• Title/Summary/Keyword: Barrier Metal

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Growth and Structural Properties of Fe Thin Films Electrodeposited on n-Si(111) (n-Si(111) 기판 위에 전기증착에 의한 Fe 박막의 성장과 구조적 특성)

  • Kim Hyun-Deok;Park Kyeong-Won;Lee Jong-Duk
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.10 no.9
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    • pp.1663-1670
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    • 2006
  • Single crystal Fe thin films were grown directly onto n-Si(111) substrates by pulsed electrodeposition. Cyclic Voltammogram(CV) indicated that the $Fe^{2+}/n-Si(111)$ interface shows a good diode behavior by forming a Schottky barrier. From Mott-Schottky (MS) relation, it is found that the flat-band potential of n-Si(111) substrate and equilibrium redox potential of $Fet^{2+}$ ions are -0.526V and -0.316V, respectively. The nucleation and growth kinetics at the initial reaction stages of Fe/n-Si(111) substraste was studied by current transients. Current transients measurements have indicated that the deposition process starts via instantaneous nucleation and 3D diffusion limited growth. After the more deposition, the deposition flux of Fe ions was saturated with increase of deposition time. from the as-deposited sample obtained using the potential pulse of 1.4V and 300Hz, it is found that Fe nuclei grows to three dimensional(3D) islands with the average size of about 100nm in early deposition stages. As the deposition time increases, the sizes of Fe nuclei increases progressively and by a coalescence of the nuclei, a continuous Fe films grow on the Si surface. In this case, the Fe films show a highly oriented columnar structure and x-ray diffraction patterns reveal that the phase ${\alpha}-Fe$ grows on the n-Si(111) substrates.

Benthic Fluxes of Ammonia and Lead in Lake Shihwa (시화호에서 암모니아와 납의 저층용출)

  • Han, Myong-Woo;Park, Yong-Chul;Huh, Sung-Hoi
    • The Sea:JOURNAL OF THE KOREAN SOCIETY OF OCEANOGRAPHY
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    • v.2 no.2
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    • pp.69-77
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    • 1997
  • A 12-cm long sediment core was collected from a station in Lake Shihwa where high salinity-anoxic deep water is isolated from low salinity-oxic surface water by a strong halocline barrier. Unprecedented concentrations of porewater ammonia and lead are encountered: at 9 cm sediment depth ammonia builds up to 1420 ${\mu}M$ and at 3 cm lead to 1348 nM. As they are stable in anoxic condition, high concentrations of ammonia and lead suggest a development of notorious anoxic condition in the benthic environment of the lake. The degree of pollution of the deep water is likely to be directly proportional to the magnitude of benthic flux, because the deep water is isolated from the surface water by the halocline. Apparent coincidence of the ammonia residence time in the deep water with the elapsing time after the completion of the artificial lake construction, as about three years, suggests that the deep water pollution is being progressed entirely by benthic flux at least with respect to ammonia. The residence time for lead is such a short 20 days that it suggests a rapid return of the bottom water lead, which is originated from porewater by benthic flux, back to sediments probably as metal sulfide phases. The speculation on the return of lead as sulfide phases is likely to be supported by high concentration of hydrogen sulfide in the deep water and by high sinking rate of non-organic particles in Lake Shihwa.

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Role of Aluminum Top-layer on Synthesis of Carbon Nanotubes using Laminated Catalyst(Al/Fe/Al) layer (적층구조 촉매층(Al/Fe/Al)을 이용한 탄소나노튜브의 합성에서 최상층 알루미늄 층의 역할)

  • Song, W.;Choi, W.C.;Jeon, C.;Ryu, D.H.;Lee, S.Y.;Shin, Y.S.;Park, C.Y.
    • Journal of the Korean Vacuum Society
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    • v.16 no.5
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    • pp.377-382
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    • 2007
  • In this study, we report the synthesis of the single-walled carbon nanotubes(SWCNTs) using laminated catalyst(Al/Fe/Al) layer deposited by sputter on Si(001). SWCNTs are grown by thermal chemical vapor deposition (TCVD) method. As the results of scanning electron microscopy(SEM), high resolution transmission electron microscopy(HR-TEM) and Raman spectroscopy, we confirmed the SWCNTs bundles with narrow diameter distribution of $1.14{\sim}1.32\;nm$ and average G&D ratio of 22.76. Compare to the sample having Fe/Al catalyst layer, it can be proposed that the top-aluminum incorporated with iron catalyst plays an important role in growing process of CNTs as a agglomeration barrier of the Fe catalyst. Thus, we suggest that a proper quantity of aluminium metal incorporated in Fe catalyst induce small and uniform iron catalysts causing SWCNTs with narrow diameter distribution.

