• 제목/요약/키워드: Bonding length

검색결과 268건 처리시간 0.021초

종이의 특성에 영향하는 펄프 섬유특성의 정량적 해석(I) (Quantitative Analysis of Pulp Fiber Characteristics that Affect Paper Properties(I))

  • 이강진;박중문
    • 펄프종이기술
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    • 제30권2호
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    • pp.47-54
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    • 1998
  • Refining is one of the most important processes of fiber treatment that provides optical and physical properties of final paper products. The evaluation method of refining progress is usually freeness (CSF) or wetness (SR) test because of its rapidity and convenience. However, there are some deficiencies in using freeness or wetness test to evaluate pulp fibers accurately because its results are more influenced by fines contents than extent of fibers treatment. The objective of this study is to show the deficiency of wetness in evaluating the refining process. For this, beating is done by varying the beating load. Handsheets are made after beating until 25 and $32^{\circ}C$ SR, and then paper properties are measured. Refined fibers are analyzed by fiber length, fines contents, curl, kink, WRV, and zero-span tensile strength. The results show that longer beating time is required to reach the same wetness at lower beating load. There are differences in the average fiber length, distribution curve of fiber length, fines contents, curl, kink, WRV of long fiber fraction, drainage time, and zero-span tensile strength of rewetted sample at different beating load. At the low beating load in the same wetness, apparent density, breaking length, burst strength, and tear strength are higher, while opacity and air permeability are lower than those of the high beating load. Using Page s equation, which shows the relationship among tensile strength, intrinsic fiber strength, and interfiber bonding strength, interfiber bonding strength is calculated and analyzed to explain final paper properties. At $25^{\circ}C$ SR, interfiber bonding strength is only slightly higher at 2.5kgf beating load, while the intrinsic fiber strength is substantially higher. At $32^{\circ}C$ SR, intrinsic fiber strength is a little bit higher at 2.5kgf beating load, and interfiber bonding strength is remarkably higher than those of 5.6kgf beating load. These results can be used to explain the different properties of the final paper at selected beating loads.

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횡 방향 플립 칩 초음파 접합 시 혼의 공차변수가 시스템의 진동에 미치는 영향 (Effect of the Tolerance Parameters of the Horn on the Vibration of the Thermosonic Transverse Bonding Flip Chip System)

  • 정하규;권원태;윤병옥
    • 한국공작기계학회논문집
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    • 제18권1호
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    • pp.116-121
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    • 2009
  • Thermosonic flip chip bonding is an important technology for the electronic packaging due to its simplicity, cost effectiveness and clean and dry process. Mechanical properties of the horn and the shank, such as the natural frequency and the amplitude, have a great effect on the bonding capability of the transverse flip chip bonding system. In this research, two kinds of study are performed. The first is the new design of the clamp and the second is the effect of tolerance parameters to the performance of the system. The clamp with a bent shape is newly designed to hold the nodal point of the flip chip. The second is the effect of the design parameters on the vibration amplitude and planarity at the end of the shank. The variation of the tolerance parameters changes the amplitude and the frequency of the vibration of the shank. They, in turn, have an effect on the quantity of the plastic deformation of the gold ball bump, which determined the quality of the flip chip bonding. The tolerance parameters that give the great effect on the amplitude of the shank are determined using Taguchi's method. Error of set-up angle, the length and diameter of horn and error of the length of the shank are determined to be the parameters that have peat effect on the amplitude of the system.

Inhomogeneous bonding state modeling for vibration analysis of explosive clad pipe

  • Cao, Jianbin;Zhang, Zhousuo;Guo, Yanfei;Gong, Teng
    • Steel and Composite Structures
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    • 제31권3호
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    • pp.233-242
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    • 2019
  • Early detection of damage bonding state such as insufficient bonding strength and interface partial contact defect for the explosive clad pipe is crucial in order to avoid sudden failure and even catastrophic accidents. A generalized and efficient model of the explosive clad pipe can reveal the relationship between bonding state and vibration characteristics, and provide foundations and priory knowledge for bonding state detection by signal processing technique. In this paper, the slender explosive clad pipe is regarded as two parallel elastic beams continuously joined by an elastic layer, and the elastic layer is capable to describe the non-uniform bonding state. By taking the characteristic beam modal functions as the admissible functions, the Rayleigh-Ritz method is employed to derive the dynamic model which enables one to consider inhomogeneous system and any boundary conditions. Then, the proposed model is validated by both numerical results and experiment. Parametric studies are carried out to investigate the effects of bonding strength and the length of partial contact defect on the natural frequency and forced response of the explosive clad pipe. A potential method for identifying the bonding quality of the explosive clad pipe is also discussed in this paper.

