• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2002년도 추계기술심포지움논문집
• /
• pp.27-32
• /
• 2002

In this paper, global full 3D finite element analysis fatigue models are constructed for flip-chip BGA on board to predict the creep fatigue life of solder joints during the thermal cycling test. The fatigue model applied is based on Darveaux's empirical equation approach with non-linear viscoplastic analysis of solder joints. It was estimated by the creep life as the variations of the four kinds of thermal cycling test conditions, pad structure, composition and size of solder ball. The shortest fatigue life of results was obtained at the thermal cycling testing condition of -65℃ ∼ 150℃. It was increased about 3.5 times in comparison with that of 0℃ ∼ 100℃. As the change of pad structure at the same other conditions, the fatigue life of SMD structure increased about 5.7% as compared with NSMD structure. Consequently, it was confirmed that the fatigue life became short as the creep strain energy density increased in solder joint.

• 한국소음진동공학회:학술대회논문집
• /
• 한국소음진동공학회 2005년도 추계학술대회논문집
• /
• pp.143-146
• /
• 2005

In modern automotive control modules, mechanical failures of surface mounted electronic components such as microprocessors, crystals, capacitors, transformers, inductors, and ball grid array packages, etc., are mai or roadblocks to design cycle time and product reliability. This paper presents a general methodology of failure analysis and fatigue prediction of these electronic components under automotive vibration environments. Mechanical performance of these packages is studied through finite element modeling approach fur given vibration environments in automotive application. Using the results of vibration simulation, fatigue lift is predicted based on cumulative damage analysis and material durability information. Detailed model of solder/lead joints is built to correlate the system level model and obtain solder strains/stresses. The primary focus in this paper is on surface-mount interconnect fatigue failures and the critical component selected for this analysis is 80 pin plastic leaded microprocessor.

• 제어로봇시스템학회:학술대회논문집
• /
• 제어로봇시스템학회 2005년도 ICCAS
• /
• pp.2290-2295
• /
• 2005

In this paper, it is developed simulator system of 3 D.O.F parallel robot for educate of expertness. This simulator system is composed of three parts ? 3 D.O.F parallel robot, controller (hardware) and software. First, basic structure of the robot is 3 active rotary actuator that small geared step motor with fixed base. An input-link is connected to this actuator, and this input-link can connect two ball joints. Thus, two couplers can be connected to the input-link as a pair. An end-plate, which is jointed by a ball joint, can be connected to the opposite side of the coupler. A sub-link is produced and installed to the internal spring, and then this sub-link is connected to the upper and bottom side of the coupler in order to prevent a certain bending or deformation of the two couplers. The robot has the maximum diameter of 230 mm, 10 kg of weight (include the table), and maximum height of 300 mm. Hardware for control of the robot is composed of computer, micro controller, pulse generator, and motor driver. The PC used in the controller sends commands to the controller, and transform signals input by the user to the coordinate value of the robot by substituting it into equations of kinematics and inverse kinematics. A controller transfer the coordinate value calculated in the PC to a pulse generator by transforming it into signals. A pulse generator analyzes commands, which include the information received from the micro controller. A motor driver transfer the pulse received from the pulse generator to a step motor, and protects against the over-load of the motor Finally, software is a learning purposed control program, which presents the principle of a robot operation and actual implementation. The benefit of this program is that easy for a novice to use. Developed robot simulator system can be practically applied to understand the principle of parallel mechanism, motors, sensor, and various other parts.

• 대한기계학회논문집A
• /
• 제40권8호
• /
• pp.759-765
• /
• 2016

항공기 등에 사용되는 Flexible PTO(Power Take-Off) 샤프트는 스프링 특성을 좋게 하기 위해 여러장의 얇은 멤브레인을 용접한 형태로 1950년대에 이미 개발됐으며, AMAD(Aircraft Mounted Accessory Drive) 기어박스와 EMAD(Engine Mounted Accessary Drive) 기어박스 사이에서 회전동력을 전달한다. 이런 종류의 샤프트는 가볍고 특히 스프링 특성이 좋기 때문에 축 정렬이 틀어진 고속회전 상태에서도 안정적으로 회전동력을 전달할 수 있어 대부분의 전투기에 사용된다. 이번 연구에서 티타늄 합금으로 개발된 Flexible PTO 샤프트의 구조해석을 통해 제품의 안전성을 확인하였고, 실제 실험실에서 진행된 고속회전 시험에서 굽힘과 비틀림 부하를 동시에 인가하여 샤프트의 고주기 피로에 대한 내성을 실증하였다. 또한, 고주기 피로 시험 조건에서 항공기용 볼 조인트의 마모 특성 분석을 통해 수명을 예측하였다.

