• Journal of the Korean Society for Precision Engineering
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• v.27 no.7
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• pp.7-12
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• 2010

In this paper, chip-on-glass(COG) interconnection with anisotropic conductive film(ACF) using lateral thermosonic bonding technology is considered. In general, thermo-compression bonding which is used in practice for flip-chip bonding suffers from the low productivity due to the long bonding time. It will be shown that the bonding time can be improved by using lateral thermosonic bonding in which lateral ultrasonic vibration together with thermo-compression is utilized. By measuring the internal temperature of ACF, the fast curing of ACF thanks to lateral ultrasonic vibration will be verified. Moreover, to prove the reliability of the lateral thermosonic bonding, observation of pressured mark by conductive particles, shear test, and water absorption test will be conducted.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.29-33
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• 2012

The demand for 3D wafer level integration has been increasing significantly. Although many technical challenges of wafer stacking are still remaining, wafer stacking is a key technology for 3D integration due to a high volume manufacturing, smaller package size, low cost, and no need for known good die. Among several new process techniques Cu-to-Cu wafer bonding is the key process to be optimized for the high density and high performance IC manufacturing. In this study two main challenges for Cu-to-Cu wafer bonding were evaluated: misalignment and bond quality of bonded wafers. It is demonstrated that the misalignment in a bonded wafer was mainly due to a physical movement of spacer removal step and the bond quality was significantly dependent on Cu bump dishing and oxide erosion by Cu CMP.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.18 no.1
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• pp.116-121
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• 2009

Thermosonic flip chip bonding is an important technology for the electronic packaging due to its simplicity, cost effectiveness and clean and dry process. Mechanical properties of the horn and the shank, such as the natural frequency and the amplitude, have a great effect on the bonding capability of the transverse flip chip bonding system. In this research, two kinds of study are performed. The first is the new design of the clamp and the second is the effect of tolerance parameters to the performance of the system. The clamp with a bent shape is newly designed to hold the nodal point of the flip chip. The second is the effect of the design parameters on the vibration amplitude and planarity at the end of the shank. The variation of the tolerance parameters changes the amplitude and the frequency of the vibration of the shank. They, in turn, have an effect on the quantity of the plastic deformation of the gold ball bump, which determined the quality of the flip chip bonding. The tolerance parameters that give the great effect on the amplitude of the shank are determined using Taguchi's method. Error of set-up angle, the length and diameter of horn and error of the length of the shank are determined to be the parameters that have peat effect on the amplitude of the system.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.427-431
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• 2005

In this study, 6' GaAs wafer bonding system is designed and optimized to bond 6 inches device wafer and material wafer. Bonding process is performed in vacuum environment and resin is used to bond two wafers. Vacuum module and double heating mechanisms are adopted to minimize wafer warpage and void. Structure and heat transfer analysis, et al of the core modules review the designed mechanisms are very effective in performance improvement. As a result, high productivity (tack time cut-down) and stabilized process can be obtained by reducing breakage failure of wafer.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.387-390
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• 2002

SiC direct bonding technology is very attractive for both SiCOI(SiC-on-insulator) electric devices and SiC-MEMS(micro electro mechanical system) fields because of its application possibility in harsh environments. This paper presents pre-bonding techniques with variation of HF pre-treatment conditions for 2 inch SiC wafer direct bonding using PECVD(plasma enhanced chemical vapor deposition) oxide. The PECVD oxide was characterized by XPS(X-ray photoelectron spectrometer) and AFM(atomic force microscopy). The characteristics of the bonded sample were measured under different bonding conditions of HF concentration and an applied pressure. The bonding strength was evaluated by the tensile strength method. The bonded interface was analyzed by using IR camera and SEM(scanning electron microscope). Components existed in the interlayer were analyzed by using FT-IR(fourier transform infrared spectroscopy). The bonding strength was varied with HF pre-treatment conditions before the pre-bonding in the range of $5.3 kgf/cm^2$ to $15.5 kgf/cm^2$