탄소나노튜브 길이 변화에 대한 확산방지층과 박막 증착 온도의 영향 (The Effect of Diffusion Barrier and thin Film Deposition Temperature on Change of Carbon Nanotubes Length)

  • 홍순규;이형우
    • 한국분말재료학회지
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    • 제24권3호
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    • pp.248-253
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    • 2017
  • In this study, we investigate the effect of the diffusion barrier and substrate temperature on the length of carbon nanotubes. For synthesizing vertically aligned carbon nanotubes, thermal chemical vapor deposition is used and a substrate with a catalytic layer and a buffer layer is prepared using an e-beam evaporator. The length of the carbon nanotubes synthesized on the catalytic layer/diffusion barrier on the silicon substrate is longer than that without a diffusion barrier because the diffusion barrier prevents generation of silicon carbide from the diffusion of carbon atoms into the silicon substrate. The deposition temperature of the catalyst and alumina are varied from room temperature to $150^{\circ}C$, $200^{\circ}C$, and $250^{\circ}C$. On increasing the substrate temperature on depositing the buffer layer on the silicon substrate, shorter carbon nanotubes are obtained owing to the increased bonding force between the buffer layer and silicon substrate. The reason why different lengths of carbon nanotubes are obtained is that the higher bonding force between the buffer layer and the substrate layer prevents uniformity of catalytic islands for synthesizing carbon nanotubes.

Experimental and numerical study of the behavior of fiber reinforced concrete beams with nano-graphene oxide and strengthening CFRP sheets

  • Mohammad Reza Halvaeyfar;Ehsanollah Zeighami;S. Mohammad Mirhosseini;Ali Hassani Joshaghani
    • Structural Engineering and Mechanics
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    • 제87권4호
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    • pp.375-389
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    • 2023
  • In many fiber concrete beams with Carbon Fiber Reinforced Polymer (CFRP), debonding occurs between the carbon sheets and the concrete due to the low strength of the bonding resin. A total of 42 fiber concrete beams with a cross-section of 10×10 cm with a span length of 50 cm are fabricated and retrofitted with CFRP and subjected to a 4-point bending test. Graphene Oxide (GO) at 1, 2, and 3 wt% of the resin is used to improve the mechanical properties of the bonding resins, and the effect of length, width, and the number of layers of CFRP and resin material are investigated. The crack pattern, failure mode, and stress-strain curve are analyzed and compared in each case. The results showed that adding GO to polyamine resin could improve the bonding between the resin and the fiber concrete beam. Furthermore, the optimum amount of nanomaterials is equal to 2% by the weight of the resin. Using 2% nanomaterials showed that by increasing the length, width, and number of layers, the bearing and stiffness of fiber concrete beams increased significantly.

반도체 패키징용 Gold Bonding Wire의 변형특성 및 해석 (Deformation Properties of Gold Bonding Wire for VLSI Packaging Applications)

  • 김경섭;홍순형
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2001년도 춘계학술대회 논문집
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    • pp.250-253
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    • 2001
  • Mechanical properties of gold bonding wire for VLSI packaging have been studied. The diameters of gold wires are about 20-30 micrometer and fracture loads are 8-20 gram force. The elastic modulus, yield strength, fracture strength and elongation properties have been evaluated by micro-tensile test method. This work discusses for an appropriate selection of micro-force testing system and grip design in mim testing. The best method to determine gauge length of wire and to measure tensile properties has been proposed. The mechanical properties such as strength and elastic modulus of current gold bonding wire are higher than pure those of gold wire.

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접착 보강부재 단부에서의 응력분포에 관한 연구 (Studies on Stress Distribution at the end of the Bonded Strengtening Plate)

  • 김지선;김경원;한만엽;정영수;홍영균
    • 한국콘크리트학회:학술대회논문집
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    • 한국콘크리트학회 1996년도 봄 학술발표회 논문집
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    • pp.129-134
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    • 1996
  • Bonding strength of reinforcing material has been recognized to be the most important factor which determines the strengthening effect and the durability of repair work. The properties of bonding layers affects the stress distribution at the end of the plate, therefore the behavior of bonding layer has to be investigated. In this study, the stress distribution at the end of the bonded plate has been tested and compared with Roberts' analysis. Shear stress and vertical normal stress at the end of strengtening plate are analysized and the effedts of bonding layer thickness, plate thickness and plate length on the bonding behavior are tested. The test results showed that thickness is one of the most important factor, which is the thinner the thickness, the smaller the maximum stress.

