• Proceedings of the Korean Vacuum Society Conference
• /
• 2012.02a
• /
• pp.385-385
• /
• 2012

A two terminal N+/P/N+ junction device to replace the conventional selective transistor was studied as a bilateral switching device for spin transfer torque (STT) MRAM based on 3D device simulation. An N+/P/N+ junction structure with $30{\times}30nm$ area requires bi-directional current flow enough to write a data by a drain induced barrier lowering (DIBL) under a reverse bias at N+/P (or P/N+ junction), and high current on/off ratio of 106. The SiGe materials are widely used in hetero-junction bipolar transistors, bipolar compensation metal-oxide semiconductors (BiCMOS) since the band gap of SiGe materials can be controlled by changing the fraction and the strain epilayers, and the drift mobility is increased with the increasing Ge content. In this work, N+/P/N+ SiGe material based junction provides that drive current is increased from 40 to $130{\mu}A$ by increased Ge content from 10~80%. When Ge content is about 20%, the drive current density of SiGe device substantially increased to 2~3 times better than Si-based junction device in case of 28 nm P length, which is sufficient current to operation of STT-MRAM.

• Journal of electromagnetic engineering and science
• /
• v.15 no.2
• /
• pp.82-88
• /
• 2015

The magnetron, a vacuum tube, is currently the usual high-power microwave power source used for microwave heating. However, the oscillating frequency and output power are unstable and noisy due to the low quality of the high-voltage power supply and low Q of the oscillation circuit. A heating system with enhanced reliability and the capability for control of chemical reactions is desired, because microwave absorption efficiency differs greatly depending on the object being heated. Recent studies on microwave high-efficiency power amplifiers have used harmonic processing techniques, such as class-F and inverse class-F. The present study describes a high-efficiency 100 W GaN-HEMT amplifier that uses a harmonic processing technique that shapes the current and voltage waveforms to improve efficiency. The fabricated GaN power amplifier obtained an output power of 50.4 dBm, a drain efficiency of 72.9%, and a power added efficiency (PAE) of 64.0% at 2.45 GHz for continuous wave operation. A prototype microwave heating system was also developed using this GaN power amplifier. Microwaves totaling 400 W are fed from patch antennas mounted on the top and bottom of the microwave chamber. Preliminary heating experiments with this system have just been initiated.

• ETRI Journal
• /
• v.27 no.6
• /
• pp.685-690
• /
• 2005

DC and RF characteristics of $0.15{\mu}m$ GaAs power metamorphic high electron mobility transistors (MHEMT) have been investigated. The $0.15{\mu}m{\times}100{\mu}m$ MHEMT device shows a drain saturation current of 480 mA/mm, an extrinsic transconductance of 830 mS/mm, and a threshold voltage of -0.65 V. Uniformities of the threshold voltage and the maximum extrinsic transconductance across a 4-inch wafer were 8.3% and 5.1%, respectively. The obtained cut-off frequency and maximum frequency of oscillation are 141 GHz and 243 GHz, respectively. The $8{\times}50{\mu}m$ MHEMT device shows 33.2% power-added efficiency, an 18.1 dB power gain, and a 28.2 mW output power. A very low minimum noise figure of 0.79 dB and an associated gain of 10.56 dB at 26 GHz are obtained for the power MHEMT with an indium content of 53% in the InGaAs channel. This excellent noise characteristic is attributed to the drastic reduction of gate resistance by the T-shaped gate with a wide head and improved device performance. This power MHEMT technology can be used toward 77 GHz band applications.

• Journal of the Korea Institute of Military Science and Technology
• /
• v.13 no.6
• /
• pp.1071-1079
• /
• 2010

This paper describes the design and fabrication of a high-efficiency GaN HEMT(Gallium Nitride High-electron Mobility Transistor) Pallet power amplifier module for S-band phased array radar applications. Pallet amplifier module has a series 2-cascaded power amplifier and the final amplification-stage consists of balanced GaN HEMT transistor. In order to achieve high efficiency characteristic of pallet power amplifier module, all amplifiers are designed to the switching-mode amplifier. We performed with various PRF(Pulse Repetition Frequency) of 1, 10, 100 and 1000Hz at a fixed pulse width of $100{\mu}s$. In the experimental results, the output power, gain, and drain efficiency(${\eta}_{total}$) of the Pallet power amplifier module are 300W, 33dB, and 51% at saturated output power of 2.9GHz, respectively.

