• Journal of the Korea Concrete Institute
• /
• v.21 no.6
• /
• pp.781-788
• /
• 2009

Mechanical properties of steel-concrete interface were evaluated on the basis of experimental observations. The properties included bond strength, unbounded and bonded friction angles, residual level of friction angle, mode I fracture energy, mode II bonded fracture energy and unbonded slip-friction energy under different levels of normal stress, and shape parameters to define geometrical shape of failure envelope. For this purpose, a typical type of constitutive model of describing steel-concrete interface behavior was presented based on a hyperbolic three-parameter Mohr-Coulomb type failure criterion. The constitutive model depicts the strong dependency of interface behavior on bonding condition of interface, bonded or unbounded. Values of the interface parameters were determined through interpretation of experimental results, geometry of failure envelope and sensitivity analysis. Nonlinear finite element analysis that incorporates steel-concrete interface as well as material nonlinearities of concrete and steel were performed to predict the experimental results.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.20 no.10
• /
• pp.3058-3067
• /
• 1996

With increasing use of ceramics/metal bonded joints, It is required to analyze the residual stress distribution and stress singularity at an interface edge for its bonded joints. In this paper, the residual stress distribution and stress singularity index of the ceramics/metal bonded joints were analyzed by using 2-dimensional elastic boundary element method. The variations of residual stress distribution and stress singularity index are studied with changes for the combinations of ceramics/metal bodned joints.

• Journal of the Korean Ceramic Society
• /
• v.36 no.8
• /
• pp.863-870
• /
• 1999

SOI(silicon on insulafor) was fabricated through the direct bonding using (100) Si wafer and 4$^{\circ}$off (100) Si wafer to investigate the stacking faults in silicon at the Si/SiO2 oxidized and bonded interface. The treatment time of wafer surface using MSC-1 solution was varied in order to observe the effect of cleaning on bonding characteristics. As the MSC-1 treating time increased surface hydrophilicity was saturated and surface microroughness increased. A comparison of surface hydrophilicity and microroughness with MSC-1 treating time indicates that optimum surface modified condition for time was immersed in MSC-1 for 2 min. The SOI structure directly bonded using (100) Si wafer and 4$^{\circ}$off (100) Si wafer at the room temperature were annealed at 110$0^{\circ}C$ for 30 min. Then the stacking faults at the bonding and oxidation interface were examined after the debonding. The results show that there were anomalies in the gettering of the stacking faults at the bonded region.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.21 no.9
• /
• pp.1357-1363
• /
• 1997

Currently it is increasing to use th bonded dissimilar materials in the various field of advanced engineering such as the highly rigid and lighter vehicle, plastic molding LSI package and metal/ceramic bonded joint. In spite of such a wide application of the bonded dissimilar materials, the evaluation method of the bonding strength has not been established yet. Therefore in this paper we analyze the interface crack problem by introducing fracture mechanics parameters as the basic research about estimating of the strength of adhesive joints. The variation of stress intensity factor according to the elastic modulus of adherend and thickness of bonded layer are investigated. Numerical results are based on the results of boundary element analysis of four different type butt joints subjected to uniaxial tension loading.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.24 no.6 s.177
• /
• pp.1547-1556
• /
• 2000

In this paper, an evaluation method of fracture toughness to apply interfacial fracture mechanics was investigated in adhesively bonded double-cantilever beam (DCB) joints. Four types of adhesively bonded DCB joints with an interface crack were prepared for analyses of the stress intensity factors using boundary element method(BEM) and the fracture toughness test. From the results of BEM analysis and fracture toughness experiments, it is found that the stress intensity factor, K1 is a parameter driving the fracture of adhesively bonded joints. Also, the evaluation method of fracture toughness by separated stress intensity factors of mixed mode cracks was proposed and the influences of mode components for its fracture toughness are investigated in adhesively bonded DCB joints.

• Journal of Welding and Joining
• /
• v.18 no.3
• /
• pp.106-113
• /
• 2000

Single crystallization behavior ad high temperature tensile properties of TLP bonded joints of Ni-base single crystal superalloy, CMSX-2 were investigated using MBF-80 and F-24 insert metals. CMSX-2 was bonded at 1523~1548K for 1.5~1.8ks in vacuum. The (100) orientation of bonded specimen was aligned perpendicular to the joint interface. Crystallographic orientation analyzed points over the bonded region possessed the almost same orientation across the joint interface and misorientation $\Delta^{\theta}$ was negligibly small in as-bonded and post-bond heat-treated situations. It was confirmed that single crystallization could be readily achieved during TLP bonding. The tensile strengths of all joints at elevated temperatures were equal to or greater than those of base metal the range of testing temperature between 923K and 1173K. The elongation and reduction of area in values were almost the same as those of base metal. SEM observation of the fracture surfaces of joints after tensile test revealed that the fracture surface indicated the similar morphologies each other, and that the fracture of joints occurred in the base metal in any cases.

• Journal of Adhesion and Interface
• /
• v.5 no.2
• /
• pp.48-52
• /
• 2004

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 1997.04a
• /
• pp.655-659
• /
• 1997

The analysis of cracks at the interface between dissimilar materilar has received a great deal of attention in recent years. In this paper we conducted the static tensile test for the aluminum bonded single lap-joint with the interface edge crack. Comparing this results, that is ultimate load and strain value of aluminum adherend by strain gauge with the fracture mechanics parameters, compliance and stress intensity factors acquied from the boundary element analysis, we concluded that there are critical value of crack length to provoke the interface fracture.

• Korean Journal of Materials Research
• /
• v.4 no.2
• /
• pp.127-135
• /
• 1994

We investigated the bonding interfaces of directly-bonded Si-Si and $Si-Sio_{2}$/Si wafer pairs. By the angle lapping-delineation, anisotropic etching, and (FIR)-TEM observation methods, we studied on the interface defects and the transient region originated from the interface stress, the various types of voids, the formation and stability of interfacial oxide. We also compared the interface image of the bonded $Si-Sio_{2}$ with that of a typically grown $Si-Sio_{2}$.

• Journal of the Semiconductor & Display Technology
• /
• v.17 no.1
• /
• pp.35-39
• /
• 2018

This paper deals with the relaxation of singular stresses developed in an epoxy adhesive at high temperature. The interface stresses are analyzed using BEM. The adhesive employed in this study is an epoxy which can be cured at room temperature. The adhesive is assumed to be linearly viscoelastic. First, the distribution of the interface stresses developed in the adhesive layer under the uniform tensile stress has been calculated. The singular stress has been observed near the interface corner. Such singular stresses near the interface corner may cause epoxy layer separated from adherent. Second, the interfacial thermal stress has been investigated. The uniform temperature rise can relieve the stress level developed in the adhesive layer under the external loading, which can be viewed as an advantage of thermal loading. It is also obvious that temperature rise reduces the bonding strength of the adhesive layer. Experimental evaluation is required to assess a trade-off between the advantageous and deleterious effects of temperature.