• 한국정밀공학회지
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• 제27권7호
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• pp.7-12
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• 2010

In this paper, chip-on-glass(COG) interconnection with anisotropic conductive film(ACF) using lateral thermosonic bonding technology is considered. In general, thermo-compression bonding which is used in practice for flip-chip bonding suffers from the low productivity due to the long bonding time. It will be shown that the bonding time can be improved by using lateral thermosonic bonding in which lateral ultrasonic vibration together with thermo-compression is utilized. By measuring the internal temperature of ACF, the fast curing of ACF thanks to lateral ultrasonic vibration will be verified. Moreover, to prove the reliability of the lateral thermosonic bonding, observation of pressured mark by conductive particles, shear test, and water absorption test will be conducted.

• 마이크로전자및패키징학회지
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• 제19권2호
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• pp.29-33
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• 2012

The demand for 3D wafer level integration has been increasing significantly. Although many technical challenges of wafer stacking are still remaining, wafer stacking is a key technology for 3D integration due to a high volume manufacturing, smaller package size, low cost, and no need for known good die. Among several new process techniques Cu-to-Cu wafer bonding is the key process to be optimized for the high density and high performance IC manufacturing. In this study two main challenges for Cu-to-Cu wafer bonding were evaluated: misalignment and bond quality of bonded wafers. It is demonstrated that the misalignment in a bonded wafer was mainly due to a physical movement of spacer removal step and the bond quality was significantly dependent on Cu bump dishing and oxide erosion by Cu CMP.

• 한국공작기계학회논문집
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• 제18권1호
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• pp.116-121
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• 2009

Thermosonic flip chip bonding is an important technology for the electronic packaging due to its simplicity, cost effectiveness and clean and dry process. Mechanical properties of the horn and the shank, such as the natural frequency and the amplitude, have a great effect on the bonding capability of the transverse flip chip bonding system. In this research, two kinds of study are performed. The first is the new design of the clamp and the second is the effect of tolerance parameters to the performance of the system. The clamp with a bent shape is newly designed to hold the nodal point of the flip chip. The second is the effect of the design parameters on the vibration amplitude and planarity at the end of the shank. The variation of the tolerance parameters changes the amplitude and the frequency of the vibration of the shank. They, in turn, have an effect on the quantity of the plastic deformation of the gold ball bump, which determined the quality of the flip chip bonding. The tolerance parameters that give the great effect on the amplitude of the shank are determined using Taguchi's method. Error of set-up angle, the length and diameter of horn and error of the length of the shank are determined to be the parameters that have peat effect on the amplitude of the system.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 추계학술대회 논문집
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• pp.427-431
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• 2005

In this study, 6' GaAs wafer bonding system is designed and optimized to bond 6 inches device wafer and material wafer. Bonding process is performed in vacuum environment and resin is used to bond two wafers. Vacuum module and double heating mechanisms are adopted to minimize wafer warpage and void. Structure and heat transfer analysis, et al of the core modules review the designed mechanisms are very effective in performance improvement. As a result, high productivity (tack time cut-down) and stabilized process can be obtained by reducing breakage failure of wafer.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 추계학술대회 논문집 Vol.15
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• pp.387-390
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• 2002

SiC direct bonding technology is very attractive for both SiCOI(SiC-on-insulator) electric devices and SiC-MEMS(micro electro mechanical system) fields because of its application possibility in harsh environments. This paper presents pre-bonding techniques with variation of HF pre-treatment conditions for 2 inch SiC wafer direct bonding using PECVD(plasma enhanced chemical vapor deposition) oxide. The PECVD oxide was characterized by XPS(X-ray photoelectron spectrometer) and AFM(atomic force microscopy). The characteristics of the bonded sample were measured under different bonding conditions of HF concentration and an applied pressure. The bonding strength was evaluated by the tensile strength method. The bonded interface was analyzed by using IR camera and SEM(scanning electron microscope). Components existed in the interlayer were analyzed by using FT-IR(fourier transform infrared spectroscopy). The bonding strength was varied with HF pre-treatment conditions before the pre-bonding in the range of $5.3 kgf/cm^2$ to $15.5 kgf/cm^2$

• Restorative Dentistry and Endodontics
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• 제21권2호
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• pp.569-584
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• 1996

