• 제목/요약/키워드: Bake

검색결과 139건 처리시간 0.026초

ONO 버퍼층을 이용한 Metal/Ferroelectrics/Insulator/Semiconductor 구조의 제작 및 특성 (Fabrication and Properties of Metal/Ferroelectrics/Insulator/Semiconductor Structures with ONO buffer layer)

  • 이남열;윤성민;유인규;류상욱;조성목;신웅철;최규정;유병곤;구진근
    • 한국전기전자재료학회:학술대회논문집
    • /
    • 한국전기전자재료학회 2002년도 하계학술대회 논문집
    • /
    • pp.305-309
    • /
    • 2002
  • We have successfully fabricated a Metal-Ferroelectric-Insulator-Semiconductor (MFIS) structure using Bi$\sub$4-x/La$\sub$x/Ti$_3$O$\sub$12/ (BLT) ferroelectric thin film and SiO$_2$/Nitride/SiO$_2$ (ONO) stacked buffer layers for single transistor type ferroelectric nonvolatile memory applications. BLT films were deposited on 15 nm-thick ONO buffer layer by sol-gel spin-coating. The dielectric constant and the leakage current density of prepared ONO film were measured to be 5.6 and 1.0 x 10$\^$-8/ A/$\textrm{cm}^2$ at 2MV/cm, respectively, It was interesting to note that the crystallographic orientations of BLT thin films were strongly effected by pre-bake temperatures. X-ray diffraction patterns showed that (117) crystallites were mainly detected in the BLT film if pre-baked below 400$^{\circ}C$. Whereas, for the films pre-baked above 500$^{\circ}C$, the crystallites with preferred c-axis orientation were mainly detected. From the C-V measurement of the MFIS capacitor with c-axis oriented BLT films, the memory window of 0.6 V was obtained at a voltage sweep of ${\pm}$8 V, which evidently reflects the ferroelectric memory effect of a BLT/ONO/Si structure.

  • PDF

신축공동주택에서의 실내공기 오염물질 방출 저감 프로세스에 관한 연구 (A Study on a Proper Reduction Process of Indoor Air Pollutants In Newly-Constructed Multi-Family Houses)

  • 유형규;박진철;이언구
    • 설비공학논문집
    • /
    • 제17권5호
    • /
    • pp.468-476
    • /
    • 2005
  • The purpose of this study is to investigate actual air quality in newly-constructed multi-family houses and to improve Indoor Air Quality (IAQ). The field measurement was conducted in four different newly-constructed multi-family house complexes in Seoul and one existing multi-family house complex in Kyong-gi province. The result of the measurement shows that indoor concentrations of Formaldehyde and TVOC in newly-constructed multi-family houses are much higher than the foreign standards. To establish a proper process for reducing indoor air pollutants, various experiments have been conducted; application of natural materials, bake-out practice, closure of all openings without ventilation, and use of mechanical ventilation system. The result indicates that three practices (natural materials, bakeout, mechanical ventilation) can reduce the level of indoor air pollutants almost in half during the experiments. However, each practice has its limitation and is insufficient to satisfy IAQ standards. Therefore, the study proposes a proper reduction process of indoor air pollutants which combines four different practices in time sequence.

수치해석에 의한 바닥난방공간의 온도변화에 따른 VOCs 방출속도 예측 (A Prediction of VOCs Emission Rate with Temperature Variation in Floor Heating Space by Numerical Analysis)

  • 강동화;최동희;김선숙;김영돈;여명석;김광우
    • 설비공학논문집
    • /
    • 제18권6호
    • /
    • pp.468-476
    • /
    • 2006
  • The paper deals with the numerical analysis of contaminants emission from the material affected by temperature variation in floor heating system. Considering mass transfer and heat transfer theories, a computer program for the analysis of VOCs emission was made. To demonstrate the accuracy of the numerical solution, the prediction results and the measured data were compared. Using this program, emission rates of the materials in the bakeout space and the no bake-out space were compared to estimate the variation of emission rate.

