• Conservation Science in Museum
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• v.19
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• pp.69-82
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• 2018

The gilt-bronze standing Buddha and bronze standing Buddha statues excavated from Yeongguksa Temple in Yeongdong, currently held in the collection of the Cheongju National Museum, underwent conservation treatment after scientific study. Materials analysis showed that the gilt-bronze statue was made with a ternary alloy of copper, tin, and lead, while the bronze statue is of a binary alloy of copper and tin. The analysis also revealed that the bronze statue contains gold, and it is therefore recommended to change its description to gilt-bronze standing Buddha. The gilt-bronze statue appears to have been made with lead produced in Korea. The material observed on the surface that is presumed to have been used as an adhesive for the gold coloring is thought to be lacquer. For conservation treatment, the statues were minimally cleaned using physical and chemical methods and were treated through consolidation and protective coating.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.03a
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• pp.11-11
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• 2010

In order to design for nano structured materials with enhanced thermoelectric properties, the alloys in the pseudo-binary $Bi_2Te_3$-PbTe system were investigated for their micro structure and thermal properties. For this synthesis the liquid alloys were cooled by water quenching method. The micro structure images were taken by using electron probe micro analyzer (EPMA). Dendritic and lamellar structures were clearly observed with the variation in the composition ratio between $Bi_2Te_3$ and PbTe. It was confirmed that a metastable compounds is $PbBi_2Te_4$ in the The $Bi_2Te_3$-PbTe system. The change in the composition increasing $Bi_2Te_3$ ratio causes to change structure from dendritic to lamellar. Seebeck coefficient of alloys 5 which the mixture rate of $Bi_2Te_3$ is 83% was measured as the highest value. In contrast, the others decreased by increasing $Bi_2Te_3$. n-type characteristics was observed at all condition except alloy 6 which $Bi_2Te_3$ ration is 91%. The power factors of all samples were calculated with Seebeck coefficient and resistivity. Also the thermal conductivity was measured by using laser flash analyzer (LFA). In this work, the microstructures and thermal properties have been measured as a function of ratio of $Bi_2Te_3$ in the $Bi_2Te_3$-PbTe system.

• Resources Recycling
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• v.10 no.1
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• pp.49-55
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• 2001

The strategy of recovering metals from scrap is in general much different from primary sources. One of the main differences between the treatment of scrap and that of primary sources lies with the fact that metals are frequently associated with other met-als to form alloys in scrap, while metals occur in primary sources as oxides or sulfides. In this paper, factors affecting the dis-solution behavior of metals from various alloy systems have been reviewed and discussed. Specific examples have been drawn from Au/Ag, Au/cu and Ag/cu systems. Results of the dissolution behavior of various metals from these alloys have been reviewed and compared to the dissolution behavior of single metal systems in various lixiviants such as acids, cyanide and ammonia. It has been observed that the presence of other metals in alloys would significantly affect the dissolution rate of the metal in question. The leaching behavior of metals from homogeneous alloys relies on the chemical interaction between atoms in the lattice of the alloys, while that from heterogeneous alloys is affected by galvanic interaction established in the solution The manner in which the dissolution of a certain metal is influenced by surrounding metals has been discussed in terms of pas-sive and noble nature of the metal in relation to the neighboring metals. The role of the standard electrochemical Potential of these metals on the selective dissolution for a given lixiviant has also been discussed.

• Journal of Korea Foundry Society
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• v.8 no.4
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• pp.437-445
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• 1988

The effect of interlamellar spacing on microstructural stability at high temperature was studied for unidirectionally solidified ternary $Ni\;/\;Ni_3Al-Ni_3$ Nb and binary $Ni-Ni_3Nb$ eutectic composite. The interlamellar spacing of both alloy systems were varied with the growth rate according to $"{\lambda}^2R=constant"$ relationship. As a result of isothermal heat treatments at high temperature it was considered that coarsening of lamellar structure was due to concentration gradient between the tip with a relatively small radius of curvature and the side of the thick lamellae with a larger radius of the opposite sign. Fault density was increased as the interlamellar spacing decreased. Therefore it is also considered that the higher coarsening rate of the specimen with the smaller interlamellar spacing was due to higher fault density. And the diference of coarsening rate between $Ni\;/\;Ni_3Al-Ni_3Nb$ and $Ni-Ni_3Nb$ eutectic composites was not observed when the interlamellar spacing was similar in size. This means that the presence of ${\gamma}'$ in ${\gamma}\;/\;{\gamma}'\;-{\delta}$ eutectic had no b arrier effect to diffusion through the ${\gamma}$ matrix.

• Corrosion Science and Technology
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• v.11 no.5
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• pp.191-195
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• 2012

The aim of this study was to investigate effects of hafnium content on the corrosion behavior of Ti alloys in electrolyte containing chloride ion. For this study, Ti-Hf binary alloys contained 10 wt%, 20 wt% and 30 wt% Hf were manufactured in a vacuum arc-melting furnace and subjected to heat treatment for 12h at $1000^{\circ}C$ in an argon atmosphere. The pitting corrosion behavior of the specimens was examined through potentiodynamic and potentiostatic tests in 0.9 wt% NaCl electrolyte at $36.5{\pm}1^{\circ}C$. The corrosion morphology of Ti-xHf alloys was investigated using optical microscopy (OM) and X-ray diffractometer (XRD). From the optical microstructures and XRD results, needle-like martensite ($\alpha$') phases of the Ti-xHf alloys increased with an increase of Hf addition. Corrosion current density $(I_{corr})$ and current density $(I_{300mV})$ in passive region decreased, whereas, corrosion potential increased with Hf content. At the constant potential ($300mV_{SCE}$), current density decreased as time increased.

