• Progress in Superconductivity and Cryogenics
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• v.4 no.1
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• pp.40-44
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• 2002

Influences of bending strain on the critical current (Ic) were investigated in Bi-2223 superconducting tapes at 77K. The effect of bending mode on the Ic degradation behavior was discussed in viewpoints of test procedure, n-value and damage morphology Especially, in this paper, we reported the Ic behavior in Ag alloy/Bi-2223 multifilamentary superconducting tapes under bending occurred within a width plane of the tape which was called as a hard bending. The Ic degradation under hard bending appeared significantly as compared with that under easy bending. The n-value decreased slightly with the increase in bending strain under the hard bending.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2000.02a
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• pp.3-5
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• 2000

Among the various processing techniques used in HTS wire fabrication, the PIP(Powder In Tube) method is currently one of the most promising for applications on an industrial scale. In this study, we have fabricated Bi-2223/Ag superconducting tapes using the modified PIT process, where several process factors were changed and improved, ie., powder packing, drawing, rolling and heat treatment. We obtained Bi-2223 tape that have high critical current, 46 a at 77.3 K, have high critical current, 46A at 77.3 K, self field although the tape was not pressed but only rolled. The critical current of 100m class long length tape was measured 21.6A at the same criterion. Besides, the critical current of Bi-2223/Ag tape was measured applying magnetic fields with different directions at various temperatures.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2003.02a
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• pp.101-104
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• 2003

Influences of transverse compressive stress on the critical current ( $I_{c}$) in AgMg and AgMn alloy sheathed Bi-2223 tapes were investigated at 77 K and 0 T. The $I_{c}$ degradation behavior depending on sample specifications was discussed in viewpoints of n-value and damage morphology. As a result, Bi-2223 tapes showed a significant drop in $I_{c}$ for stresses greater than 50MPa. The AgMg sheathed Bi-2223 tapes representing higher $I_{c}$ showed a lower $\sigma$$_{irr}$ and a significant $I_{c}$ degradation with increase in compressive stress. There existed a voltage tap separation dependency of the $I_{c}$ degradation behavior caused by the transverse compressive stress.sive stress.s.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.8
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• pp.718-723
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• 2000

The critical characteristics of Bi-2223 HTS tapes made by PIT method are influenced by the heat treatment and the mechanical processing. In this study firstly we investigated the influence o rolling reduction rate in mechanical process for improving Jc of HTS tapes. As a result the optimized rolling reduction rate that we obtained was 10%-50% and 30%-30% (1st-2nd). And then we fabricated the stacking type HTS tapes that made of the multi-filamentary tapes with various length(3, 5, 10cm) and with various number of stacking (1, 5, 10 layer). Measuring the critical current and observing the structure of grain we concluded that the stacking type tapes will be able to operate more stably by adding the number of stacking tapes. And we could expect that by minimizing the gap between Ag-sheath of tapes mechanical strength of stacking HTS tapes is enhanced and current in tapes will flow more stably.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.04a
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• pp.50-54
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• 2002

Influences of bending strain on the critical current ($I_c$) in Ag-sheathed Bi-2223 superconducting tapes at 77K were investigated. The effect of bending mode on the bending strain characteristics was discussed in viewpoints of sample geometry, n-value and damage morphology. Especially, in this paper, we reported the $I_c$ behavior in Ag alloy sheathed Bi-2223 multifilamentary superconducting tapes under hard bending. As a result, $I_c$ degradation behavior of the hard bending appeared remarkably than the case of easy bending, but it did not influence greatly on the n-value.

• Proceedings of the KIEE Conference
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• 1997.07d
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• pp.1339-1341
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• 1997

The various type Ag sheathed Bi-2223 tapes have been were fabricated by Powder-in-tube(PIT) process. The critical current density could be improved with the value of $23,000\;A/cm^2$(77 K, zero field) in the single concentric Bi-2223 tape. The bending property dependence of $I_c$ was improved in the double concentric Bi-2223 tape compared with single filamentary and single concentric one.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.284-285
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• 2005

Bi-2223 High-Temperature Superconducting(HTS) tape is one of the most widely used HTS tape for power application. Characteristics of the over current of HTS tape with different sheath are described. This paper presents the basic properties such as temperature and resistivity rise of the Bi-2223 HTS tape which is exposed to the over current. It is expected that results from this study can be utilized as basic data in designing superconducting power devices.

• Proceedings of the KIEE Conference
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• 2002.07b
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• pp.831-834
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• 2002

Several companies in the world are marketing superconducting wires, films and bulks. High-Tc superconducting systems using these superconductors are begun to commercialize. For the successful realization or commercialization of superconducting system used Bi-2223 wires, the database on the degradation of critical current is essentially needed. In this paper, the electrical degradation of a Bi-2223 wires is measured. The electrical degradation rate was measured after the certain time of continuous current transportation. Specimens have the length of 190cm and double-pancakes coil have the length of 10m were tested. Tested Bi-2223 wires are commercialized product has 115A of Ic. When the transportation current was 95% of Ie, the degradation of Ic was appeared after 5 hours of transportation time. When the transferred current is enough larger than Ic, Bi-2223 double pancake is damaged seriously.

• Transactions on Electrical and Electronic Materials
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• v.1 no.1
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• pp.12-16
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• 2000

In this paper, we analyze self field effects of Bi-2223 tape-stacked cable assuming constant current density in the cross section of stacked cable. Generally, the critical current of Bi-2223 tape-stacked-cable in much less than the total summation of critical currents of each tape, which is mainly due to the self magnetic fields of the cable itself. Therefore, to predict the critical current of Bi-2223 tape-stacked-cable, we needs to analyze the self filed effects on the stacked cable as well as critical current density data(J$\_$C/) of one tape. To make it more complex, the critical current degradation of Bi-2223 tape is an-isotropic; the critical current is lower in the normal magnetic field(to the tape surface) than in the parallel field. In the paper, a novel approach to predict the critical current of a Bi-2223 tape-stacked-cable from a J$\_$C/-B curve of one tape is presented with the assumption of constant current density across the stacked cable, The approach basically includes the load analysis of the stacked tapes, and its usefulness is confirmed by the experimental data.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.5
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• pp.473-477
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• 2005

A Bi-2223 tape has been developed for power applications such as a fault current limiter, a power cable and a superconducting magnetic energy storage system. In such applications, the Bi-2223 tape carries time varying transport current and in addition experiences time varying external magnetic field. It is well known that the external magnetic field not only causes magnetization loss in the Bi-2223 tape, but also drastically increases transport loss due to a so-called 'dynamic resistance' We developed an evaluation setup, which can measure transport loss in external at magnetic fields. Using this equipment, we measured the dynamic resistances for various amplitudes and frequencies of an external at magnetic field perpendicular to the face in the tape. Simultaneously we investigated the effect of an external ac field on transport loss with different experimental conditions. This paper describes test results ana discussions on correlation between the dynamic resistance and the transport loss for the Bi-2223 tape.