자동차용 고강도 냉연강판의 개발 및 적용현황 (Developments and applications of high strength cold rolled steel sheets for automobiles)

  • 김성주;진광근
    • 한국소성가공학회:학술대회논문집
    • /
    • 한국소성가공학회 2004년도 제5회 압연심포지엄 신 시장 개척을 위한 압연기술
    • /
    • pp.45-52
    • /
    • 2004
  • Continuing pressure for the weight reduction of vehicles and improvement of collision safety is driving the development of new high strength steel with excellent formability. The formable high strength steels which have excellent drawability have been developed and applied to the complicated inner panels. Although BH steel have mainly occupied the material market for outer panels, it is challenged by DP steel which have low yield strength and good bake hardenability. The advanced high strength steel, TRIP steels and DP steels which have excellent formability are new alternatives to conventional HSLA steel for structural parts such as members and pillars. HSLA steels also have been used for automotive bumper reinforcements due to their high yield ratio. Higher grade complex phase steel(CP) were developed for bumper reinforcements by addition of precipitation hardening to transformation strengthened steel. The usage of the advanced high strength steel ale increasing and will become the main material in structural parts near future. This paper describes the features of newly developed high strength cold rolled steels for automobiles.

  • PDF

Opaque 도재의 도포 방법에 따른 금속-도재의 결합강도에 미치는 영향에 관한 실험적 연구 (An Experimental Study on Effect on Debonding Strength of Metal-porcelain by Painting Method of Opaque Porcelain)

  • 김사학
    • 대한치과기공학회지
    • /
    • 제22권1호
    • /
    • pp.39-47
    • /
    • 2000
  • This study is the know the difference bond strength according to painting method of Opaque porcelain. Among Porcelain powder for Porcelain, Noritake powder, Bonding agent 1 class and metal are selected as Base metal alloy. And painting method of Opaque porcelain is divided by 4 groups : PG, WG, NG and DG. Also it is to manufacture 24 sheets of Specimen by 6 each every method and to measure Crack-initiation Strength of Metal-porcelain and it is to observe it by Scanning electron microscope. I come to get a conclusion as follows. 1. As for Debonding strength of every experiment groups, it showed that WS group which executed Wash bake had highest value, 44.25MPa and NG group which used Normal powder had value, 42.11MPa and DG group which used Bonding agent had value, 35.88MPa and PG group which used Paste opaque had value, 35.39MPa. 2. In four painting methods of Opaque porcelain, PG group, WG group, NG group and DG group, there is no significant difference statistically in Crack-initiation Strength. 3. As a result of observing fracture surface with Scanning electron microscope, it was showde that PG group remained a lot of particle of porcelain on the surface of metal than WG group, NG group and DG group.

  • PDF

재생시멘트의 품질향상을 위한 제조방법에 관한 연구 (An Experimental Study of the Recycled Cement Manufacturing Method for Improving the Material Quality)

  • 오상균
    • 한국건축시공학회지
    • /
    • 제4권2호
    • /
    • pp.143-149
    • /
    • 2004
  • The recycle of domestic waste concrete is, however, still in an early stage, and it has been only partially being used for the road fillers. As a counter-plan of activating recycled concrete, we have confirmed the hydration possibility of the waste concrete powder from the experiment on recycling the aggregate powder since 2000. Though that study, we have known that the strength is increasing when the baking time is longer, and baking temperature maintain in $700^{\circ}C$. Also, the quality is lowered because of the fine aggregate powder which has a bad influence on flowability & compression strength by adhesion of mortar on the aggregate face. Therefore, mortar and interfacial separation of aggregate are large in proper quality for concrete recycling is expected that affect. The purpose of this study is to investigate effective aggregate separation and to determine the most suitable production method controlling the duration of baking time for recycled cement from the compressive strength, X-ray diffraction and ingredient analysis test.

전기오븐의 강제대류 열전달 특성 연구 (A numerical analysis of forced convection heat transfer in an electric oven)

  • 노선종;조성호;김형식;곽동성
    • 한국전산유체공학회:학술대회논문집
    • /
    • 한국전산유체공학회 2011년 춘계학술대회논문집
    • /
    • pp.124-128
    • /
    • 2011
  • The heat transfer rate in an oven is very important for the quality of cooking food. For a robust performance design in an electric oven, forced convection has been used rather than natural convection, in bake and convection mode. Forced convection heat trans for in a vented electric oven has been numerically evaluated using the commercial software FLUENT. CFD modeling of the electric oven involves three-dimensional, steady state, MRF fan model and DO radiation model. In this study, the electric oven cavity and fan modules are not simplified. Other research shows that the boundary condition can often lead to non-physical solutions, such as reverse flaw at the top vent. To remove this non-physical solution, control volume has been expanded at the nearby vent. This numerical analysis has been performed with dedicated experimental support. The results show that there is less than a 2.2% difference between the simulation and experimental data for the temperature profile of food. From this research we can use this oven simulation technique to make a better convection system in an electric oven.