The purpose of this study was to elucidate the effect of benzalkonium chloride on tensile bond strength of BPDM/HEMA dentin bonding. One hundred sixty dentin specimens from freshly extracted bovine mandibular incisors were used, and 0, 0.02, 0.1 or 0.5% benzalkonium chloride solution was applied to the dentin specimen with/after phosphoric acid. 32% phosphoric acid was used when the specimens were bonded with One-Step$^{TM}$, a BPDM/HEMA system and 10% was used when bonded with All-Bond$^{(R)}$ 2, a NTG-GMA/BPDM system. Aelitefil$^{TM}$ composite resin was bonded to the pretreated dentin specimen with the use of All-Bond$^{(R)}$ 2 or One-Step$^{TM}$ dentin bonding agent. After the bonded specimens were stored in $37^{\circ}C$ distilled water for 24 hours, tensile bond strength was measured. The fractured dentin specimens were examined under the scanning electron microscope. The results were as follows : Benzalkonium chloride application after acid-treatment resulted in decrease of dentin bond strength of One-Step$^{TM}$, a BPDM/HEMA system (p>0.05). Benzalkonium chloride application did not exert any influence on dentin bond strength of All-Bond$^{(R)}$ 2, a NTG-GMA/BPDM system (p>0.05). There was no relationship between the concentration or application method of benzalkonium chloride and the dentin bond strength of One-Step$^{TM}$ or All-Bon$^{(R)}$ 2 (p<0.05). On SEM examination of the fractured dentin-resin interface, while mixed failure was prominent in dentin bonding with One-Step$^{TM}$, adhesive and mixed failures were seen together in dentin bonding with All-Bond$^{(R)}$ 2 regardless of the concentration and application method of benzalkonium chloride.

• 대한소아치과학회지
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• 제49권3호
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• pp.264-273
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• 2022

치과에서 사용하는 재료들의 물성의 발달로 인하여 브라켓과 치아 사이의 결합 능력도 크게 향상되었다. 그러나 소아치과 영역에서와 같이 환자의 협조를 기대하기 어렵거나, 수분 격리가 제대로 이루어지지 않을 경우 기대하는 효과에 미치지 못하는 결합강도를 보여 줄 수 있다. 본 연구의 목적은 세 가지의 접착 술식을 비교하여 브라켓의 전단 접착 강도를 평가하고, 임상적으로 유의한 차이가 존재하는지 비교하는 것이다. 우식증이나 수복물이 없는 상, 하악 소구치 60개 치아를 대상으로 하였다. Group I은 대조군으로서 기존의 3 step 접착 방식에 따라 브라켓을 부착하였고, Group II는 self-etching primer system을 이용하여 부착하였다. Group III는 self-priming adhesive를 이용하여 브라켓을 부착하였다. 각 group의 전단 결합 강도를 측정하고 접착제 잔류지수(ARI)를 기록하였다. 각 group I, II, III의 평균 전단 결합 강도는 14.69 MPa, 11.21 MPa 그리고 12.21 MPa로 측정되었다. Group I과 II, group I과 III에서만 유의한 차이가 존재하였으며(p < 0.05), ARI 값은 모든 group에서 유의한 차이가 존재하지 않았다.

• 한국실내디자인학회논문집
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• 제22권5호
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• pp.367-375
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• 2013

Using the 'New material' concept has recently been introduced into the natural characteristics. In the course of such a, Janine M. Benyus has proposed to mimic the characteristics of natural ecosystems to mention the concept of Biomimicry. Process made engineered using technical elements for representing the material properties of Biomimicry such will be acting importantly, This study intends to analyze how new materials applied to 'Biomimicry' characteristics are processed in space. The results were as follows : 1) Processing methods of new materials resulted as 'Forming', 'Surface treatment', 'Bonding', 'Inserting'. These four were divided and analyzed into 'Form', 'System', 'Adaptation'. As a result of this analysis, such significances were shown as 'Forming/Surface treatment/Bonding' in 'Form', 'Bonding' in 'System' and 'Adaptation'. 2) 'Bonding' applied to 'System' of new material can be recycled to be combined with other materials through the existing adhesive material, and present as a solution of 'Sustainable development'. 3) 'Bonding' applied to 'Adaptation' of new material is to impart the ability to react to the environment through the joint, but is characteristic, at this time, using digital and other field technology. It appeared primarily that it can be known to meet the social trends and convergence between fields. Thus, as the finish that are friendly to the environment from the interior design, the results of the study are expected to be utilized in the study of new materials guidelines.

