• 제목/요약/키워드: Bias-stress

검색결과 291건 처리시간 0.024초

Light Effects on the Bias Stability of Transparent ZnO Thin Film Transistors

  • Shin, Jae-Heon;Lee, Ji-Su;Hwang, Chi-Sun;KoPark, Sang-Hee;Cheong, Woo-Seok;Ryu, Min-Ki;Byun, Chun-Won;Lee, Jeong-Ik;Chu, Hye-Yong
    • ETRI Journal
    • /
    • 제31권1호
    • /
    • pp.62-64
    • /
    • 2009
  • We report on the bias stability characteristics of transparent ZnO thin film transistors (TFTs) under visible light illumination. The transfer curve shows virtually no change under positive gate bias stress with light illumination, while it shows dramatic negative shifts under negative gate bias stress. The major mechanism of the bias stability under visible illumination of our ZnO TFTs is thought to be the charge trapping of photo-generated holes at the gate insulator and/or insulator/channel interface.

BTS 측정 분석을 통한 MLCC 소자의 결함 여부 판단

  • 최평호;김상섭;최병덕
    • 한국진공학회:학술대회논문집
    • /
    • 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
    • /
    • pp.298-298
    • /
    • 2012
  • 본 연구에서는 Bias Temperature Stress (BTS) 측정을 통한 다층세라믹커패시터(Multi-Layer Ceramic Capacitor, MLCC) 소자 분석에 대한 연구를 진행하였다. BTS 분석은 소자 내부에 존재하는 Na+, K+ 등의 mobile charge 검출을 위한 방법으로 positive bias와 negative bias stress에 따른 C-V 특성 곡선으로부터 mobile charge의 정량적 해석이 가능하다. 실험 결과 positive bias stress 후의 C-V 특성 곡선이 stress 전 C-V 특성 곡선과 비교해 negative bias 영역으로 0.0376 V 만큼 shift 하였다. 또한 수식(QM = $Cox{\cdot}{\triangle}V$)으로부터 $1.7{\times}1,011$개의 mobile charge가 존재함을 확인하였다. 본 연구는 MLCC 소자 내의 금속 오염물 존재 여부에 따른 소자의 전기적 특성 변화 분석을 위해 진행되었으며, BTS 분석은 반도체 소자 뿐 아니라 본 연구에서와 같이 커패시터 소자의 결함 여부 판단에도 이용 가능함을 확인하였다.

  • PDF

Experimental Investigation of Physical Mechanism for Asymmetrical Degradation in Amorphous InGaZnO Thin-film Transistors under Simultaneous Gate and Drain Bias Stresses

  • Jeong, Chan-Yong;Kim, Hee-Joong;Lee, Jeong-Hwan;Kwon, Hyuck-In
    • JSTS:Journal of Semiconductor Technology and Science
    • /
    • 제17권2호
    • /
    • pp.239-244
    • /
    • 2017
  • We experimentally investigate the physical mechanism for asymmetrical degradation in amorphous indium-gallium-zinc oxide (a-IGZO) thin-film transistors (TFTs) under simultaneous gate and drain bias stresses. The transfer curves exhibit an asymmetrical negative shift after the application of gate-to-source ($V_{GS}$) and drain-to-source ($V_{DS}$) bias stresses of ($V_{GS}=24V$, $V_{DS}=15.9V$) and ($V_{GS}=22V$, $V_{DS}=20V$), but the asymmetrical degradation is more significant after the bias stress ($V_{GS}$, $V_{DS}$) of (22 V, 20 V) nevertheless the vertical electric field at the source is higher under the bias stress ($V_{GS}$, $V_{DS}$) of (24 V, 15.9 V) than (22 V, 20 V). By using the modified external load resistance method, we extract the source contact resistance ($R_S$) and the voltage drop at $R_S$ ($V_{S,\;drop}$) in the fabricated a-IGZO TFT under both bias stresses. A significantly higher RS and $V_{S,\;drop}$ are extracted under the bias stress ($V_{GS}$, $V_{DS}$) of (22 V, 20V) than (24 V, 15.9 V), which implies that the high horizontal electric field across the source contact due to the large voltage drop at the reverse biased Schottky junction is the dominant physical mechanism causing the asymmetrical degradation of a-IGZO TFTs under simultaneous gate and drain bias stresses.