  • PDF

감광성 BCB를 이용한 절연막층에서의 비아형성 (Via Formation in Dielectric Layers Made of Photosensitive BCB)

  • 주철원;임성훈;한병성
    • 한국전기전자재료학회논문지
    • /
    • 제14권5호
    • /
    • pp.351-355
    • /
    • 2001
  • Via for achieving reliable fabrication of MCM(Multichip Module) substrate was formed on photosensitive BCB layer. The MCM substrate consists of photosensitive BCB(Benzocyclobutene) interlayer dielectric and copper conductors. In order to form the vias in the photosensitive BCB layer, the process of forming the BCB layer and its via forming plasma etch using C$_2$F$\_$6//O$_2$ gas were evaluated. The thickness of the BCB layer after hard bake was shrunk down to 40% of the original. The resolution of vias formed on the BCB was 15㎛ and the slope after develop was 85 degree. AES analysis was done on two vias, one is etched in C$_2$F$\_$6/O$_2$ gas and the other isnot etched. On the via etched in C$_2$F$\_$6//O$_2$, native C was detected and the amount of native C was reduced after Ar sputter. On the via not etched in C$_2$F$\_$6//O$_2$, organic C was detected. As a result of AES, BCB residue was not removed by Ar sputter, so plasma etch is necessary for achieving reliable vias.

  • PDF

KMPR을 이용한 다층구조물 제작 및 전해도금을 이용한 니켈몰드 제작 (Fabrication of the multi-layer structure and Nickel mold with electroforming using KMPR)

  • 황성진;정필구;고정상;고종수;정임덕;김인곤
    • 한국정밀공학회:학술대회논문집
    • /
    • 한국정밀공학회 2006년도 춘계학술대회 논문집
    • /
    • pp.143-144
    • /
    • 2006
  • In this paper, we proposed XP KMPR-1050 negative tone resist to replace SU-8 resist for multi-layer micro-structures and thick plating mold fabrication using UV-LIGA process. XP KMPR resist proposed in this paper can be easily striped using a common stripping solution such as NMP without damage of micro-structure. The conditions for the fabrication of XP KMPR micro-structure were optimized by adjustment of exposure and post-exposure bake(PEB). The $140{\mu}m$ -thick and an aspect ratio at least 10 micro-structure and multi-layer structures were successfully fabricated through the process conditions. Through-mold electroplating and PR striping of XP KMPR has been successfully demonstrated.

  • PDF

진공패키지에 의해 조립된 볼로미터 적외선 센서의 특성

  • 한명수;김진혁;신광수;김효진;김선훈;고항주
    • 한국진공학회:학술대회논문집
    • /
    • 한국진공학회 2010년도 제39회 하계학술대회 초록집
    • /
    • pp.241-241
    • /
    • 2010
  • 적외선 센서는 빛의 유무에 관계없이 물체 또는 인체에서 발산하는 적외선을 감지한다. 이러한 센서를 전자 및 디스플레이 시스템과 연동하면 열영상 시스템이 되는데, 이는 전방 감시, 플랜트 감시, 보안, 방범용으로 많이 사용되며, 특히 자동차 야간 운전자 보조용으로 사용되어 최첨단, 고부가가치를 지니고 있는 핵심부품이다. 비냉각형 적외선 센서인 마이크로볼로미터는 상온에서 작동하므로 극저온 Cooler가 불필요하며, 무게와 부피가 작아 각종 시스템에 부착가능하다. 특히 볼로미터형 적외선 센서는 용량이 적은 TE cooler로 상온으로 안정화를 시키며, 진공으로 유지되는 금속 또는 세라믹 패키지를 사용하게 된다. 본 연구에서는 마이크로 볼로미터용 진공패키지를 제작하여 패키지 조립 및 측정기술에 대해 조사하였다. 패키지는 금속재질인 kovar를 사용하여 제작되었고, 내부에 TE Cooler와 장수명 진공유지를 위한 getter, 그리고 온도센서 및 볼로미터 센서 칩을 장착하여 조립하였다. 패키지 Cap ass'y와 base envelop의 솔더링 공정은 약 $200^{\circ}C$에서 수행하였으며, evacuation system을 이용하여 5일 동안 패키지 bake-out 공정을 수행하였다. 이 후 getter를 활성화시키고, seal-off 공정으로 진공 기밀을 유지하였다. 진공 패키지의 기밀성은 $6{\times}10^{-9}\;std.cm^3/sec$로 기밀성을 유지하였다. 볼로미터 센서의 반응도는 $10^2\;V/W$ 이상을 나타내었으며, 탐지도는 $2{\times}10^8\;cm-Hz^{1/2}/W$를 나타내었다.

  • PDF