• Journal of Electrical Engineering and information Science
• /
• v.2 no.6
• /
• pp.202-207
• /
• 1997

Design and fabrication issues for an L-band GaAs Monolithic Microwave Integrated Circuit(MMIC) Voltage Controlled Oscillator(VCO) as a component of Personal Communications Systems(PCS) Radio Frequency(RF) transceiver are discussed. An ion-implanted GaAs MESFET tailored toward low current and low noise with 0.5mm gate length and 300mm gate width has been used as an active device, while an FET with the drain shorted to the source has been used as the voltage variable capacitor. The principal design was based on a self-biased FET with capacitive feedback. A tuning range of 140MHz and 58MHz has been obtained by 3V change for a 600mm and a 300mm devices, respectively. The oscillator output power was 6.5dBm wth 14mA DC current supply at 3.6V. The phase noise without any buffer or PLL was 93dB/1Hz at 100KHz offset. Harmonic balance analysis was used for the non-linear simulation after a linear simulation. All layout induced parasitics were incorporated into the simulation with EEFET2 non-linear FET model. The fabricated circuits were measured using a coplanar-type probe for bare chips and test jigs with ceramic packages.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• v.24 no.4
• /
• pp.394-402
• /
• 2013

This paper presents design, fabrication and ruggedness test of switching-mode power amplifier using GaN(Gallium Nitride) HEMT(High Electron Mobility Transistor) for S-band radar applications. The power amplifier is designed to Class-F for high efficiency. The input signal for the measurement of the power amplifier is pulse signal at $100{\mu}s$ pulse width and duty cycle of 10 %. The measurement results of the fabricated Class-F power amplifier are a power gain of 10.8 dB, an output power of 40.8 dBm, a power added efficiency(PAE) of 54.2 %, and a drain efficiency of 62.6 %, at the center frequency. We proposed reliability test set-up of a power amplifier for ruggedness test. And we measured output power and efficiency according to VSWR(Voltage Standing Wave Ratio) variation. The designed power amplifier achieved output power of 32.6~41.1 dBm and drain efficiency of 23.4~63 % by changing VSWR, respectively.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.41 no.9
• /
• pp.25-30
• /
• 2004

In this Paper, the 0.1 w InGaAs/InAlAs/GaAs Metamorphic HEMT, which is applicable to MIMIC, and a 100 GHz MIMIC amplifier were designed and fabricated. The DC characteristics of MHEMT are 640 mA/mm of drain current density, 653 mS/mm of maximum transconductance. The current gain cut-off frequency(fT) is 173 GHz and the maximum oscillation frequency(fmax) is 271 GHz. A 100 GHz amplifier was designed using 0.1${\mu}{\textrm}{m}$ MHEMT and CPW technology. The measured results from the 100 GHz MIMIC amplifiers show good S21 gain of 10.1 dB and 12.74 dB at 100 GHz and 97.8 GHz, respectively.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2013.02a
• /
• pp.221-221
• /
• 2013

Striving to replace the well known silicon nanocrystals embedded in oxides with solution-processable charge-trapping materials has been debated because of large scale and cost effective demands. Herein, a silicon quantum dot-polystyrene nanocomposite (SiQD-PS NC) was synthesized by postfunctionalization of hydrogen-terminated silicon quantum dots (H-SiQDs) with styrene using a thermally induced surface-initiated polymerization approach. The NC contains two miscible components: PS and SiQD@PS, which respectively are polystyrene and polystyrene chains-capped SiQDs. Spin-coated films of the nanocomposite on various substrate were thermally annealed at different temperatures and subsequently used to construct metal-insulator-semiconductor (MIS) devices and thin film field effect transistors (TFTs) having a structure p-$S^{++}$/$SiO_2$/NC/pentacene/Au source-drain. C-V curves obtained from the MIS devices exhibit a well-defined counterclockwise hysteresis with negative fat band shifts, which was stable over a wide range of curing temperature ($50{\sim}250^{\circ}C$. The positive charge trapping capability of the NC originates from the spherical potential well structure of the SiQD@PS component while the strong chemical bonding between SiQDs and polystyrene chains accounts for the thermal stability of the charge trapping property. The transfer curve of the transistor was controllably shifted to the negative direction by chaining applied gate voltage. Thereby, this newly synthesized and solution processable SiQD-PS nanocomposite is applicable as charge trapping materials for TFT based memory devices.

