• Journal of Adhesion and Interface
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• v.3 no.1
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• pp.37-42
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• 2002

Adhesives are becoming increasingly accepted for advanced engineering/boding tasks. Therefore the understanding of the basic principles and the benefits of elastic bonding and structural bonding respectively is of utmost importance. Structural bonding means adhesive performance in load-bearing environments. Furthermore. the time to achieve handling strength has an impact on the economics of an assembly line. The paper gives briefly a summary about the fundamentals of elastic bonding and discusses different adhesive systems in the context of handling strength. Hereby the focus lies on the Warm Melt Technology, and its potential is compared to standard adhesives (l-part, 2-part and Booster Technology, a special 2-C system). Examples illustrate their economical benefits. Main Points : ${\bullet}$ The basic principles and benefits of elastic bonding ${\bullet}$ Warm-melt Technology in comparison with standard adhesives ${\bullet}$ Handling strength an economic issue ${\bullet}$ Combination with Booster-Technology, a special 2-C PUR system ${\bullet}$ Presentation of real world applications Learning Objectives: ${\bullet}$ Fundamentals of elastic bonding ${\bullet}$ Warm-melt Technology: correlation between chain length and cristallinity ${\bullet}$ Handling strength and curing speed of various systems in comparison ${\bullet}$ Real world applications illustrate the potential of the Warm-melt Technology.

• Restorative Dentistry and Endodontics
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• v.19 no.1
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• pp.180-193
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• 1994

The purpose of this study was to observe the sealing ability and durability of All-Bond 2, Gluma Bonding System, Scotch bond 2 and Superbond D-liner which are dentin bonding agents used as desensitizing agents. The durability of the sealing ability of the materials were compared after 0, 140, 420, 840 tooth brushing strokes. 120 extracted teeth were divided into 5 groups and the agents were applied to the exposed dentin. No agents was applied on group I, the control group. Each specimen went through thermocycling from $5^{\circ}$ to $55^{\circ}C$, 200 times. Each group was devide into 4 subgroups and artificial tooth brushing strokes were done for 0, 140, 420, 840 times. Finally the specimens were stored in 0.5 % methylene blue solution for 24 hours in a incubator set at $37^{\circ}C$. The tooth were sectioned perpendicular to the long axis and the dye penetration ratio to the pulp was measured. The following results were obtained. 1. All four dentin bonding agents initially showed excellent sealing ability. 2. All-bond 2, Gluma Bonding System and Superbond D-liner showed durability of dentinal tubule sealing effect after 840 strokes(6-week) artificial tooth brushing. 3. Scotchbond 2 showed a significant decrease in sealing ability after 420 strokes(3-week) artificial tooth brushing. (P<0.05).

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.04a
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• pp.35-40
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• 1997

The present study considers the analysis and control of the bonding process for a LOC DIe Bonder. A mathematical model for describing the bonding process is developed and proved by experiments. A feedback scheme is also applied for system in order to ensure the robustness of the bonding force control. The theoretical and experimental results are proved useful for the design and control of the LOC Die Bonder.

• The Journal of the Korean dental association
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• v.53 no.3
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• pp.187-194
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• 2015

This paper reflects on the state of the art of two kinds of tooth hard tissue (enamel and dentin) bonding with resin cement. After presenting composition of resin cement, concepts of enamel bonding and resin bonding are addressed. Special attention is devoted to the concept and advantage of self-etching technique. Finally, recommended clinical performance regarding bonding to tooth with resin cement is summarized.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.10
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• pp.883-888
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• 2002

SiC direct bonding technology is very attractive for both SiCOI(SiC-on-insulator) electric devices and SiC-MEMS(micro electro mechanical system) fields because of its application possibility in harsh environments. This paper presents pre-bonding techniques with variation of HF pre-treatment conditions for SiC wafer direct bonding using PECVD(plasma enhanced chemical vapor deposition) oxide. The PECYD oxide was characterized by XPS(X-ray photoelectron spectrometer) and AFM(atomic force microscopy). The characteristics of the bonded sample were measured under different bonding conditions of HF concentration and an applied pressure. The bonding strength was evaluated by the tensile strength method. The bonded interface was analyzed by using SEM(scanning electron microscope). Components existed in the interlayer were analyzed by using FT-IR(fourier transform infrared spectroscopy). The bonding strength was varied with HF pre-treatment conditions before the pre-bonding in the range of 5.3 kgf/cm$^2$to 15.5 kgf/cm$^2$.