Effects of Temperature Stress on VFB Shifts of HfO2-SiO2 Double Gate Dielectrics Devices

  • Lee, Kyung-Su;Kim, Sang-Sub;Choi, Byoung-Deog
    • 한국진공학회:학술대회논문집
    • /
    • 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
    • /
    • pp.340-341
    • /
    • 2012
  • In this work, we investigated the effects of temperature stress on flatband voltage (VFB) shifts of HfO2-SiO2 double gate dielectrics devices. Fig. 1 shows a high frequency C-V of the device when a positive bias for 10 min and a subsequent negative bias for 10 min were applied at room temperature (300 K). Fig. 2 shows the corresponding plot when the same positive and negative biases were applied at a higher temperature (473.15 K). These measurements are based on the BTS (bias temperature stress) about mobile charge in the gate oxides. These results indicate that the positive bias stress makes no difference, whereas the negative bias stress produces a significant difference; that is, the VFB value increased from ${\Delta}0.51$ V (300 K, Fig. 1) to ${\Delta}14.45$ V (473.15 K, Fig. 2). To explain these differences, we propose a mechanism on the basis of oxygen vacancy in HfO2. It is well-known that the oxygen vacancy in the p-type MOS-Cap is located within 1 eV below the bottom of the HfO2 conduction band (Fig. 3). In addition, this oxygen vacancy can easily trap the electron. When heated at 473.15 K, the electron is excited to a higher energy level from the original level (Fig. 4). As a result, the electron has sufficient energy to readily cross over the oxide barrier. The probability of trap about oxygen vacancy becomes very higher at 473.15 K, and therefore the VFB shift value becomes considerably larger.

  • PDF

상시불통형 p-AlGaN-게이트 질화갈륨 이종접합 트랜지스터의 게이트 전압 열화 시험 (Reliability Assessment of Normally-off p-AlGaN-gate GaN HEMTs with Gate-bias Stress)

  • 금동민;김형탁
    • 전기전자학회논문지
    • /
    • 제22권1호
    • /
    • pp.205-208
    • /
    • 2018
  • 본 연구에서는 상시불통형 p-AlGaN-게이트 질화갈륨(GaN) 이종접합 트랜지스터의 신뢰성 평가를 위한 가속열화 시험 조건을 수립하기 위해 게이트 전압 열화 시험을 진행하였다. 상시불통형 트랜지스터의 동작 조건을 고려하여 기존 상시도통형 쇼트키-게이트 소자평가에 사용되는 게이트 역전압 시험과 더불어 순전압 시험을 수행하여 열화특성을 분석하였다. 기존 상시도통형 소자와 달리 상시불통형 소자에서는 게이트 역전압 시험에 의한 열화는 관찰되지 않은 반면, 게이트 순전압 시험에서 심한 열화가 관찰되었다. 상시불통형 질화갈륨 전력 반도체 소자의 신뢰성 평가에 게이트 순전압 열화 시험이 포함되어야 함을 제안한다.

Influence of Channel Thickness Variation on Temperature and Bias Induced Stress Instability of Amorphous SiInZnO Thin Film Transistors

  • Lee, Byeong Hyeon;Lee, Sang Yeol
    • Transactions on Electrical and Electronic Materials
    • /
    • 제18권1호
    • /
    • pp.51-54
    • /
    • 2017
  • TFTs (thin film transistors) were fabricated using a-SIZO (amorphous silicon-indium-zinc-oxide) channel by RF (radio frequency) magnetron sputtering at room temperature. We report the influence of various channel thickness on the electrical performances of a-SIZO TFTs and their stability, using TS (temperature stress) and NBTS (negative bias temperature stress). Channel thickness was controlled by changing the deposition time. As the channel thickness increased, the threshold voltage ($V_{TH}$) of a-SIZO changed to the negative direction, from 1.3 to -2.4 V. This is mainly due to the increase of carrier concentration. During TS and NBTS, the threshold voltage shift (${\Delta}V_{TH}$) increased steadily, with increasing channel thickness. These results can be explained by the total trap density ($N_T$) increase due to the increase of bulk trap density ($N_{Bulk}$) in a-SIZO channel layer.

바이어스 스트레스에 의한 실리콘-게르마늄 이종접합 바이폴라 트랜지스터의 열화 현상 (The degradation phenomena in SiGe hetero-junction bipolar transistors induced by bias stress)

  • 이승윤;유병곤
    • 한국진공학회지
    • /
    • 제14권4호
    • /
    • pp.229-237
    • /
    • 2005
  • 바이어스 스트레스 인가 후에 발생하는 실리콘-게르마늄 이종접합 바이폴라 트랜지스터(SiGe HBT)의 열화현상을 고찰하였다. SiGe HBT가 바이어스 스트레스에 일정 시간 노출되면 소자 내부의 변화에 의하여 소자 파라미터가 원래 값으로부터 벗어나게 된다. 에미터-베이스 접합에 역방향 바이어스 스트레스가 걸리면 전기장에 의해 가속된 캐리어가 재결합 중심을 생성하여 베이스 전류가 증가하고 전류이득이 감소한다. $140^{\circ}C$ 이상의 온도에서 높은 에미터 전류를 흘려주는 순방향 바이어스 전류 스트레스가 가해지면 Auger recombination이나 avalancHe multiplication에 의해 형성된 핫 캐리어가 전류이득의 변동을 유발한다. 높은 에미터 전류와 콜렉터-베이스 전압이 동시에 인가되는 mixed-mode 스트레스가 가해지면 에미터-베이스 역방향 바이어스 스트레스의 경우와 마찬가지로 베이스 전류가 증가한다. 그러나 miked-mode 스트레스 인가 후에는 inverse mode Gummel 곡선에서 베이스 전류 증가가 관찰되고 perimeter-to-area(P/A) 비가 작은 소자가 심각하게 열화되는 등 에미터-베이스 역방향 바이어스 스트레스와는 근본적으로 다른 신뢰성 저하 양상이 나타난다.