• Proceedings of the KSRS Conference
• /
• 2004.10a
• /
• pp.331-335
• /
• 2004

This study is focused to analyze the movement of thermal effluent dischargeed from nuclear power plant by season, ebb and flow, and before and after foundation of tide embankment using thermal infrared band image of 28 scenes observed from Landsat from 1987 to 2004, which is the early stage of operation of young-kwang nuclear power plant. In diffusion of thermal effluent discharge by seasons, spring and summer is spreading further than autumn and winter. It is considered to distribute widely mixed with thermal effluent discharge and hot water, which is distributed naturally along the seaside. It is known the fact that tidal currents control the direction of diffusion of thermal effluent discharge by the change of ebb and flow. Namely, it is distributed widely on the Southwest direction along the seaside by tidal currents when ebb and, it is moved widely on the Northeast direction along the seaside by tidal current when flood. However, in the early stage of flood current, the mainstream of thermal effluent discharge is spread on Southwest direction and, the direction is changed on North­east way when the latter period of flood current. Similarly, in the early stage of ebb current, the mainstream of thermal effluent discharge is spread on Northeast direction and, the direction is changed on Southwest direction when the latter period of ebb current. As the result of comparing to the diffusion pattern of thermal effluent discharge before and after the foundation of seawall, discharged thermal effluent from the drain of plant by the foundation of dike is shown as curved circle pattern on Northeast to West direction from the ending portion of the seawall.

• ETRI Journal
• /
• v.14 no.1
• /
• pp.40-51
• /
• 1992

$0.25{\mu} m$ 급 pMOSFET소자를 구현하기 위해, $P^+$ 폴리실리콘을 적용한 pMOS를 제작하였으며, $p^+$ 폴리실리콘 게이트 소자에서 심각하게 문제가 되고 있는 붕소이온 침투현상을 조사하고 붕소이온 침투가 일어나지 않는 최적열처리온도를 조사하였다. 소자제조 공정중 게이트 공정만 전자선 (EBML300)을 이용하여 직접묘사하고 그 이외의 공정은 stepper(gline) 을 사용하는 Mix & Match 방법을 사용하였다. 또한 붕소이온 침투현상을 억제하기 위한 한가지 예로서, 실리콘산화막과 실리콘질화막을 적층한 ONO(Oxide/Nitride/Oxide) 구조를 게이트 유전체로 적용한 소자를 제작하여 그 가능성을 조사하였다. 그 결과 $850^{\circ}C$의 온도와 $N_2$ 분위기에서 30분동안 열처리 하였을 경우, 붕소이온의 침투현상이 일어나지 않음을 SIMS(Secondary Ion Mass Spectrometer) 분석 및 C-V(Capacitance-Voltage) 측정으로 확인할 수 있었으며 그 이상의 온도에서는 붕소이온이 침투되어 flat band전압(Vfb)을 변화시킴을 알았다. 6nm의 얇은 게이트 산화막 및 $0.1{\mu} m$ 이하의 LDD(Lightly Doped Drain) $p^-$의 얇은 접합을 형성함으로써 소자의 채널길이가 $0.2 {\mu} m$까지 짧은 채널효과가 거의 없는 소자제작이 가능하였으며, 전류구동능력은 $0.26\muA$/$\mu$m(L=0.2$\mu$m, V$_DS$=2.5V)이었고, subthreshold 기울기는 89-85mV/dec.를 얻었다. 붕소이온의 침투현상을 억제하기 위한 한가지 방법으로 ONO 유전체를 소자에 적용한 결과, $900^{\circ}C$에서 30분의 열처리조건에서도 붕소이온 침투현상이 일어나지 않음으로 미루어 , $SiO_2$ 게이트 유전체보다 ONO 게이트 유전체가 boron 침투에 대해서 좋은 장벽 역활을 함을 알았다. ONO 게이트 유전체를 적용한 소자의 경우, subthreshold특성은 84mV/dec로서 좋은 turn on,off 특성을 얻었으나, ONO 게이트 유전체는 막자체의 누설전류와 실리콘과 유전체 계면의 고정전하량인 Qss의 양이 공정조건에 따라 변화가 심해서 문턱전압 조절이 어려워 소자적용시 문제가 된다. 최근 바닥 산화막(bottom oxide) 두께가 최적화된 ONO 게이트 유전체에 대하 연구가 활발히 진행됨을 미루어, 바닥 산화막 최적화가 된다면 더 좋은 결과가 예상된다.