• 한국전기전자재료학회논문지
• /
• 제29권12호
• /
• pp.750-758
• /
• 2016

For the channel doping of shallow junction and retrograde well formation in CMOS, indium can be implanted in silicon. The retrograde doping profiles can serve the needs of channel engineering in deep MOS devices for punch-through suppression and threshold voltage control. Indium is heavier element than B, $BF_2$ and Ga ions. It also has low coefficient of diffusion at high temperatures. Indium ions can be cause the erode of wafer surface during the implantation process due to sputtering. For the ultra shallow junction, indium ions can be implanted for p-doping in silicon. UT-MARLOWE and SRIM as Monte carlo ion-implant models have been developed for indium implantation into single crystal and amorphous silicon, respectively. An analytical tool was used to carry out for the annealing process from the extracted simulation data. For the 1D (one-dimensional) and 2D (two-dimensional) diffused profiles, the analytical model is also developed a simulation program with $C^{{+}{+}}$ code. It is very useful to simulate the indium profiles in implanted and annealed silicon autonomously. The fundamental ion-solid interactions and sputtering effects of ion implantation are discussed and explained using SRIM and T-dyn programs. The exact control of indium doping profiles can be suggested as a future technology for the extreme shallow junction in the fabrication process of integrated circuits.

• 한국재료학회지
• /
• 제33권1호
• /
• pp.15-20
• /
• 2023

'Tracers' are bullets that emit light at the backside so that the shooter can see the trajectory of their flight. These light-emitting bullets allow snipers to hit targets faster and more accurately. Conventional tracers are all combustion type which use the heat generated upon ignition. However, the conventional tracer has a fire risk at the impact site due to the residual flame and has a by-product that can contaminate the inside of the gun and lead to firearm failure. To resolve these problems, it is necessary to develop non-combustion-type tracers that can convert heat to luminance, so-called 'thermoluminescence (TL)'. Here, we highly improve the thermoluminescence properties of MgB₄O₇ through co-doping of Dy³⁺+Ce³⁺ and Dy³⁺+Na⁺. The presence of doping materials (Dy³⁺, Ce³⁺, Na⁺) was confirmed by XPS (X-ray photoelectron spectroscopy). The as-synthesized co-doped MgB₄O₇ was irradiated with a specific radiation dose and heated to 500 ℃under dark conditions. Different thermoluminescence characteristics were exhibited depending on the type or amounts of doping elements, and the highest luminance of 370 cd/m² was obtained when Dy 10 % and Na 5 % were co-doped.

• 한국초전도학회:학술대회논문집
• /
• 한국초전도학회 2006년도 High Temperature Superconductivity Vol.XVI
• /
• pp.97-97
• /
• 2006

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
• /
• pp.592-592
• /
• 2013

We synthesized BiOI nanostructures with various doped-concentrations of Ag (0.1, 1.0, 5.0, 10.0 mol%) and Ti (1.0, 5.0, 10.0, 30.0, 50.0 mol%). They show spherical echinoid-like structures examined by scanning electron microscope. The BET surface areas were measured to be in the range of 40~70 $m^2$/g, which is reduced by doping. The indirect band gap was estimated to be 1.8 eV for undoped BiOI with no change and 1.0 eV increase upon Ag and Ti doping, respectively. The structures were further examined by X-Ray diffraction analysis, FT-IR, and photoluminescence. We also demonstrated adsorption and photocatalytic degradation performances for methyl orange and Rhodamine B on the echinoid-like BiOI structures.

• 한국세라믹학회지
• /
• 제52권5호
• /
• pp.331-337
• /
• 2015

$LaBO_3$ (B = Cr, Mn, Fe, Co, and Ni) perovskites, the most common perovskite-type mixed ionic-electronic conductors (MIECs), are promising candidates for intermediate-temperature solid oxide fuel cell (IT-SOFC) cathodes. The catalytic activity on MIEC-based cathodes is closely related to the bulk ionic conductivity. Doping B-site cations with other metals may be one way to enhance the ionic conductivity, which would also be sensitively influenced by the chemical composition of the dopants. Here, using density functional theory (DFT) calculations, we quantitatively assess the activation energies of bulk oxide ion diffusion in $LaBO_3$ perovskites with a wide range of combinations of B-site cations by calculating the oxygen vacancy formation and migration energies. Our results show that bulk oxide ion diffusion dominantly depends on oxygen vacancy formation energy rather than on the migration energy. As a result, we suggest that the late transition metal-based perovskites have relatively low oxygen vacancy formation energies, and thereby exhibit low activation energy barriers. Our results will provide useful insight into the design of new cathode materials with better performance.

