• 마이크로전자및패키징학회지
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• 제14권4호
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• pp.71-77
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• 2007

본 연구에서는 리플로우 횟수를 달리하여 Sn-37Pb, Sn-3.5Ag와 Sn-3.5Ag-0.75Cu (all wt.%) BGA 솔더 접합부들을 OSP가 코팅된 Cu 패드 상에 형성시킨 후, 기계적 전기적 특성을 연구하였다. 주사전자현미경 분석 결과, 접합 계면에 생성된 $Cu_6Sn_5$ 금속간화합물 층의 두께는 리플로우 횟수가 증가함에 따라 증가하였다. Sn-Pb와 Sn-Ag-Cu 솔더 접합부의 경우, 3회 리플로우 후 최대 전단 강도를 나타내었으며, Sn-Ag 솔더 접합부의 경우 4회 리플로우 후 최대 전단 강도를 나타내었다. 이후 리플로우 횟수가 10회까지 증가함에 따라 전단 강도는 점차 감소하였다. 리플로우 횟수가 증가함에 따라 전기적 특성은 점차 감소하였다.

• 마이크로전자및패키징학회지
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• 제17권4호
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• pp.73-76
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• 2010

A two-facet approach was used to investigate the parametric performance of functional high-speed DDR3 (Double Data Rate) DRAM (Dynamic Random Access Memory) die placed in different types of BGA (Ball Grid Array) packages: wire-bonded BGA (FBGA, Fine Ball Grid Array), flip-chip (FCBGA) and lead-bonded $microBGA^{(R)}$. In the first section, packaged live DDR3 die were tested using automatic test equipment using high-resolution shmoo plots. It was found that the best timing and voltage margin was obtained using the lead-bonded microBGA, followed by the wire-bonded FBGA with the FCBGA exhibiting the worst performance of the three types tested. In particular the flip-chip packaged devices exhibited reduced operating voltage margin. In the second part of this work a test system was designed and constructed to mimic the electrical environment of the data bus in a PC's CPU-Memory subsystem that used a single DIMM (Dual In Line Memory Module) socket in point-to-point and point-to-two-point configurations. The emulation system was used to examine signal integrity for system-level operation at speeds in excess of 6 Gb/pin/sec in order to assess the frequency extensibility of the signal-carrying path of the microBGA considered for future high-speed DRAM packaging. The analyzed signal path was driven from either end of the data bus by a GaAs laser driver capable of operation beyond 10 GHz. Eye diagrams were measured using a high speed sampling oscilloscope with a pulse generator providing a pseudo-random bit sequence stimulus for the laser drivers. The memory controller was emulated using a circuit implemented on a BGA interposer employing the laser driver while the active DRAM was modeled using the same type of laser driver mounted to the DIMM module. A custom silicon loading die was designed and fabricated and placed into the microBGA packages that were attached to an instrumented DIMM module. It was found that 6.6 Gb/sec/pin operation appears feasible in both point to point and point to two point configurations when the input capacitance is limited to 2pF.

• 한국표면공학회지
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• 제36권2호
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• pp.214-225
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• 2003

Trends in microelectronics packages such as low cost, miniaturization, high performance, and high reliability made area array interconnecting technologies including flip chip, CSP (Chip Scale Package) and BGA (Ball Grid Array) mainstream technologies. Underfill technology is used for the reliability of the area array technologies, thus electronics packaging industry regards it as very important technology In this paper, the underfill technology is reviewed and the recent advances in the underfill technology including new processes and materials are introduced. These includes reworkable underfills, no-flow underfills, molded underfills and wafer - level - applied underfills.

• International journal of advanced smart convergence
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• 제8권3호
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• pp.39-45
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• 2019

This paper presents an optical technique for the three-dimensional (3D) shape inspection of micro solder balls used in ball-grid array (BGA) packaging. The proposed technique uses an optical source composed of spatially arranged light-emitting diodes (LEDs) and the results are derived based on the specular reflection characteristics of the micro solder balls for BGA A vision system comprising a camera and LEDs is designed to capture the reflected images of multiple solder balls arranged arbitrarily on a tray and the locations of the LED point-light-source reflections in each ball are determined via image processing, for shape inspection. The proposed methodology aims to determine the presence of defects in 3D BGA shape using the statistical information of the relative positions of multiple BGA balls, which are included in the image. The presence of the BGA balls with large deviations in relative position imply the inconsistencies in their shape. Experiments were conducted to verify that the proposed method could be applied to inspection without sophisticated mechanism and productivity problem.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.28-32
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• 2003

