• Proceedings of the Materials Research Society of Korea Conference
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• 2007.11a
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• pp.156.2-156.2
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• 2007

• Proceedings of the Korean Ceranic Society Conference
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• 2004.04b
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• pp.33.2-33.2
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• 2004

• Journal of the Microelectronics and Packaging Society
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• v.28 no.4
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• pp.109-114
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• 2021

We investigated the effects of atmospheric hydrogen plasma treatment on Cu-Cu direct bonding. Hydrogen plasma was effective in reducing the surface oxide layer of Cu thin film, which was confirmed by GIXRD analysis. It was observed that larger plasma input power and longer treatment time were effective in terms of reduction and surface roughness. The interfacial adhesion energy was measured by DCB test and it was observed to decrease as the bonding temperature decreased, resulting in bonding failure at bonding temperature of 200℃. In case of wet treatment, strong Cu-Cu bonding was observed above bonding temperature of 250℃.

• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.6
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• pp.305-310
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• 2013

In this paper, the pressure sensor usable in a high temperature, using a SDB(silicon-direct-bonding) wafer of Si/$SiO_2$/Si-sub structure was provided and studied the characteristic thereof. The pressure sensor produces a piezoresistor by using a single crystal silicon as a first layer of SDB wafer, to thus provide a prominent sensitivity, and dielectrically isolates the piezoresistor from a silicon substrate by using a silicon dioxide layer as a second layer thereof, to be thus usable even under the high temperature over $120^{\circ}C$ as a limited temperature of a general silicon sensor. The measured result for a pressure sensitivity of the pressure sensor has a characteristic of high sensitivity, and its tested result for an output of the sensor further has a very prominent linearity and hysteresis characteristic.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.12
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• pp.185-194
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• 2000

Rapid Prototyping(RP) techniques have their unique characteristics according to the working principles: stair-stepped surface of parts due to layer-by-layer stacking, low build speed caused by line-by-line solidification to build one layer, and additional post processing to improve surface roughness, so it is required very high cost to introduce and to maintain of RP apparatus. The objective of this study is to develop a new RP process, Variable Lamination Manufacturing using linear hotwire cutting technique and expandable polystyrene foam sheet as part material(VLM-S), and to investigate characteristics of part material, cutting characteristics by using linear hotwire cutting system and bonding. Experiments were carried out to investigate mechanical properties of part material such as anisotropy and directional tensile strength. In order to obtain optimal dimensional accuracy, surface roughness, and reduced cutting time, addition experiments were performed to find the relationship between cutting speed and cutting offset of hotwire, and heat generation of hotwire per unit length. So, adhesion strength tests according to ASTM test procedure showed that delamination did not occur at bonded area. Based on the data, a clover-shape was fabricated using unit shape part(USP) it is generated hotwire cutting. The results of present study have been reflected on the enhancement of the VLM-S process and apparatus.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.7
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• pp.576-582
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• 2002

Nonvolatile semiconductor memory devices with reoxidized nitrided oxide(RONO) gate dielectrics were fabricated, and nitrogen distribution and bonding species which contribute to memory characteristics were analyzed. Also, memory characteristics of devices depending on the anneal temperatures were investigated. The devices were fabricated by retrograde twin well CMOS processes with $0.35\mu m$ design rule. The processes could be simple by in-situ process in growing dielectric. The nitrogen distribution and bonding states of gate dielectrics were investigated by Dynamic Secondary Ion Mass Spectrometry(D-SIMS), Time-of-Flight Secondary Ion Mass Spectrometry(ToF-SIMS), and X-ray Photoelectron Spectroscopy(XPS). As the nitridation temperature increased, nitrogen concentration increased linearly, and more time was required to form the same reoxidized layer thickness. ToF-SIMS results showed that SiON species were detected at the initial oxide interface which had formed after NO annealing and $Si_2NO$ species within the reoxidized layer formed after reoxidation. As the anneal temperatures increased, the device showed worse retention and degradation properties. It could be said that nitrogen concentration near initial interface is limited to a certain quantity, so the excess nitrogen is redistributed within reoxidized layer and contribute to electron trap generation.