• 마이크로전자및패키징학회지
• /
• 제13권4호
• /
• pp.1-7
• /
• 2006

WLCSP(wafer level chip size package)는 웨이퍼 레벨에서 패키지 공정이 이루어지는 차세대 패키지 중 하나이다. WLCSP는 웨이퍼 레벨에서 패키지 공정이 이루어진다는 특징으로 인하여 웨이퍼당 생산되는 반도체 칩의 수에 따라 그 패키징 비용을 크게 줄일 수 있다는 장점이 있다. 그러나 응력 버퍼 역할을 하는 기판을 없애는 혁신적인 구조로 인하여 솔더 조인트의 신뢰성이 기존의 BGA 패키지에 비하여 취약하게 되는데, 이러한 솔더 조인트 신뢰성에 대하여 반도체 칩과 솔더볼을 연결하는 폴리머 절연층은 열팽창계수 차이에 의해 발생하는 응력을 흡수하는 중요한 역할을 하게 된다. 본 연구에서는 하이닉스에서 개발한 Omega-CSP를 사용하여 솔더볼 배열 변화와 제 1 절연층의 특성에 따른 솔더 조인트의 열피로 특성을 평가하였다. 그 결과 절연층의 특성 변화가 솔더 조인트의 열피로 특성에 주는 영향은 솔더볼 배열 구조에 따라 변화되는 것을 확인하였다.

• 대한금속재료학회지
• /
• 제49권8호
• /
• pp.635-641
• /
• 2011

The effect of high shear speed on shear force, shear energy and fracture surface was investigated for the solder joint of a $Sn-_{3.0}Ag-_{0.5}Cu$ ball. For both ENIG and OSP pads, the shear force increased with an increase in shearing speed to 0.3 m/s. However, for an ENEPIG pad, the shear force increased with an increase in shear speed to 0.6 m/s and kept almost constant afterward. The shear energy decreased with an increase in shearing speed for ENIG and OSP pads. For the ENEPIG pad, however, the shear energy almost remained constant in a shearing speed range 0.3-3.0 m/s. The fracture mode analysis revealed that the amount of brittle fracture for the ENIG and the OSP pads increased with shearing speed, and a complete brittle fracture appeared at 1.0 m/s for ENIG and 2.0 m/s for OSP. However, the ENEPIG pad showed only a ductile fracture until 0.25 m/s, and a full brittle fracture didn't occur up to 3.0 m/s. The fracture mode matched well with the shear energy. The results from the high speed shear test of SAC305 were similar to those of SAC105.

• 대한물리의학회지
• /
• 제17권1호
• /
• pp.109-116
• /
• 2022

PURPOSE: This study compared the effect of performing gastrocnemius stretching with and without the self-myofascial release of the sole on the active and passive ankle dorsiflexion angles and muscle tone of the gastrocnemius muscle in subjects with short gastrocnemius muscle. METHOD: A total of 23 subjects with short gastrocnemius muscles were included in this study. The study participants were divided into two experimental groups. Group A performed gastrocnemius muscle self-stretching exercises only, while group B performed self-myofascial release of the sole using a massage ball after the gastrocnemius muscle self-stretching exercises. For both groups, the active and passive ankle dorsiflexion angles were measured using a goniometer, and the tone of the gastrocnemius muscle was assessed using the MyotonPRO®. RESULTS: Within-group comparison showed that the participants in both groups A and B had significantly increased active and passive ankle dorsiflexion angles and decreased gastrocnemius muscle tone (p < .05) after performing their respective exercises. However, no significant differences in the said criteria were observed between groups A and B (p>.05). CONCLUSION: The results of this study showed that both methods were effective in increasing active and passive dorsiflexion angles and decreasing muscle tone. Thus, it is recommended to tailor gastrocnemius stretching exercises according to the patient's condition. If the patient does not experience discomfort in the plantar fasciae, it is recommended to perform the gastrocnemius stretching exercise only without myofascial release and use a massage ball afterward.

• 마이크로전자및패키징학회지
• /
• 제8권3호
• /
• pp.55-62
• /
• 2001

최근 전자 제품에서 사용이 폭발적으로 증가하고 있는 BGA, CSP 등의 면실장형 부품의 폭 넓은 채용에 따라서 베어 보드에서 solderability에 영향을 미치는 평탄한 표면 처리에 대한 요구는 갈수록 증가되고 있다. 무전해 Ni/Au도금 처리는 이러한 요구에 대한 해결책을 가지고 있어서 많은 전자제품에서 평탄한 표면 처리를 요구하는 응용 분야에 폭 넓게 사용되고 있다. 그러나, 무전해 Ni/Au 도금은 평탄한 표면 처리를 가지는 반면에 도금 공정에서 Ni의 산화와 적정한 P성분과 같은 몇 가지 해결요소를 가지고 있는 실정이다. 본 연구에서는 무전해 Ni/Au 도금 처리를 한 보드에서 BGA의 solderability에 미치는 영향을 사전 조사한 후, NiP 산화 특성과 보드의 휨과 간은 주요 인자를 선정하였다. 이를 위하여 먼저, 다양한 도금 조건을 가지는 테스트 보드를 제작한 후, 도금 공정에서 P성불을 감소시켜 NiP 산화 특성을 개선하였다. 또한 다양한 내층 구조와 휨 분석을 통해 내층 구조를 개선하여 보드의 휨을 최소화하였다. Solderability의 평가를 위해서 최적의 조건으로 제작된 보드에 BGA를 실장하여 보드의 휨과 도금 특성을 분석하였다. BGA의 접합부 조직은 주사 전자현미경(SEM: Scanning Electronic Microscope)과 광학 현미경(Optical Microscope)으로 관찰하였으며, 성분 분석은 EDS(Energy Dispersive Spectroscopy)를 활용하였다. 또한 기계적인 특성은 ball shear tester를 사용해서 파괴 강도와 모드를 분석하였다.

