• Corrosion Science and Technology
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• 제2권5호
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• pp.238-242
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• 2003

The characteristics of Ru etching using $O_2/Cl_2$ plasmas were investigated by employing inductively coupled plasma (ICP) etcher. The changes of Ru etch rate, Ru to $SiO_2$ etch selectivity and Ru electrode etching slope with the gas flow ratio, bias power, total gas flow rate, and source power were scrutinized. A high etching slope (${\sim}86^{\circ}$) and a smooth surface after etching was attained using $O_2/Cl_2$ inductively coupled plasma.

• 한국세라믹학회:학술대회논문집
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• 한국세라믹학회 2003년도 춘계총회 및 연구발표회 초록집
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• pp.145.1-145
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• 2003

• 대한기계학회논문집A
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• 제32권10호
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• pp.831-835
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• 2008

We present a continuous electrical cell lysis chip, using a DC bias voltage to generate the focused high electric field for cell lysis as well as the electroosmotic flow for cell transport. The previous cell lysis chips apply an AC voltage between micro-gap electrodes for cell lysis and use pumps or valves for cell transport. The present DC chip generates high electrical field by reducing the width of the channel between a DC electrode pair, while the previous AC chips reducing the gap between an AC electrode pair. The present chip performs continuous cell pumping without using additional flow source, while the previous chips need additional pumps or valves for the discontinuous cell loading and unloading in the lysis chambers. The experimental study features an orifice whose width and length is 20 times narrower and 175 times shorter than the width and length of a microchannel. With an operational voltage of 50 V, the present chip generates high electric field strength of 1.2 kV/cm at the orifice to disrupt cells with 100% lysis rate of Red Blood Cells and low electric field strength of 60 V/cm at the microchannel to generate an electroosmotic flow of $30{\mu}m/s{\pm}9{\mu}m/s$. In conclusion, the present chip is capable of continuous self-pumping cell lysis at a low voltage; thus, it is suitable for a sample pretreatment component of a micro total analysis system or lab-on-a-chip.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.393-394
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• 2008

Carbon nanotubes are attractive nano-structured materials because of their remarkable electronic, physical, chemical properties. Due to these reasons, application researches of CNTs are actively processed on the display, the electronic element, the nano-diode fields and the semiconductor element. Today, The major issue of semiconductor technique are via and interconnects. CNTs are used to make via and interconnects because of high electric currents density and high heat transfer. Control of the orientation of grown CNTs is very important thing for making via and interconnects. Via are horizontal growth of CNTs and interconnects are vertical growth of CNTs. This research is based on the experiment using control of gas flow directions and DC bias. Scanning Electron Microscope (SEM) was used to check this experiment.

• 한국전기전자재료학회논문지
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• 제21권4호
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• pp.305-310
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• 2008

Deep trench etching of silicon was investigated as a function of RF source power, DC bias voltage, $C_4F_8$ gas flow rate, and $O_2$ gas addition. On increasing the RF source power from 300 W to 700 W, the etch rate was increased from $3.52{\mu}m/min$ to $7.07{\mu}m/min$. The addition of $O_2$ gas improved the etch rate and the selectivity. The highest etch rate is achieved at the $O_2$ gas addition of 12 %, The selectivity to PR was 65.75 with $O_2$ gas addition of 24 %. At DC bias voltage of -40 V and $C_4F_8$ gas flow rate of 30 seem, We were able to achieve etch rate as high as $5.25{\mu}m/min$ with good etch profile.

• 한국대기환경학회지
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• 제19권4호
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• pp.377-386
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• 2003

In order to develop a confident sampling technique, we designed and constructed a 6-port manifold MFC sampling system for collecting gaseous pollutants in air. Using this instrumentation, we tested the performance criteria of MFC system in terms of: (1) flow rate; (2) MFC-to-MFC variability; (3) tube-to-tube variability; and (4) time. It was interesting to find that the later two factors did not show any significant variations, while the former two show substantially large variations. However, as most of those variabilities are consistent enough to form systematic patterns, we were able to explain the occurrence patterns of all those MFC biases in terms of those four major variables. The overall results of our experiment suggest that one needs to use correction factor for each MFC unit under a given flow rate to maintain optimal accuracy and precision for sampling of those pollutants.

• 항공우주시스템공학회지
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• 제7권1호
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• pp.8-18
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• 2013

Recently, the advanced condition monitoring methods such as the model-based method and the artificial intelligent method have been applied to maximize the availability as well as to minimize the maintenance cost of the aircraft gas turbines. Among them the non-linear GPA(Gas Path Analysis) method and the GA(Genetic Algorithms) have lots of advantages to diagnose the engines compared to other advanced condition monitoring methods such as the linear GPA, fuzzy logic and neural networks. Therefore this work applies both the non-linear GPA and the GA to diagnose AE3007 turbofan engine for an aircraft, and in case of having sensor noise and bias it is confirmed that the GA is better than the GPA through the comparison of two methods.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제41회 하계 정기 학술대회 초록집
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• pp.236-236
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• 2011

Silicon oxynitride (SiON) was deposited for gas barrier film on polyethylene terephthalate (PET) using octamethylycyclodisiloxane (Si4O4C8H24, OMCTS) precursor by plasma enhanced chemical vapor deposition (PECVD) at low temperature. The ion flux and substrate temperature were measured by oscilloscope and thermometer. The chemical bonding structure and barrier property of films were characterized by Fourier transform infrared (FT-IR) spectroscopy and the water vapor transmission rate (WVTR), respectively. The deposition rate of films increases with RF bias and nitrogen dilution due to increase of dissociated precursor and nitrogen ion incident to the substrate. In addition, we confirmed that the increase of nitrogen dilution and RF bias reduced WVTR of films. Because, on the basis of FT-IR analysis, the increase of the nitrogen gas flow rate and RF bias caused the increase of the C=N stretching vibration resulting in the decrease of macro and nano defects.

• 한국수소및신에너지학회논문집
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• 제34권5호
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• pp.514-525
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• 2023

This study conducted numerical simulations with the purpose of analyzing the impact of variations in outlet pressure conditions under extreme temperature conditions on the fluid dynamics and performance of a check valve utilized in hydrogen refueling systems. Under the extreme temperature conditions, changes in outlet pressure conditions of the check valve were investigated to analyze velocity distributions, pressure distributions, and temperature distributions in the operational and connection regions. The analysis results indicated that changes in outlet pressure had a significant influence on the internal temperature variation of the check valve. Furthermore, due to density variations in the connection region caused by the cooling effect of excessively cooled hydrogen, a bias in the primary flow direction towards the lower part of the valve outlet was observed in the outlet area. Through a comparison of the results of the valve's inherent flow performance, represented by the flow coefficient, it was observed that when the pressure difference between the inlet and outlet was below 0.37 MPa, sufficient flow was not ensured.

• 펄프종이기술
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• 제35권1호
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• pp.7-12
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• 2003

The test results for water repellency of paper and paperboard according to KS M 7057 can readily be influenced by an operator's bias. In order to discard such bias, the automatic analysis program of water repellency was developed based on different shape features of a liquid trace formed on a specimen. That is, the shape of a liquid track flowing down on the specimen with an angle of $45^{\circ}$ was evaluated according to width variation between head and tail of the trace($S_{Hr}$), uniformity of a liquid flow($S_{d}$), length of long traces($L_{SHr}$), eccentricity of liquid traces($E_{i}$), and then was recognized as a specific degree of water repellency. Finally, the automatic analysis system of water repellency based upon KS M 7057 made it possible to readily measure water resistance of paper and paperboards classified into R0 to R10.