A Study on the Corrosion Effects by Addition of Complexing Agent in the Copper CMP Process |
Kim, Sang-Yong
(PE CMP Team, Dongbu-Anam Semiconductor, Inc.)
Kim, Nam-Hoon (School of Electrical and Electronics Engineering, Chung-Ang University) Kim, In-Pyo (School of Electrical and Electronics Engineering, Chung-Ang University) Chang, Eui-Goo (School of Electrical and Electronics Engineering, Chung-Ang University) Seo, Yong-Jin (Department of Electrical Engineering, Daebul University) Chung, Hun-Sang (Department of Electrical Engineering Chosun University) |
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2 | G. Popescum, M. Lauwidjaja, L. Denny, and K. Richardson, 'Aging effect in CMP slurries probed by multiple light scattering', Electrochem. Soc. Proc., Vol. 98, p. 59, 1999 |
3 | S. Y. Kim, J. H. Lim, C. H. Yu, N. H. Kim, and E. G. Chang, 'Roles of Phosphohc Acid in Slurry for Cu and TaN CMP', Trans. on EEM, Vol. 4, No. 2, p. 1, 2003 |
4 | S. Y. Kim, W. S. Lee, and Y. J. Seo, 'Reduction ofplasma process induced damage during HDP IMD deposition', Trans. on EEM, Vol. 3, No. 3, p. 14, 2002 |
5 | C.-J. Park, S.-Y. Kim, and Y.-J. Seo, 'Effects of diluted silica slurry and abrasives on the CMP characteristics', J. of KIEEME(in Korean), Vol. 15, No.10,p.851,2002 |
6 | S. Y. Kim and H. S. Chung, 'A study on characterization and modeling of shallow trench isolation in oxide chemical mechanical polishing' Trans. Joumal of electrical and electronic Materials, Vo1. 2, No. 3, P. 24, 2001 |
7 | S. Y. Kim, J. H. Lim, C. H. Yu, N. H. Kim, and E. G Chang, 'Roles of phosphoric acid in slurry for Cu and TaN CMP', Trans. on EEM, Vol. 4, No. 2, p.I, 2003 |
8 | T.-H. Kim, W.-S. Lee, Y.-J. Seo, C.-I. Kim, and E.-G. Chang, 'A study for global planarization of mltilevelmtal by CMP', J. of KIEEME(m Korean), Vol. 11, No. 12, p. 1084, 1998 |
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