• 한국운동역학회지
• /
• 제15권1호
• /
• pp.29-44
• /
• 2005

The purpose of this study is to reveal the effects of two different kicks, the drop kick and the punt kick, into the kicking motion, through the kinetic comparative analysis of the kicking motion, which is conducted when one kicks a soccer goal. To grasp kinetic changing factors, which is performed by individual's each body segment, I connected kicking motions, which were analyzed by a two dimension co-ordination, into the personal computer to concrete the digits of it and smoothed by 10Hz. Using the smoothed data, I found a needed kinematical data by inputting an analytical program into the computer. The result of comparative analysis of two kicking motions can be summarized as below. 1. There was not a big difference between the time of the loading phase and the time of the swing phase, which can affect the exact impact and the angle of balls aviation direction. 2. The two kicks were not affected the timing and the velocity of the kicking leg's segment. 3. In the goal kick motion, the maximum velocity timing of the kicking leg's lower segment showed the following orders: the thigh(-0.06sec), the lower leg(-0.05sec), the foot(-0.018sec) in the drop kick, and the thigh(-0.06sec), the lower leg(-0.05sec), the foot(-0.015sec) in the punt kick. It showed that whipping motion increases the velocity of the foot at the time of impact. 4. At the time of impact, there was not a significant difference in the supporting leg's knee and ankle. When one does the punt kick, the subject spreads out his hip joint more at the time of impact. 5. When the impact performed, kicking leg's every segment was similar. Because the height of the ball is higher in the punt kick than in the drop kick, the subject has to stretch the knees more when he kicks a ball, so there is a significant affect on the angle and the distance of the ball's flying. 6. When one performs the drop kick, the stride is 0.02m shorter than the punt kick, and the ratio of height of the drop kick is 0.05 smaller than the punt kick. This difference greatly affects the center of the ball, the supporting leg's location, and the location of the center of gravity with the center of the ball at the time of impact. 7. Right before the moment of the impact, the center of gravity was located from the center of the ball, the height of the drop kick was 0.67m ratio of height was 0.37, and the height of the punt kick was 0.65m ratio of height was 0.36. The drop kick was located more to the back 0.21m ratio of height was 0.12, the punt kick was located more to the back 0.28m ratio of height was 0.16. 8. There was not a significant difference in the absolute angle of incidence and the maximum distance, but the absolute velocity of incidence showed a significant difference. This difference is caused from that whether players have the time to perform of not; the drop kick is used when the players have time to perform, and punt kick is used when the players launch a shifting attack. 9. The surface reaction force of the supporting leg had some relation with the approaching angle. Vertical reaction force (Fz) showed some differences in the two movements(p<0.05). The maximum force of the right and left surface reaction force (Fx) didn't have much differences (p<0.05), but it showed the tendency that the maximum force occurs before the peak force of the front and back surface (Fy) occurs.

• 마이크로전자및패키징학회지
• /
• 제12권4호통권37호
• /
• pp.289-299
• /
• 2005

실험과 비선형 유한요소해석을 병행하여, area array 패키지에서 솔더 접합부 특성을 판별하기 위한 전단시험 결과에 미치는 전단속도와 높이의 영향을 연구하였다. 전단속도의 증가와 전단높이의 감소에 따라 전단강도는 증가하는 경향을 나타내었다. 과대하게 높은 전단높이는 비정상적으로 높은 표준편차 또는 솔더볼 표면으로부터 전단 프로브의 밀림 현상과 같은 실험오차를 발생시켰다. 반면, 낮은 전단 속도는 취약한 계면 파괴나 계면에서 가장 약한 층의 판별에 있어서 유용하였다. 한편, 리플로우 회수 증가에 따른 Sn-37Pb/Cu와 Sn-3.5Ag/Cu BGA 솔더 접합부의 기계적${\cdot}$전기적 특성에 대하여 연구하였다. Cu6Sn5와 Cu3Sn으로 구성된 금속간화합물 층의 총 두께는 리플오우 시간의 1/3승에 비례하여 증가하였다. 전단 강도는 3회 또는 4회 리플로우까지 증가한 후, 이후 리플로우 회수에 비례하여 감소하는 경향을 나타내었다. 이때, 파괴는 리플로우 회수에 관계없이 솔더 내에서 발생하였다. 진기 비저항은 리플로우 회수에 비례하여 증가하였다.