• Journal of Welding and Joining
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• v.9 no.4
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• pp.17-27
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• 1991

The direct brazing technology which could be used for the simplification of brazing process and the improvement of brazed joint quality was studied with $Al_2O_3$ and stainless steels. The brazing of $Al_2O_3$ to STS304 or STS430 was performed under different brazing conditions such as brazing filler metal, temperature, heating rate and brazing time. Microstructural observation and chemical analysis be SEM/EPAM were carried out to verify the quality of brazed joints. 4-point bending strength of brazed joints was also measured to find the optimal brazing conditions. The results showed that, in brazing of $Al_2O_3$, the mixed oxide layer resulted from the reaction between Ti in filler metal and oxide layer on the material surface to be brazed was found to be bery important for the joint quality. The width of oxide layer varied with the brazing conditions such as brazing time, heating rate and chemical composition of filler metals. The strength of brazed joints was more affected by the type of materials and their thermal properties than by brazing heat cycle.

• Transactions on Electrical and Electronic Materials
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• v.3 no.1
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• pp.4-8
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• 2002

The typical mold method for FED (field emission display) fabrication is used to form a gate electrode, a gate oxide layer, and emitter tip after fabrication of a mold shape using wet-etching of Si substrate. However, in this study, new mold method using a side wall space structure was developed to make sharp emitter tips with the gate electrode. In new method, gate oxide layer and gate electrode layer were deposited on a Si wafer by LPCVD (low pressure chemical vapor deposition), and then BPSG (Boro phosphor silicate glass) thin film was deposited. After then, the BPSG thin film was flowed into the mold at high temperature in order to form a sharp mold structure. TiN was deposited as an emitter tip on it. The unfinished device was bonded to a glass substrate by anodic bonding techniques. The Si wafer was etched from backside by KOH-deionized water solution. Finally, the sharp field emitter array with gate electrode on the glass substrate was formed.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.6 s.171
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• pp.144-151
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• 2005

Spin coater is regarded as a major module rotating at high speed to be used build up polymer resin thin film layer fur bonding process of GaAs wafer. This module is consisted of spin unit for spreading uniformly, align device, resin spreading nozzle and et. al. Specially, spin unit which is a component of module can cause to vibrate and finally affect to the uniformity of polymer resin film layer. For the stability prediction of rotation velocity and uniformity of polymer resin film layer, it is very important to understand the dynamic characteristics of assembled spin coater module and the dynamic response mode resulted from rotation behavior of spin chuck. In this paper, stress concentration mode and the deformed shape of spin chuck generated due to angular acceleration process are presented using analytical method for evaluation of structural safety according to the revolution speed variation of spin unit. And also, deformation form of GaAs wafer due to dynamic behavior of spin chuck is presented fur the comparison of former simulated results.

• Textile Coloration and Finishing
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• v.34 no.3
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• pp.173-184
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• 2022

In this study, the TPU film was laminated on an aramid fabric or circular knits in order to implement an air cushion material that can respond to high impact forces in case of a fall and is easy to expand. To increase the bonding strength between the fabric layer and the film layer, a primer layer was formed in two ways: one for thermally bonding and laminating PET film and two for coating and aging hot melt type PUR adhesive. The tensile strength of the aramid air cushion was 2.5 times higher than that of the circular knits, but the tensile elongation of the aramid air cushion was very low compared to that of the circular knits. The tear strength of the aramid air cushion was about twice or more superior to that of the circular knits, the primer treatment method was good at A, and the peel strength was excellent at method A. The aramid air cushion was the lightest in weight. Summarizing the above results, it was best to combine the air cushion material with aramid woven fabric and primer treatment method A to cope with the high impact force applied when falling.