• 한국자기학회:학술대회 개요집
• /
• 한국자기학회 2015년도 임시총회 및 하계학술연구발표회
• /
• pp.92-94
• /
• 2015

• 대한약학회:학술대회논문집
• /
• 대한약학회 2000년도 춘계총회 및 학술대회
• /
• pp.158.2-158.2
• /
• 2000

• 한국자기학회지
• /
• 제16권3호
• /
• pp.168-172
• /
• 2006

졸-겔(sol-gel) 방법을 이용하여 제작된 산소결핍(oxygen vacancy)들을 내포하는 Ni 도핑된 루타일(rutile) 구조의 $TiO_{2-{\delta}}$ 박막들에 대하여 그 자기적 성질 및 관련된 전자구조적 성질에 대하여 조사분석 하였다. $TiO_{2-{\delta}}$:Ni 박막들에서 상온 강자성이 관측되었으며 Ni 도핑량이 증가할수록 포화 자화량($M_s$)이 점차 감소하여 6 at% 이상에서 일정한 값으로 유지되었다. 이와 같은 Ni 도핑량 6 at% 이하에서의 강자성 현상은 산소결핍 자리에 속박된 전자를 매개로 그 주위에 존재하는 불순물 이온들의 자기 능률들이 강자성 정렬을 이루게 되는 자기 폴라론(magnetic polaron)의 형성에 의한 것으로 해석된다. 소량의 Ni 도핑 시 각 이온당 최대 $3.7{\mu}_B/Ni$의 큰 $M_s$ 값이 나타났으며 6 at% 이상에서의 일정한 $M_s$ 값은 Ni cluster 형성에 의한 것으로 해석된다. 이와 같은 Ni cluster의 존재는 시료들에 대한 Hall 측정 결과 나타난 Ni 도핑량 증가에 따르는 p-n 전도성 전이를 설명하여 줄 수 있다.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2009년도 제38회 동계학술대회 초록집
• /
• pp.322-322
• /
• 2010

For boron doping on n-type silicon wafer, around $1,000^{\circ}C$ doping temperature is required, because of the relatively low solubility of boron in a crystalline silicon comparing to the phosphorus case. Boron doping by fiber laser annealing and lamp furnace heat treatment were carried out for the uniformly deposited p-a-Si:H layer. Since the uniformly deposited p-a-Si:H layer by cluster is highly needed to be doped with high temperature heat treatment. Amorphous silicon layer absorption range for fiber laser did not match well to be directly annealed. To improve the annealing effect, we introduce additional lamp furnace heat treatment. For p-a-Si:H layer with the ratio of $SiH_4:B_2H_6:H_2$=30:30:120, at $200^{\circ}C$, 50 W power, 0.2 Torr for 30 min. $20\;mm\;{\times}\;20\;mm$ size fiber laser cut wafers were activated by Q-switched fiber laser (1,064 nm) with different sets of power levels and periods, and for the lamp furnace annealing, $980^{\circ}C$ for 30 min heat treatment were implemented. To make the sheet resistance expectable and uniform as important processes for the $p^+$ layer on a polished n-type silicon wafer of (100) plane, the Q-switched fiber laser used. In consequence of comparing the results of lifetime measurement and sheet resistance relation, the fiber laser treatment showed the trade-offs between the lifetime and the sheet resistance as $100\;{\omega}/sq.$ and $11.8\;{\mu}s$ vs. $17\;{\omega}/sq.$ and $8.2\;{\mu}s$. Diode level device was made to confirm the electrical properties of these experimental results by measuring C-V(-F), I-V(-T) characteristics. Uniform and expectable boron heavy doped layers by fiber laser and lamp furnace are not only basic and essential conditions for the n-type crystalline silicon solar cell fabrication processes, but also the controllable doping concentration and depth can be established according to the deposition conditions of layers.

• 대한전자공학회논문지SD
• /
• 제43권11호
• /
• pp.1-7
• /
• 2006

이상적인(ideal) 이중-게이트(double-gate) 벌크(bulk) FinFET의 3차원(3-D) 시뮬레이션을 수행하여 전기적 특성들을 분석하였다. 3차원 시뮬레이터를 이용하여, 게이트 길이($L_g$)와 높이($H_g$), 핀 바디(fin body)의 도핑농도($N_b$)를 변화시키면서 소스/드레인 접합 깊이($X_{jSDE}$)에 따른 문턱전압($V_{th}$), 문턱전압 변화량(${\Delta}V_{th}$), DIBL(drain induced barrier lowering), SS(subthreshold swing)의 특성들을 살펴보았다. 게이트 높이가 35 nm인 소자에서 소스/드레인 접합 깊이(25 nm, 35 nm, 45 nm) 변화에 따라, 각각의 문턱전압을 기준으로 게이트 높이가 $30nm{\sim}45nm$로 변화 될 때, 문턱전압변화량은 20 mV 이하로 그 변화량이 매우 적음을 알 수 있었다. 낮은 핀 바디 도핑농도($1{\times}10^{16}cm^{-3}{\sim}1{\times}10^{17}cm^{-3}$)에서, 소스/드레인 접합 깊이가 게이트전극보다 깊어질수록 DIBL과 SS는 급격히 나빠지는 것을 볼 수 있었고. 이러한 특성저하들은 $H_g$ 아래의 ${\sim}10nm$ 위치에 국소(local) 도핑을 함으로써 개선시킬 수 있었다. 또한 local 도핑으로 소스/드레인 접합 깊이가 얕아질수록 문턱전압이 떨어지는 것을 개선시킬 수 있었다.