Thermo-mechanical behavior of a ceramic ball grid array(CBGA) package assembly and wire bond ball grid array(WB-PBGA) package assemblies are characterized by high sensitive moire interferometry. Moire fringe patterns are recorded and analyzed at various temperatures in a temperature cycle. Thermal-history dependent analyses of global and local deformations are presented, and bending deformation(warpage) of the package and shear strain in the rightmost solder ball are discussed. A significant non-linear global behavior is documented due to stress relaxation at high temperature. The locations of the critical solder ball in WB-PBGA package assemblies are documented.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2007년도 춘계학술대회 논문집
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• pp.383-386
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• 2007

In this study, the analysis was carried out for Electrical Discharge Machining (EDM) characteristics of the Cu electrodes by LIGA process. The shape of electrodes has 324 pins for the cavity of BGA(Ball Grid Array) type test socket mold. BGA test sockets are used in the inspection process of the semi-conductor I.C chip manufacturing. In the work, the machining performance for EDM of the electrodes was analyzed on dimensional accuracy and wear rate. The dimensional accuracy was measured for dimension of the pins, pitch size between the pins and the roundness of corner edge using optical measuring machine.

• Journal of Welding and Joining
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• 제19권4호
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• pp.406-412
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• 2001

This study is focussed on the numerical prediction of the thermal fatigue life of a ${\mu}BGA$(Micro Ball Grid Array) solder joint. Numerical method is used to perform three-dimensional finite element analysis for Sn-37mass%Pb. Sn-3.5mass%Ag solder alloys during the given thermal cycling. Strain values, along with the result of mechanical fatigue tests for solder alloys were then used to predict the solder joint fatigue life using the Coffin-Manson equation. In this study, a practical correlation for the prediction of the thermal fatigue life is suggested by using the dimensionless variable $\gamma$. As a result. it could be found that Sn-3.5mass%Ag has longer fatigue life than Sn-37mass%Pb in low cycle fatigue. In addition. the result with ${\gamm}ashow$a good agreement with the FEA results.

• 한국조명전기설비학회:학술대회논문집
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• 한국조명전기설비학회 2005년도 춘계학술대회논문집
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• pp.431-436
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• 2005

In this paper, We proposed the stereo image modeling using 2-dimensional images captured by the high resolution cameras to inspect the ball defects of BGA(Ball Grid Array) device. The proposed algorithm consists of the package/ball area extraction part, the FOV(Field of View) calibration part, the top point matching part, and ball height measurement part, In the package/ ball area extraction part, the package and ball areas are separately extracted in a left and right image by the extraction algerian. Through the experiment, we draw out the result.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2015년도 추계학술대회 논문집
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• pp.284-284
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• 2015

반도체 Ball Grid Array(BGA)에 사용되던 종래의 Solder Ball은 Sn96.3 Ag3.0 Cu0.7의 용융솔더를 이용하여 제작하고 있다. 이는 SMT Reflow공정에서 BGA Ball의 퍼짐현상으로 인해 원래의 Ball Height에 영향을 미쳐 접합불량의 원인이 되고 있다. 이러한 문제를 해결하기 위해 Copper Core Ball위에 SnAgCu 삼원합금도금공정을 이용해 문제점을 해결하고자 했으며, 본 실험을 통해 구현한 CCSB를 이용해 SMT Reflow를 진행한 결과 종래의 BGA Ball보다 우수한 효과를 확인할 수 있었다.

• Journal of Mechanical Science and Technology
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• 제18권2호
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• pp.230-239
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• 2004

A compact model approach of a network of spring elements for elastic loading is presented for the thermal deformation analysis of BGA package assembly. High-sensitivity moire interferometry is applied to evaluate and calibrated the model quantitatively. Two ball grid array (BGA) package assemblies are employed for moire experiments. For a package assembly with a small global bending, the spring model can predict the boundary conditions of the critical solder ball excellently well. For a package assembly with a large global bending, however, the relative displacements determined by spring model agree well with that by experiment after accounting for the rigid-body rotation. The shear strain results of the FEM with the input from the calibrated compact spring model agree reasonably well with the experimental data. The results imply that the combined approach of the compact spring model and the local FE analysis is an effective way to predict strains and stresses and to determine solder damage of the critical solder ball.