MOCVD를 이용한 자발성장 InAs 양자점의 적층 성장 시 발생하는 파장변화량 제어

  • Choe, Jang-Hui;An, Seong-Su;Yu, Su-Gyeong;Lee, Jong-Min;Park, Jae-Gyu;Lee, Dong-Han;Jo, Byeong-Gu;Han, Won-Seok
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.150-151
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    • 2011
  • 양자점 Laser Diode(LD)는 낮은 문턱전류, 높은 미분 이득을 갖으며 또한 온도변화에도 안정적이기 때문에 광통신분야에서 광원으로 양자점 LD를 사용하기 위한 연구가 계속되고 있다. 양자점은 fill factor가 낮기 때문에 양자점의 밀도를 높이거나 양자점을 적층 성장하여 fill factor를 높인다. 그러나 양자점을 적층 성장하면 각 층간의 응력, 수직적 결합, 전기적인 결합이 생기며 이는 양자점의 전기적, 광학적 특성에 영향을 미친다. 본 연구에서는 metal organic chemical vapor deposition (MOCVD)을 이용하여 InP기판 위에 자발성장 법으로 InAs 양자점을 다주기 성장하였으며 photoluminescence (PL)을 이용하여 광학적 특성을 분석하였다. precursor는 trimethylindium (TMI), trimethylgalium (TMGa), $PH_3$, $AsH_3$를 사용하였으며 carrier gas는 $H_2$를 사용하였다. InAs 양자점은 1100 nm의 파장을 갖는 InGaAsP barrier 위에 성장하였고, InAs와 InGaAsP의 성장온도는 $520^{\circ}C$이며 InAs 양자점 성장시 V/III 비는 3.66으로 일정하게 유지하였다. 그림 1은 양자점 성장시간을 0.11분으로 고정하여 3주기(A), 5주기(B), 8주기(C) 성장한 구조이며 그림 2는 양자점 성장시간을 3주기마다 0.01분씩 줄여가며 3주기는 0.11분${\times}$3(D), 6주기는 0.11분${\times}$3+0.10분${\times}$3(E), 9주기는 0.11분${\times}$3+0.10분${\times}$3+0.09분${\times}$3(F) 으로 성장한 성장구조이다. 각 성장한 시료는 PL을 이용하여 파장과 반치폭을 측정하였다. 그림 3은 양자점 성장시간을 고정한 시료 A, B, C의 PL파장과 PL반치폭 데이터이다. PL파장은 A, B, C 시료 각각 1504 nm, 1571 nm, 1702 nm이며 반치폭은 각각 140 meV, 140 meV, 150 meV이다. PL파장과 반치폭은 각각 3주기에서 6주기로 증가할 때 67 nm, 0 meV 6주기에서 9주기로 증가할 때는 131 nm, 10 meV 증가하였다. 다음 그림4는 양자점 성장시간을 조절하여 성장한 양자점 시료 D, E, F의 PL파장과 PL반치폭 데이터이다. PL파장은 D, E, F 시료 각각 1509 nm, 1556 nm, 1535 nm이며 반치폭은 각각 137 meV, 138 meV, 144 meV이다. PL파장과 반치폭은 각각 3주기에서 6주기로 증가할 때 47 nm, 1 meV 증가하였고, 6주기에서 9주기로 증가할 때는 21 nm 감소, 6 meV 증가하였다. 양자점 성장시간을 고정하여 다주기를 성장하였고 또 3주기마다 양자점 성장시간을 달리하여 다주기를 성장하였으며 PL을 이용해 광학적 특성을 연구하였다. 성장된 양자점의 PL 파장과 PL 반치폭 변화를 통해 적층구조에서 성장 주기가 늘어날수록 양자점의 크기가 증가하는 것을 확인하였고 또한 적층성장을 할 때 양자점 성장시간을 줄임으로써 양자점의 크기 변화를 제어 할 수 있었다.

