Proceedings of the Korean Society of Precision Engineering Conference (한국정밀공학회:학술대회논문집)
- 2006.05a
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- Pages.143-144
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- 2006
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- 2005-8446(pISSN)
Fabrication of the multi-layer structure and Nickel mold with electroforming using KMPR
KMPR을 이용한 다층구조물 제작 및 전해도금을 이용한 니켈몰드 제작
- Hwang Sung-Jin (Mech. Eng. Dept., PNU) ;
- Jung Phill-Gu (Mech. Eng. Dept., PNU) ;
- Ko Jeung-Sang (Mech. Eng. Dept., PNU) ;
- Ko Jong-Soo (Mech. Eng. Dept., PNU) ;
- Jeong Im-Deok (Interdisciplinary program in Microelectromechanicalsystems, PNU) ;
- Kim In-Gon (Dept. of Advanced Materials Eng, Dongeui University)
- 황성진 (부산대학교 기계공학부) ;
- 정필구 (부산대학교 기계공학부) ;
- 고정상 (부산대학교 기계공학부) ;
- 고종수 (부산대학교 기계공학부) ;
- 정임덕 (부산대학교 미세기계전자시스템 협동과정) ;
- 김인곤 (동의대학교 신소재공학과)
- Published : 2006.05.01
Abstract
In this paper, we proposed XP KMPR-1050 negative tone resist to replace SU-8 resist for multi-layer micro-structures and thick plating mold fabrication using UV-LIGA process. XP KMPR resist proposed in this paper can be easily striped using a common stripping solution such as NMP without damage of micro-structure. The conditions for the fabrication of XP KMPR micro-structure were optimized by adjustment of exposure and post-exposure bake(PEB). The
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