• Transactions on Electrical and Electronic Materials
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• 제18권4호
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• pp.181-184
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• 2017

Multilayer ceramics in which piezoelectric layers of $0.90Pb(Zr_{0.48}Ti_{0.52})O_3-0.05Pb(Mn_{1/3}Sb_{2/3})O_3-0.05Pb(Zn_{1/3}Nb_{2/3})O_3$ (0.90PZT-0.05PMS-0.05PZN) stack alternately with silver electrode layers were prepared by an advanced low-temperature co-fired ceramic (LTCC) method. The electrical properties and bonding strength of the multilayers were associated with the interface morphologies between the piezoelectric and silver-electrode layers. Usually, the inner silver electrodes are fabricated by sintering silver paste in multi-layer stacks. To improve the interface bonding strength, piezoelectric powders of 0.90PZT-0.05PMS-0.05PZN with an average particle size of $23{\mu}m$ were added to silver paste to form a gradient interface. SEM observation indicated clear interfaces in multilayer ceramics without powder addition. With the increase of piezoelectric powder addition in the silver paste, gradient interfaces were successfully obtained. The multilayer ceramics with gradient interfaces present greater bonding strength as well as excellent piezoelectric properties for 30~40 wt% of added powder. On the other hand, over addition greatly increased the resistance of the inner silver electrodes, leading to a piezoelectric behavior like that of bulk ceramics in multilayers.

• Journal of Welding and Joining
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• 제30권3호
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• pp.26-31
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• 2012

Three-dimensional integrated circuit (3D IC) technology has become increasingly important due to the demand for high system performance and functionality. We have evaluated the effect of Buffered oxide etch (BOE) on the interfacial bonding strength of Cu-Cu pattern direct bonding. X-ray photoelectron spectroscopy (XPS) analysis of Cu surface revealed that Cu surface oxide layer was partially removed by BOE 2min. Two 8-inch Cu pattern wafers were bonded at $400^{\circ}C$ via the thermo-compression method. The interfacial adhesion energy of Cu-Cu bonding was quantitatively measured by the four-point bending method. After BOE 2min wet etching, the measured interfacial adhesion energies of pattern density for 0.06, 0.09, and 0.23 were $4.52J/m^2$, $5.06J/m^2$ and $3.42J/m^2$, respectively, which were lower than $5J/m^2$. Therefore, the effective removal of Cu surface oxide is critical to have reliable bonding quality of Cu pattern direct bonds.

• 한국전기전자재료학회논문지
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• 제32권1호
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• pp.6-12
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• 2019

Bonding properties of epoxy-containing solder joints were investigated by a high temperature aging test. Specimens were prepared by bonding an R3216 standard chip resistor to an OSP-finished PCB by a reflow process with two basic types of solder (SAC305 & Sn58Bi) pastes and two epoxy-solder (SAC305+epoxy & Sn58Bi+epoxy) pastes. In all epoxy solder joints, an epoxy fillet was formed in the hardened epoxy, lying around the outer edge of the solder joint, between the chip and the Cu pad. In order to analyze the bonding characteristics of solder joints at high temperatures, a high-temperature aging test at $150^{\circ}C$ was carried out for 14 days (336 h). After aging, the intermetallic compound $Cu_6Sn_5$ was found to have formed in the solder joint on the Cu pad, and the shear stress on the conventional solder joint was reduced by a significant amount. The reason that the shear force did not decrease much, even though in epoxy solder, was thatbecause epoxy hardened at the outer edge of the supported solder joints. Using epoxy solder, strong bonding behavior can be ensured due to this resistance to shear force, even in metallurgical changes such as those where intermetallic compounds form at solder joints.

• 열처리공학회지
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• 제34권2호
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• pp.66-74
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• 2021

Cladding material, which can selectively obtain excellent properties of different metals, is a composite material that combines two or more types of dissimilar metals into one plate. The titanium-copper cladding material between titanium which has excellent corrosion resistance and copper which has high thermal and electrical conductivity, are highly valuable composite materials. It can be used as heat exchangers with high conductivity under severe corrosion conditions. In order to apply the clad plate to the heat exchanger, it must be manufactured in the form of a tube and additional welding is required. It is important to select the cladding material manufacturing process and the welding process. The process of manufacturing the cladding material includes extrusion, rolling, and explosive bonding. Among them, the explosive bonding process is suitable for additional welding because no heat-affected zone is formed. In this study TIG welding of the explosive-bonded dissimilar clad plates was successfully performed by butt welding. The microstructures and bonding interface of the welded part were observed, and the effect of the bonding layer at the welding interface and the intermetallic compounds on the mechanical properties and tensile plastic deformation behaviors were analyzed. And also the integrity of TIG-welded dissimilar part was evaluated.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2011년도 춘계학술발표대회
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• pp.244.2-244.2
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• 2011

We introduce a novel and robust method for the preparation of nanocomposite multilayers, which allows the excellent photoluminescent (PL) properties as well as the accurate control over the composition and dimensions of multilayers. By exchanging the oleic acid stabilizers of CdSe@ZnS quantum dots (QDs) synthesized in organic solvent with 2-bromo-2-methylpropionic acid (BMPA) in the same solvent, these nanoparticles were be alternately deposited by nucleophilic substitution reaction with highly branched poly(amidoamine) dendrimer (PAMA) through layer-by-layer (LbL) assembly process. Our approach does not need to be transformed into the water-dispersible nanoparticles with electrostatic or hydrogen-bonding groups, which can deteriorate their inherent properties, for the built-up of multilayers. The nanocomposite multilayers including QDs exhibited the strong PL properties achieving densely packed surface coverage as well as long-term PL stability under atmospheric conditions in comparison with those of conventional LbL multilayers based on electrostatic interaction. Furthermore, we demonstrate that the flexible multilayer films with optical properties can be easily prepared using nucleophilic substitution reaction between bromo and amino groups in organic media. This robust and tailored method opens a new route for the design of functional film devices based on nanocomposite multilayers.