기독교인의 코로나19 건강예방행위 영향 요인 (Influencing Factors of Christians' COVID-19 Health Prevention Behavior)

  • 방설영;제남주;박미라
    • 한국산업융합학회 논문집
    • /
    • 제26권2_2호
    • /
    • pp.293-306
    • /
    • 2023
  • The purpose of this study is a descriptive research study to analyze the factors that affect Christians' COVID-19 preventive behavior. The subjects of the study were 262 adult Christians, and the data collected were using SPSS 25.0 and AMOS 21.0 programs. As a result of the study, the subject's religious maturity level was 4.21 ± .55 points out of 5 points, COVID-19 stress was 2.86 ± .73 points out of 5 points, optimism bias was 2.94 ± 1.26 points out of 7 points, and COVID-19 preventive health behavior was 4 points. The total score was 3. 54 ± . 44 points. As a result of the correlation analysis of the subject's religious maturity, COVID-19 stress, optimistic bias, and COVID-19 preventive health behaviors, COVID-19 preventive health behaviors were faith maturity (r=.156, p=.012), COVID-19 stress (r=.216, There was a positive correlation with optimism bias (r=174, p=.005). In conclusion, it can be said that the higher the religious maturity, the higher the COVID-19 stress, and the higher the optimistic bias, the better the preventive health behavior of COVID-19, and the explanatory power of the overall model was 9.4%. In the post-COVID-19 era, it is necessary to develop educational programs that can prevent infectious diseases and promote health in the community.

Effect of Negative Substrate Bias Voltage on the Microstructure and Mechanical Properties of Nanostructured Ti-Al-N-O Coatings Prepared by Cathodic Arc Evaporation

  • Heo, Sungbo;Kim, Wang Ryeol;Park, In-Wook
    • 한국표면공학회지
    • /
    • 제54권3호
    • /
    • pp.133-138
    • /
    • 2021
  • Ternary Ti-X-N coatings, where X = Al, Si, Cr, O, etc., have been widely used for machining tools and cutting tools such as inserts, end-mills, and etc. Ti-Al-N-O coatings were deposited onto silicon wafer and WC-Co substrates by a cathodic arc evaporation (CAE) technique at various negative substrate bias voltages. In this study, the influence of substrate bias voltages during deposition on the microstructure and mechanical properties of Ti-Al-N-O coatings were systematically investigated to optimize the CAE deposition condition. Based on results from various analyses, the Ti-Al-N-O coatings prepared at substrate bias voltage of -80 V in the process exhibited excellent mechanical properties with a higher compressive residual stress. The Ti-Al-N-O (-80 V) coating exhibited the highest hardness around 30 GPa and elastic modulus around 303 GPa. The improvement of mechanical properties with optimized bias voltage of -80 V can be explained with the diminution of macroparticles, film densification and residual stress induced by ion bombardment effect. However, the increasing bias voltage above -80 V caused reduction in film deposition rate in the Ti-Al-N-O coatings due to re-sputtering and ion bombardment phenomenon.

더블게이트 실리콘 나노시트 피드백 전계효과 트랜지스터의 전기적 특성에 미치는 열처리 효과 (Effects of Annealing on Electrical Characteristics of Double-Gated Silicon Nanosheet Feedback Field-Effect Transistors)

  • 허효주;신연우;손재민;류승호;조경아;김상식
    • 전기전자학회논문지
    • /
    • 제27권4호
    • /
    • pp.418-424
    • /
    • 2023
  • 본 연구에서는 더블게이트 실리콘 나노시트 (SiNS) 피드백 전계효과 트랜지스터(FBFET)의 전기적 특성에 열처리가 미치는 영향을 분석하였다. 1000 초 동안 바이어스 스트레스를 인가했을 때 더블게이트 SiNS FBFET는 inversion layer의 전자에 의한 계면 트랩의 증가로 인해 채널 모드와 무관하게 negative bias stress 보다는 positive bias stress의 영향을 더 많이 받았다. 300 ℃에서 10 분 동안 열처리를 진행한 이후 소자는 원래의 특성을 완전히 회복하였으며 다시 1000 초 동안 바이어스 스트레스를 인가해도 특성이 변하지 않았다.