• Restorative Dentistry and Endodontics
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• v.21 no.2
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• pp.569-584
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• 1996

The purpose of this study was to elucidate the effect of benzalkonium chloride on tensile bond strength of BPDM/HEMA dentin bonding. One hundred sixty dentin specimens from freshly extracted bovine mandibular incisors were used, and 0, 0.02, 0.1 or 0.5% benzalkonium chloride solution was applied to the dentin specimen with/after phosphoric acid. 32% phosphoric acid was used when the specimens were bonded with One-Step$^{TM}$, a BPDM/HEMA system and 10% was used when bonded with All-Bond$^{(R)}$ 2, a NTG-GMA/BPDM system. Aelitefil$^{TM}$ composite resin was bonded to the pretreated dentin specimen with the use of All-Bond$^{(R)}$ 2 or One-Step$^{TM}$ dentin bonding agent. After the bonded specimens were stored in $37^{\circ}C$ distilled water for 24 hours, tensile bond strength was measured. The fractured dentin specimens were examined under the scanning electron microscope. The results were as follows : Benzalkonium chloride application after acid-treatment resulted in decrease of dentin bond strength of One-Step$^{TM}$, a BPDM/HEMA system (p>0.05). Benzalkonium chloride application did not exert any influence on dentin bond strength of All-Bond$^{(R)}$ 2, a NTG-GMA/BPDM system (p>0.05). There was no relationship between the concentration or application method of benzalkonium chloride and the dentin bond strength of One-Step$^{TM}$ or All-Bon$^{(R)}$ 2 (p<0.05). On SEM examination of the fractured dentin-resin interface, while mixed failure was prominent in dentin bonding with One-Step$^{TM}$, adhesive and mixed failures were seen together in dentin bonding with All-Bond$^{(R)}$ 2 regardless of the concentration and application method of benzalkonium chloride.

• Journal of the korean academy of Pediatric Dentistry
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• v.49 no.3
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• pp.264-273
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• 2022

Due to the development of properties of adhesive materials currently used in dentistry, the bonding ability between the brackets and the tooth enamel has been greatly improved. In general, in situations where cooperation can be obtained, adhesion of the orthodontic bracket through the conventional three-step process can show excellent bonding strength. However, if it is difficult to expect patient cooperation, as in the pediatric dentistry area, or if moisture isolation is not properly performed, the binding strength that does not reach the expected effect. As a result, various products that simplify the process for adhesion are being developed. The aim of this study was to evaluate and compare the shear bonding strength between the conventional 3-step adhesion system, self-etching primer system and one-step adhesion system that reduces the priming process. A total of 60 human maxillary, mandibular premolars were prepared. Group I (control group) were followed conventional 3-step bonding process. Group II were conditioned with self-etching primer. Group III were etched with 37% phosphoric acid and brackets were bonded with self-priming adhesive. The resultant shear bond strength of each group was measured and an adhesive remnant index (ARI) was recorded. The mean shear bond strength of group I, II, III were 14.69 MPa, 11.21 MPa and 12.21 MPa respectively. Significant differences could only be found between group I, II and group I, III (p < 0.05). The ARI indicated no significant difference among all groups.

• Korean Institute of Interior Design Journal
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• v.22 no.5
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• pp.367-375
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• 2013

Using the 'New material' concept has recently been introduced into the natural characteristics. In the course of such a, Janine M. Benyus has proposed to mimic the characteristics of natural ecosystems to mention the concept of Biomimicry. Process made engineered using technical elements for representing the material properties of Biomimicry such will be acting importantly, This study intends to analyze how new materials applied to 'Biomimicry' characteristics are processed in space. The results were as follows : 1) Processing methods of new materials resulted as 'Forming', 'Surface treatment', 'Bonding', 'Inserting'. These four were divided and analyzed into 'Form', 'System', 'Adaptation'. As a result of this analysis, such significances were shown as 'Forming/Surface treatment/Bonding' in 'Form', 'Bonding' in 'System' and 'Adaptation'. 2) 'Bonding' applied to 'System' of new material can be recycled to be combined with other materials through the existing adhesive material, and present as a solution of 'Sustainable development'. 3) 'Bonding' applied to 'Adaptation' of new material is to impart the ability to react to the environment through the joint, but is characteristic, at this time, using digital and other field technology. It appeared primarily that it can be known to meet the social trends and convergence between fields. Thus, as the finish that are friendly to the environment from the interior design, the results of the study are expected to be utilized in the study of new materials guidelines.