• Journal of Korea Foundry Society
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• v.24 no.3
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• pp.138-144
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• 2004

Effects of alloying elements such as Si, Mn, Zn on the fluidity and mechanical properties of high ductility Al-Mg based alloys were investigated. The fluidity of alloys was evaluated using a vacuum suction fluidity test, and Si addition was observed to increase the fluidity of AI-Mg binary alloys substantially while Zn somewhat decreased the fluidity. However, both the strength and ductility were significantly deteriorated by the Si additions. It was observed that a small amount of Mn addition to Al-Mg alloy increased the tensile strength effectively without losing much ductility but the effect of Zn addition on the strength was relatively small.

• Journal of Welding and Joining
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• v.17 no.4
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• pp.60-68
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• 1999

The previously developed two dimensional model was modified in order to predict more accurately the degree of microsegregation and eutectic fraction on in weld metal whose solidification rate is very fast. The model employed the same assumptions with previous model but considered of a tip undercooling. The previously predicted microsegregation and eutectic fraction has the discrepancies between simulated and examined results in the weld metal solidification. The experiments for the weld metal solidification of 2024 A1 and Fe-Ni alloy were carried out in order to examine the reasonability and feasibility of this modified model. The concentration profile of the solute and eutectic fraction predicted by the simulation agreed well with those found from experimental works. According to the results, it was believed that the dendrite tip undercooling considered in the modified model be reasonable for predicting the degree of microsegregation more accurately in weld metla solidification. In the GTA welds, degree of dendrite-tip undercooling increases with increasing solidification rage(welding speed). This serves to increase the concentration of dendrite core and thus result in reducing the degree of segregation. And solid state diffusion(back diffusion) during solidification is very low in the weld metal solidification so that little additional homogenization of solute occurs during solidification. With consideration of tip undercooling this modified model can predict exactly degree of microsegregation and eutectic fraction from slow solidification(casting) to fast solidification(welding).

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.2
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• pp.187-192
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• 2011

UBM(Under Bump Metallurgy) is very important for successful realization of Flip-Chip technology. In this study, it is investigated the interfacial reactions between various Sn-Ag solder alloys and Ni-P/Au UBM and Cu plate finish. It is also evaluated the shear strength by using the micro shear-punch test method for Sn-37Pb alloy, binary and ternary alloys of environment-friendly Pb-free solder alloys which are applied in the electronic packages. In terms of interfacial microstructure, the Pb-free solder joints have thicker IMCs than the Sn-Pb solder joints. The thickness of IMC is related to Reflow time. The IMC has been observed to grow with the increase in Reflow time. As a result of the shear test, in case of Max. shear strength, Pb-free solder showed the highest strength value and Sn-37Pb showed the lowest strength value 10 be generally condition of Reflow time.

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.235-237
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• 2007

In this paper, fabrication of Sn-3.0Ag-0.5Cu solder bumping having accurate composition and behavior of intermetallic compounds(IMCs) growth at interface between Sn-Ag-Cu bumps and Cu substrate were studied. The ternary alloy of the Sn-3.0Ag-0.5Cu solder was made by two binary(Sn-Cu, Sn-Ag) electroplating on Cu pad. For the manufacturing of the micro-bumps, photo-lithography and reflow process were carried out. After reflow process, the micro-bumps were aged at $150^{\circ}C$ during 1 hr to 500 hrs to observe behavior of IMCs growth at interface. As a different of Cu contents(0.5 or 2wt%) at Sn-Cu layer, behavior of IMCs was estimated. The interface were observed by FE-SEM and TEM for estimating of their each IMCs volume ratio and crystallographic-structure, respectively. From the results, it was found that the thickness of $Cu_3Sn$ layer formed at Sn-2.0Cu was thinner than the thickness of that layer be formed Sn-0.5Cu. After aging treatment $Cu_3Sn$ was formed at Sn-0.5Cu layer far thinner.

• Journal of the Korean Society for Industrial and Applied Mathematics
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• v.17 no.3
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• pp.197-207
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• 2013

The Cahn-Hilliard equation was proposed as a phenomenological model for describing the process of phase separation of a binary alloy. The equation has been applied to many physical applications such as amorphological instability caused by elastic non-equilibrium, image inpainting, two- and three-phase fluid flow, phase separation, flow visualization and the formation of the quantum dots. To solve the Cahn-Hillard equation, many numerical methods have been proposed such as the explicit Euler's, the implicit Euler's, the Crank-Nicolson, the semi-implicit Euler's, the linearly stabilized splitting and the non-linearly stabilized splitting schemes. In this paper, we investigate each scheme in finite-difference schemes by comparing their performances, especially stability and efficiency. Except the explicit Euler's method, we use the fast solver which is called a multigrid method. Our numerical investigation shows that the linearly stabilized stabilized splitting scheme is not unconditionally gradient stable in time unlike the known result. And the Crank-Nicolson scheme is accurate but unstable in time, whereas the non-linearly stabilized splitting scheme has advantage over other schemes on the time step restriction.