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Effects of hydrogen and ammonia partial pressure on MOCVD $Co/TaN_x$ layer for Cu direct electroplating

  • Park, Jae-Hyeong;Mun, Dae-Yong;Han, Dong-Seok;Yun, Don-Gyu;Park, Jong-Wan
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2012.05a
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    • pp.84-84
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    • 2012
  • 소자가 고집적화 됨에 따라, 비저항이 낮고 electro migration (EM), Stress Migration (SM) 특성이 우수한 구리(Cu)를 배선재료로서 사용하고 있다. 그러나, 구리는 Si과 $SiO_2$의 내부로 확산이 빠르게 일어나, Si 소자 내부에 deep donor level을 형성하고, 누설 전류를 증가시키는 등 소자의 성능을 저하시킬 수 있는 문제점을 가지고 있다. 그러나, electroplating 을 이용하여 증착한 Cu 박막은 일반적으로 확산 방지막으로 쓰이는 TiN, TaN, 등의 물질과의 접착 (adhesion) 특성이 나쁘다. 따라서, Cu CMP 에서 증착된 Cu 박막의 벗겨지거나(peeling), EM or SM 저항성 저하 등의 배선에서의 reliability 문제를 야기하게된다. 따라서 Cu 와 접착 특성이 좋은 새로운 확산방지막 또는 adhesion layer의 필요성이 대두되고 있다. 본 연구에서는 이러한 Cu 배선에서의 접착성 문제를 해결하고자 Metal organic chemical vapor deposition (MOCVD)을 이용하여 제조한 코발트(Co) 박막을 $Cu/TaN_x$ 사이의 접착력 개선을 위한 adhesion layer로 적용하려는 시도를 하였다. Co는 비저항이 낮고, Cu 와 adhesion이 좋으며, Cu direct electroplating 이 가능하다는 장점을 가지고 있다. 하지만, 수소 분위기에서 $C_{12}H_{10}O_6(Co)_2$ (dicobalt hexacarbonyl tert-butylacetylene, CCTBA) 전구체에 의한 MOCVD Co 박막의 경우 탄소, 산소와 같은 불순물이 다량 함유되어 있어, 비저항, surface roughness 가 높아지게 된다. 따라서 구리 전착 초기에 구리의 핵 생성(nucleation)을 저해하고 핵 생성 후에도 응집(agglomeration)이 발생하여 연속적이고 얇은 구리막 형성을 방해한다. 이를 해결하기 위해, MOCVD Co 박막 증착 시 수소 반응 가스에 암모니아를 추가로 주입하여, 수소/암모니아의 분압을 1:1, 1:6, 1:10으로 변화시켜 $Co/TaN_x$ 박막의 특성을 비교 분석하였다. 각각의 수소/암모니아 분압에 따른 $Co/TaN_x$ 박막을 TEM (Transmission electron microscopy), XRD (X-ray diffraction), AES (Auger electron spectroscopy)를 통해 물성 및 조성을 분석하였고, AFM (Atomic force microscopy)를 이용하여, surface roughness를 측정하였다. 실험 결과, $Co/TaN_x$ 박막은 수소/암모니아 분압 1:6에서 90 ${\mu}{\Omega}-cm$의 낮은 비저항과 0.97 nm 의 낮은 surface roughness 를 가졌다. 뿐만 아니라, MOCVD 에 의해 증착된 Co 박막이4-6 % concentration 의 탄소 및 산소 함량을 가지는 것으로 나타났고, 24nm 크기의 trench 기판 위에 약 6nm의 $Co/TaN_x$ 박막이 매우 균일하게 형성된 것을 확인 할 수 있었다. 이러한 결과들은, 향후 $Co/TaN_x$ 박막이 Cu direct electroplating 공정이 가능한 diffusion barrier로서 성공적으로 사용될 수 있음을 보여준다.

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Oxidation Behavior at the Interface between E-beam Coated $ZrO_{2}$-7wt.%$Y_{2}O}_{3}$and Plasma Sprayed CoNiCrAlY (전자빔 코팅 및 플라즈마 용사에 의한 안정화지르코니아/CoNiCrAlY 계면의 산화거동)

