonding in underground transmission system can induce high voltage on the sheath when ground fault, lightning serge and switching serge occurs, at that time underground cable systems cannot offer a return path of fault current. Accordingly if fault current, which cannot return to ground, flows at the single point bonding, high voltage can be induced in SVL and that voltage can cause aging and breakdown of SVL. Therefore this paper study on the effect of parallel ground conductor at the single point bonding when ground fault and lightning serge occurs by using ATPDraw.

• 동력기계공학회지
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• 제10권4호
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• pp.65-70
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• 2006

This study is to experimentally evaluate the cooling performance of the Bonding type and Injection type of heat sink using three different kinds of industrial Peltier module by digital LabViewTM measurement. Injection type of heat sink could be more efficient for the heat transfer than Bonding type, even with 30% more radiating surface area. In addition, the experimental results revealed that the sufficient power supplied was able to show the better cooling performance of Peltier module. In order to verify the optimal cooling performance of the cooling device, two Peltier module, HMN 6040 and HMN 1550 with Bonding and Injection type of heat sink were used. The cooling performance with injection type of heat sink was 2.11% and 6.24% better than that with bonding type of heat sink under the HMN 6040 and HMN 1550, respectively.

• 한국음향학회:학술대회논문집
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• 한국음향학회 1994년도 FIFTH WESTERN PACIFIC REGIONAL ACOUSTICS CONFERENCE SEOUL KOREA
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• pp.824-829
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• 1994

High-frequency and complex vibration ultrasonic wire bonding systems are propsed and their welding characteristic are studied. Ultrasonic wire bonding is used widely for joining thin connecting wire of various electronic devices including IC or LSI. Conventional bonding systems use vibration frequency of 40 or 60 kHz and linear vibration welding tips. Complex vibration welding tip which vibrates in elliptical to circular or rectangular to square in the same or different frequency is effective to join welding specimens in shorter welding time and under smaller vibration amplitude, and furthermore high-frequency systems such as 90, 120, 190 kHz are also significantly effective. High-frequency and complex vibration welding system of 90, 120 and 190 kHz are designed. Welding characteristics of these systems are found very superior than a conventional system. Welding specimens of aluminum wire of 0.1mm diameter are successfully.

• 대한수학회지
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• 제61권3호
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• pp.565-602
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• 2024

We study the collective behaviors of two second-order nonlinear consensus models with a bonding force, namely the Kuramoto model and the Cucker-Smale model with inter-particle bonding force. The proposed models contain feedback control terms which induce collision avoidance and emergent consensus dynamics in a suitable framework. Through the cooperative interplays between feedback controls, initial state configuration tends to an ordered configuration asymptotically under suitable frameworks which are formulated in terms of system parameters and initial configurations. For a two-particle system on the real line, we show that the relative state tends to the preassigned value asymptotically, and we also provide several numerical examples to analyze the possible nonlinear dynamics of the proposed models, and compare them with analytical results.