• 한국연소학회지
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• 제22권3호
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• pp.47-52
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• 2017

The propellant tile and crack which account for the greatest proportion of solid rockets are profoundly affected by viscosity and mechanical properties of solid propellant. In this paper HTPB/AP/Al system propellant has been researched for the viscosity, mechanical properties and burning properties with type and contents of bonding agents. The viscosity of propellant was changed significantly depending on the type and contents of bonding agents, and mechanical properties of HTPB/AP/Al system propellant were also varied. Considering both lower viscosity and stable mechanical properties, the optimum type and contents of bonding agents can be identified as the main factors to the HTPB/AP/Al system propellant.

• Restorative Dentistry and Endodontics
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• 제20권2호
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• pp.699-720
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• 1995

본 연구는 양이온 계면활성효과를 가져 소독제로 사용되고 있는 benzalkonium chloride 수용액을 상아질 표면에 대한 습윤용 처리제로 적용시킬 경우 상아질접착제의 접착성능에 미치는 영향을 관찰하기 위해 시행되었다. 소의 하악전치 80개를 8개군으로 분류하여 순면의 상아질을 노출시켜서 산처리한 후 물로 습윤 상태를 유지시킨 대조군과 0.1%, 0.5% 및 1% 농도의 benzalkonium chloride 수용액으로 습윤시킨 실험군으로 나누어 NTG-GMA/BPDM계 상아질접착제인 All-bond 2와 DSDM 계 상아질접착제인 Aelitebond를 각각 접착시킨 후 접착시험을 시행하였다. 상아질 표면을 10% 인산수용액으로 처리한 후 습윤과정을 거친 시편을 각 접착시스템의 primer와 bonding resin을 도포하고 Aelitefil 복합레진으로 접 착시 킨후 항온조에서 24시간 방치한 뒤 인장접착강도를 측정하고, 상아질표면 및 파단면의 양상을 주사전자 현미경으로 관찰하였으며 FT-IR을 사용하여 전처리 전후의 상아질 표면을 분석하여 다음의 결과를 얻었다. 1. NTG-GMA/BPDM 계 상아질접착제 (All-bond 2)로 접착시킨 경우 물로 습윤시킨 대조군에 비해 0.1 % benzalkonium chloride 수용액으로 습윤시킨 군에서 유의하게 높은 인장접착강도를 보였으나(p<0.05), 0.5% 및 1.0 % benzalkonium chloride 수용액으로 습윤시킨 군에서는 유의한 차이가 나타나지 않았다. 2. DSDM계 상아질접착제 (Aelitebond) 로 접착시킨 경우 물로 습윤시킨 대조군과 0.1 %, 0.5% 및 1.0 % benzalkonium chloride 수용액으로 습융시킨 군 간의 인장접착강도의 유의한 차이는 없었다(p>0.05). 3. Benzalkonium chloride 수용액의 적용과 관계 없이 전체적으로 NTG-GMA/ BPDM계 상아질접착제로 접착시킨 경우가 DSDM계 상아질접착제로 접착시킨 경우보다 인장접착강도가 높았으며, 파단양상의 관찰결과에서도 NTG-GMA /BPDM계 상아질접착제를 사용한 경우는 응집성 및 혼합성 파단양상이, DSDM 계 상아질접착제를 사용한 경우는 부착성 파단양상이 우세하였다. 4. 주사전자 현미경적 관찰상에서 benzalkonium chloride 수용액 적용 유무에 따른 각 상아질 표면의 primer 도포양상의 뚜렷한 차이는 관찰되지 않았으나, 상아질 표면에 대한 benzalkonium chloride 수용액 적용 전후의 FT-IR 분석결과 에서는 0.1 % benzalkonium chloride 수용액으로 습윤 처리 시킨 군이 대조군에 비해 NTG-GMA/ BPDM 및 DSDM primer의 도포효과를 다소 향상시킨 소견이었다.