  • Choi, Won-Seop;Kim, Young-Do;Jeon, Hyeong-Tag;Kim, Hyon-Tae;Yoon, Kook-Han;Hong, Kyung-Tae;Park, Jong-Ku;Park, Won-Sik
    • Korean Journal of Materials Research
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    • v.8 no.6
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    • pp.538-544
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    • 1998
  • The spallation of a thermal barrier coating layer depends on the formation of brittle spinels. thermal expansion mismatch between ceramic and metal. the phase transformation of a ceramic layer and residual stress of coating layer. In this work. the formation mechanism of oxide scale formed by oxidation treatment at 90$0^{\circ}C$ was investigated in order to verify oxidation behavior at the interface between E-beam coated $Zr0_2$-7wt.% $Y_20_3$ and plasma sprayed CoNiCrAIY. Some elements distributed in the bond coating layer were selectively oxidized after oxidation. At the initial time of oxidation. AI-depletion zone and $\alpha$-$Al_O_3$,O, were formed at the bond coating layer by the AI-outward diffusion. After layer grew until critical thickness. spinels. $Cr_20$, and $C0_2CrO_4$ by outward diffusion of Co. Cr, Ni were formed. It was found that the formation of spinels may be related to the spallation of $Zr0_2$-7wt.% $Y_20_3$ during isothermal oxidation.

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A Study on the Electrical Characteristics of Ge2Sb2Te5/Ti/W-Ge8Sb2Te11 Structure for Multi-Level Phase Change Memory (다중준위 상변환 메모리를 위한 Ge2Sb2Te5/Ti/W-Ge8Sb2Te11 구조의 전기적 특성 연구)

  • Oh, Woo-Young;Lee, Hyun-Yong
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.35 no.1
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    • pp.44-49
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    • 2022
  • In this paper, we investigated current (I)- and voltage (V)-sweeping properties in a double-stack structure, Ge2Sb2Te5/Ti/W-doped Ge8Sb2Te11, a candidate medium for applications to multilevel phase-change memory. 200-nm-thick and W-doped Ge2Sb2Te5 and W-doped Ge8Sb2Te11 films were deposited on p-type Si(100) substrate using magnetron sputtering system, and the sheet resistance was measured using 4 point-probe method. The sheet resistance of amorphous-phase W-doped Ge8Sb2Te11 film was about 1 order larger than that of Ge2Sb2Te5 film. The I- and V-sweeping properties were measured using sourcemeter, pulse generator, and digital multimeter. The speed of amorphous-to-multilevel crystallization was evaluated from a graph of resistance vs. pulse duration (t) at a fixed applied voltage (12 V). All the double-stack cells exhibited a two-step phase change process with the multilevel memory states of high-middle-low resistance (HR-MR-LR). In particular, the stable MR state is required to guarantee the reliability of the multilevel phase-change memory. For the Ge2Sb2Te5 (150 nm)/Ti (20 nm)/W-Ge8Sb2Te11 (50 nm), the phase transformations of HR→MR and MR→LR were observed at t<30ns and t<65ns, respectively. We believe that a high speed and stable multilevel phase-change memory can be optimized by the double-stack structure of proper Ge-Sb-Te films separated by a barrier metal (Ti).

Switching and Leakage-Power Suppressed SRAM for Leakage-Dominant Deep-Submicron CMOS Technologies (초미세 CMOS 공정에서의 스위칭 및 누설전력 억제 SRAM 설계)

  • Choi Hoon-Dae;Min Kyeong-Sik
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.43 no.3 s.345
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    • pp.21-32
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    • 2006
  • A new SRAM circuit with row-by-row activation and low-swing write schemes is proposed to reduce switching power of active cells as well as leakage one of sleep cells in this paper. By driving source line of sleep cells by $V_{SSH}$ which is higher than $V_{SS}$, the leakage current can be reduced to 1/100 due to the cooperation of the reverse body-bias. Drain Induced Barrier Lowering (DIBL), and negative $V_{GS}$ effects. Moreover, the bit line leakage which may introduce a fault during the read operation can be eliminated in this new SRAM. Swing voltage on highly capacitive bit lines is reduced to $V_{DD}-to-V_{SSH}$ from the conventional $V_{DD}-to-V_{SS}$ during the write operation, greatly saving the bit line switching power. Combining the row-by-row activation scheme with the low-swing write does not require the additional area penalty. By the SPICE simulation with the Berkeley Predictive Technology Modes, 93% of leakage power and 43% of switching one are estimated to be saved in future leakage-dominant 70-un process. A test chip has been fabricated using $0.35-{\mu}m$ CMOS process to verify the effectiveness and feasibility of the new SRAM, where the switching power is measured to be 30% less than the conventional SRAM when the I/O bit width is only 8. The stored data is confirmed to be retained without loss until the retention voltage is reduced to 1.1V which is mainly due to the metal shield. The switching power will be expected to be more significant with increasing the I/O bit width.