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탄소 복합재와 알루미늄 이종재료 단일겹침 접착 체결부의 강도에 관한 실험 연구 (An Experimental Study on the Strength of Single-Lap Bonded Joints of Carbon Composite and Aluminum)

  • 강태환;이창재;최진호;권진회
    • 한국항공우주학회지
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    • 제35권3호
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    • pp.204-211
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    • 2007
  • 연구에서는 5가지의 접착길이를 갖는 탄소 복합재-알루미늄 단일겹침 체결부에 대한 실험을 통해 단일겹침 접착 체결부의 파손양상 및 강도를 연구하였다. 시편은 필름 형태의 접착제인 FM73m을 사용하여 이차접착으로 제작하였다. 실험 결과, 이종재료 접착 체결부의 강도는 금속-금속 체결부의 강도보다는 낮고, 복합재-복합재 체결부의 강도보다는 높게 나타났다. 접착길이 대 폭의 비가 1보다 작은 경우, 접착길이의 증가가 강도 저하에 미치는 영향이 컸지만, 접착길이 대 폭의 비가 커질수록 접착길이의 효과는 줄어드는 것으로 나타났다. 모든 시편은 최종적으로 층간분리의 형태로 파손되었다. 따라서 고강도 접착제를 사용한 체결부의 강도향상을 위해서는 적층판의 층간분리 파손을 지연시킬 수 있는 설계가 중요할 것으로 판단된다.

탄소 복합재-알루미늄 단일겹침 접착 체결부의 강도에 관한 인자연구 (A Parametric Study on the Strength of Single-Lap Bonded Joints of Carbon Composite and Aluminum)

  • 김태환;성명수;최진호;권진회
    • Composites Research
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    • 제20권5호
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    • pp.34-42
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    • 2007
  • 본 논문에서는 탄소 복합재와 알루미늄으로 구성된 이종재료 단일겹침 접착 체결부에서, 파손하중에 영향을 미치는 주요인자들의 효과를 실험적으로 연구하였다. 실험을 위해 접착압력 4가지(2, 3, 4, 6기압), 겹침길이 6가지(15, 20, 25, 30, 35, 40 mm), 모재 두께 2가지(1.58, 3.01 mm)에 대한 시편 총 66개를 제작하였다. 실험 결과 접착제 FM73에 대해 제작사에서 제시한 접착압력은 약 3기압이었지만 본 연구에서 사용한 이종재료 접착의 경우, 최소 4기압 이상의 접착압력이 필요함을 확인하였다. 겹침길이를 증가시킬 경우 파손하중이 증가하지만 접착부의 폭과 길이의 비가 1을 넘어갈 경우 접착강도 즉 단위 접착면적당의 파손하중의 증가는 크지 않았다. 모재의 두께도 접착부 파손하중 및 강도에 큰 영향을 미쳤으며 모재의 두께가 약 2배로 증가할 때 접착강도는 $12{\sim}32%$까지 증가하였다. 접착부의 파손은 대부분 복합재 모재의 층간분리 형태로 발생하였으며, 접착압력이 높아질수록, 접착길이가 길어질수록 층간분리가 발생하는 위치가 적층판 내부로 깊게 확대되는 경향이 있다.

A Strong Dependence of the P-P Bond Length on the Transition Metal Component in ThCr2Si2-Type Phosphides CaM2P2 (M = Fe, Ni): The Influence of d Band Position and σp* Mixing

  • Kang, Dae-Bok
    • Bulletin of the Korean Chemical Society
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    • 제24권8호
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    • pp.1215-1218
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    • 2003
  • An analysis of the bonding situation in CaM₂P₂ (M=Fe, Ni) with ThCr₂Si₂ structure is made in terms of DOS and COOP plots. The main contributions to covalent bonding are due to M-P and P-P interactions in both compounds. Particularly, the interlayer P-P bonding by variation in the transition metal is examined in more detail. It turns out that the shorter P-P bonds in CaNi₂P₂ form as a result of the decreasing electron delocalization into ${{\sigma}_p}^*$ of P₂ due to the weaker bonding interaction between the metal d and ${{\sigma}_p}^*$ as the metal d band is falling from Fe to Ni.