Polishing Behavior and Characterization of Cu Surface in Citric Acid based Slurry with Corrosion Inhibitor (BTA) (부식방지제(BTA)가 첨가된 Cu CMP 슬러리에서의 연마거동과)
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- Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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- 2005.07a
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- pp.42-43
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- 2005