• 한국재료학회지
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• 제16권1호
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• pp.30-36
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• 2006

A novel method was proposed to grow an epitaxial $CoSi_2$ on (100)Si substrate. A $CoN_x$ interlayer was deposited by reactive sputtering of Co in an Ar+$N_2$ flow. From the Ti/Co/$CoN_x$/Si structure, a uniform and thin $CoSi_2$ layer was epitaxially grown on (100)Si by annealing above $700^{\circ}C$. Two amorphous layers were found at the $CoN_x$/Si interface, where the top layer has a silicon nitride (Si-N) bonding state with some Co content and the bottom layer has a Co-Si intermixing state. The SiNx amorphous layer seems to play a critical role of suppressing the diffusion of Co into Si substrate for the direct formation of epitaxial $CoSi_2$.

• 한국주조공학회지
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• 제17권4호
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• pp.371-378
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• 1997

The study for direct synthesis of TaC carbide which was a reaction product of tantalum and carbon in the cast iron was performed. Cast iron which has hypo-eutectic composition was cast bonded in the metal mold with tantalum thin sheet of thickness of $100{\mu}m$. The contents of carbon and silicon of cast iron matrix was controlled to have constant carbon equivalent of 3.6. The chracteristics of microstructure and the formation mechanism of TaC carbide in the interfacial reaction layer in the cast iron/tantalum thin sheet heat treated isothermally at $950^{\circ}C$ for various time were examined. TaC carbide reaction layer was grown to the dendritic morphology in the cast iron/tantalum thin sheet interface by the isothermal heat treatment. The composition of TaC carbide was 48.5 at.% $Ti{\sim}48.6$ at.% C-2.8 at.% Fe. The hardness of reaction layer was MHV $1100{\sim}1200$. The thickness of reaction layer linearly increased with increasing the total content of carbon in the cast iron matrix and isothermal heat treating time. The growth constant for TaC reaction layer was proportional to the log[C] of the matrix. The formation mechanism of TaC reaction layer at the interface of cast iron/tantalum thin sheet was proved to be the interfacial reaction.

• 한국표면공학회지
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• 제20권2호
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• pp.49-59
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• 1987

The properties of $Cr_2O_3-Al_2O_3-SiO_2$ composite oxide coatings on steel surface were investigated. The results obtained were as follows: The microhardness of oxide coating layer increased with increasing heat-treatment temperature and $Cr_2O_3$ content in coating layer. The hardness showed the highest value (850Hv) treated at 700$^{\circ}C$ for $SiO_2:Al_2O_3:Cr_2O_3$=1:1:4. Increasing heat-treatment temperature, corrosion current density became lower and coating layer became denser. The corrosion current density showed the lowest value $(6.5{\times}10^{-5}\;Acm^2)$ treated at 750$^{\circ}C\;for\;SiO_2:Al_2O_3:Cr_2O_3$=1:1:3. These results were explained by protective layer which was formed during heat-treatment. The bonding between matrix and coating layer is expected to be made mechanically and chemically by the inter diffusion of Ni and Fe. The composite oxide coating was formed by softening of the binder with increasing heat-treatment temperature. The strengthening of coating layer is to be resulted from the dispersion of major oxide particles.

• 보존과학회지
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• 제35권1호
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• pp.33-40
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• 2019

During the conservation and maintenance of the birthplace center yard of President Asan Yoon Bosun, four porcelain enamel dishware were excavated from the central yard well. The glaze layer of excavated enamel was severely damaged; hence, the conservation process was done rapidly. In addition, scientific investigation and analysis were conducted to confirm the material properties of the glaze layer. It was confirmed that the outer surface was inverted and dried, while the inner surface was upright and fired during the glazing and drying process by measuring the film thickness. By examining the breakup phenomenon, the breaking up of the white enamel on the colored enamel was confirmed. This indicates that the colored glaze rose to the surface depending on the density of the colored glaze and white glaze. The investigation of the cross-section of the film confirmed that the lower layer formed according to the bonding properties with metal during the glazing process. Analysis of the constituents of the identified lower layer confirmed that there are differences between the specific components of the metal oxide of the lower layer and the surface color development of the upper layer.

• Carbon letters
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• 제7권3호
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• pp.196-200
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• 2006

Graphite has hexagonal closed packing structure with two bonding characteristics of van der Waals bonding between the carbon layers at c axis, and covalent bonding in the carbon layer at a and b axis. Graphite has high tolerant to the extreme conditions of high temperature and neutron irradiations rather than any other materials of metals and ceramics. However, carbon elements easily react with oxygen at as low as 400C. Considering the increasing production of today of hydrogen and electricity with a nuclear reactor, study of oxidation characteristics of graphite is very important, and essential for the life evaluation and design of the nuclear reactor. Since the oxidation behaviors of graphite are dependent on the shapes of testing specimen, critical care is required for evaluation of nuclear reactor graphite materials. In this work, oxidation rate and amounts of the isotropic graphite (IG-110, Toyo Carbon), currently being used for the Koran nuclear reactor, are investigated at various temperature. Oxidation process or principle of graphite was figured out by measuring the oxidation rate, and relation between oxidation rate and sample shape are understood. In the oxidation process, shape effect of volume, surface area, and surface to volume ratio are investigated at $600^{\circ}C$, based on the sample of ASTM C 1179-91.