• Steel and Composite Structures
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• v.31 no.3
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• pp.233-242
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• 2019

Early detection of damage bonding state such as insufficient bonding strength and interface partial contact defect for the explosive clad pipe is crucial in order to avoid sudden failure and even catastrophic accidents. A generalized and efficient model of the explosive clad pipe can reveal the relationship between bonding state and vibration characteristics, and provide foundations and priory knowledge for bonding state detection by signal processing technique. In this paper, the slender explosive clad pipe is regarded as two parallel elastic beams continuously joined by an elastic layer, and the elastic layer is capable to describe the non-uniform bonding state. By taking the characteristic beam modal functions as the admissible functions, the Rayleigh-Ritz method is employed to derive the dynamic model which enables one to consider inhomogeneous system and any boundary conditions. Then, the proposed model is validated by both numerical results and experiment. Parametric studies are carried out to investigate the effects of bonding strength and the length of partial contact defect on the natural frequency and forced response of the explosive clad pipe. A potential method for identifying the bonding quality of the explosive clad pipe is also discussed in this paper.

• Journal of the Semiconductor & Display Technology
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• v.21 no.1
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• pp.142-147
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• 2022

After introducing Hybrid Bonding technology into image sensors using stacked sensors and image processors, large quantity production became possible. As a result, it is currently used in most of the CMOS image market in smartphones and other image-based devices worldwide, and almost all stacked CIS manufacturing sites have focused on miniaturization using hybrid bonding. In this study, an upper wafer handling module for Wafer to Wafer Hybrid Bonding developed to increase the alignment and precision between wafers when wafer bonding. The module was divided two parts to reduce error of both the alignment and degree of precision during wafer bonding. Wafer handling module developed both new Tip/Tilt system controlling θx,θy of upper wafer and striker to push upper wafer. Based on this, it was confirmed through the stability evaluation that the upper wafer handling module can be controlled without any problem during W2W hybrid bonding.

• Journal of the Korean Society of Industry Convergence
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• v.15 no.2
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• pp.55-58
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• 2012

This study is concerned about the design and structural analysis of high integrated Chip Bonding Machine. Recently, many studies have been undergoing to reduce a working time in a field of Chip Bonding Machine. Chip Bonding Machine belongs to reduce a stand-by time by Chip Moving time. The developed system can save tool moving distance in small space than other machine. The analysis is carried out by SoldEdge & Ansys software.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.5
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• pp.365-371
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• 2003

We prepared silicon on insulator(SOI) wafer pairs of Si/1800${\AA}$ -SiO$_2$ ∥ 1800${\AA}$ -SiO$_2$/Si using water direct bonding method. Wafer pairs bonded at room-temperature were annealed by a normal furnace system or a fast linear annealing(FLA) equipment, and the micro-structure of bonding interfaces for each annealing method was investigated. Upper wafer of bonded pairs was polished to be 50 $\mu\textrm{m}$ by chemical mechanical polishing(CMP) process to confirm the real application. Defects and bonding area of bonded water pairs were observed by optical images. Electrical and mechanical properties were characterized by measuring leakage current for sweeping to 120 V, and by observing the change of wafer curvature with annealing process, respectively. FLA process was superior to normal furnace process in aspects of bonding area, I-V property, and stress generation.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.2
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• pp.227-233
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• 2014

This study investigates the vibration characteristics of a wire-bonding piezoelectric transducer and ultrasonic horn for high-speed and precise welding. A ring-type piezoelectric stack actuator is excited at 136 kHz to vibrate a conical-type horn and capillary system. The nodal lines and amplification ratio of the ultrasonic horn are obtained using a theoretical analysis and FEM simulation. The vibration modes and frequencies close to the driving frequency are identified to evaluate the bonding performance of the current wire-bonder system. The FEM and experimental results show that the current wire-bonder system uses the bending mode of 136 kHz as the principal motion for bonding and that the transverse vibration of the capillary causes the bonding failure. Because the major longitudinal mode exists at 119 kHz, it is recommended that the design of the current wire-bonding system be modified to use the major longitudinal mode at the excitation frequency and to minimize the transverse vibration of capillary in order to improve the bonding performance.