• Journal of the Korean Society of Combustion
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• v.22 no.3
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• pp.47-52
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• 2017

The propellant tile and crack which account for the greatest proportion of solid rockets are profoundly affected by viscosity and mechanical properties of solid propellant. In this paper HTPB/AP/Al system propellant has been researched for the viscosity, mechanical properties and burning properties with type and contents of bonding agents. The viscosity of propellant was changed significantly depending on the type and contents of bonding agents, and mechanical properties of HTPB/AP/Al system propellant were also varied. Considering both lower viscosity and stable mechanical properties, the optimum type and contents of bonding agents can be identified as the main factors to the HTPB/AP/Al system propellant.

• Restorative Dentistry and Endodontics
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• v.20 no.2
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• pp.699-720
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• 1995

This study was conducted to evaluate the effect of benzalkonium chloride solution as a wetting agent instead of water on dentin bonding with NTG-GMA/BPDM system (All-bond 2, Bisco.) and DSDM system (Aelitebond, Bisco.). Benzalkonium chloride solution is a chemical disinfectant widely used in medical and dental clinics for preoperative preparation of skin and mucosa due to its strong effect of cationic surface active detergent. Eighty freshly extracted bovine lower incisor were grinded labially to expose flat dentin surface, and then were acid-etched with 10 % phosphoric acid for 15 second, water-rinsed, and dried for 10 second with air syringe. The specimens were randomly divided into 8 groups of 10 teeth. The specimens of control group were remoistured with water and the specimens of experimental groups were remoistured with 0.1 %, 0.5 %, and 1.0 % benzalkonium chloride solution respectively. And then, the Aelitefil composite resin was bonded to the pretreated surface of the specimens by use of All-bond 2 dentin bonding system or Aelitebond dentin bonding system in equal number of the specimens. The bonded specimens were stored in $37^{\circ}C$ distilled water for 24 hours, then the tensile bond strength was measured, the mode of failure was observed, the fractured dentin surface were examined under scanning electron microscopy, and FT-IR spectroscopy was taken for the purpose of investigating the changes of the dentin surface pretreated with benzal konium chloride solution followed by each primer of the dentin bonding systems. The results were as follows : In the group of bonding with NTG-GMA/BPDM dentin bonding agent(All-bond 2), higher tensile bond strength was only seen in the experimental group remoistured with 0.1 % benzal konium chloride solution than that in water-remoistured control group(p<0.05). In the group of bonding with DSDM dentin bonding agent (Aelitebond), no significant differences were seen between the control and each one of the experimental group(p<0.05). Higher tensile bond strength were seen in NTG-GMAIBPDM dentin bonding agent group than in DSDM dentin bonding agent group regardless of remoistur ization with benzal konium chloride solution. On the examination of failure mode, cohesive and mixed failure were predominantly seen in the group of bonding with NTG-GMAIBPDM dentin bonding agent, while adhesive failure was predominantly seen in the group of bonding with DSDM dentin bonding agent. On SEM examination of fractured surfaces, no differences of findings of primed dentin surface between the groups with and without remoisturization with benzal konium chloride solution. FT-IR spectroscopy taken from the control and the experimental group reve::.led that some higher absorbance derived from the primers binding to dentin surface was seen at the group pretreated with 0.1 % benzal konium chloride solution than at the control group of remoisturizing with water.