• THE INTERNATIONAL COMMERCE & LAW REVIEW
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• v.30
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• pp.123-144
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• 2006

MERCOSUR (Southern Cone Common Market, Latin American trade organization established in 1991, full members: Argentina, Brazil, Paraguay, and Uruguay; associate members: Bolivia, Chile, Colombia, Ecuador, Peru, and Venezuela) is the world's third largest economic union. It is a vital region that Korean corporations should enter to preoccupy the Latin American market. Since China and Japan are recently moving strongly to advance into MERCOSUR, Korea needs to work out measures to cope with the situation. In trading with MERCOSUR, it is very important to establish a strategic base in the market from a long-term perspective rather than to approach the market only as an exporting market. From this viewpoint, Korea should regard MERCOSUR as a market with which it should cooperate in terms of resources, beyond a market from which it imports raw materials. Helped by its advancement strategies varying according to regional markets and price competitiveness, China is bolstering its market share in these regions. In addition, China has built production bases focused on electric and electronics products. It is also increasing its investments in MERCOSUR as a stable raw material-providing base. To make inroads into MERCOSUR successfully, therefore, Korean enterprises should not regard it as a market where it disposes of stock goods, but should instead export technologically competitive goods to this region. Likewise, Korean companies should expand their investments in automotive parts and machinery in MERCOSUR. Furthermore, Korea should closely study international trading policies of MERCOSUR to clear away any possible obstacles of exports to this region and to prepare countermeasures so as to avoid possible damage from import regulations of MERCOSUR.

• JSTS:Journal of Semiconductor Technology and Science
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• v.16 no.5
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• pp.595-604
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• 2016

Utilizing a standard 130-nm CMOS process, a RF frontend is designed at 24 GHz for automotive collision avoidance radar application. Single IF direct conversion receiver (DCR) architecture is adopted to achieve high integration level and to alleviate the DCR problem. The proposed frontend is composed of a two-stage LNA and downconversion mixers. To save power consumption, and to enhance gain and linearity, stacked NMOS-PMOS $g_m$-boosting technique is employed in the design of LNA as the first stage. The switch transistors in the mixing stage are biased in subthreshold region to achieve low power consumption. The single balanced mixer is designed in PMOS transistors and is also realized based on the well-known folded architecture to increase voltage headroom. This frontend circuit features enhancement in gain, linearity, and power dissipation. The proposed circuit showed a maximum conversion gain of 19.6 dB and noise figure of 3 dB at the operation frequency. It also showed input and output return losses of less than -10 dB within bandwidth. Furthermore, the port-to-port isolation illustrated excellent characteristic between two ports. This frontend showed the third-order input intercept point (IIP3) of 3 dBm for the whole circuit with power dissipation of 6.5 mW from a 1.5 V supply.

• Transactions of Materials Processing
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• v.23 no.8
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• pp.495-500
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• 2014

Magnesium alloys are currently expected to be widely used for weight reduction of cars and as high efficient materials in the automotive and electronics industries. Although the specific strength of magnesium is excellent, it cannot be easily formed at room temperature due to its HCP structure. However in order to improve the formability of magnesium, it is necessary to investigate its formability in the warm temperature range. In the current study, the aim was to add to the magnesium property database so that the mass production of a magnesium car body can be accomplished. Warm tensile tests were conducted and the forming limit diagram was determined to confirm formability characteristics of magnesium AZ31B alloy sheet. In addition the bending formability and the magnesium damping capacity were evaluated for AZ31B and compared to SPRC440E which is a sheet steel used for car bodies.

• Transactions of the Korean hydrogen and new energy society
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• v.26 no.2
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• pp.184-191
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• 2015

As the power electronics system increases the frequency, the power loss and thermal management are paid more attention. This research presents a real time model of dissipation power with junction temperature response for 120kw IGBT inverter which is applied to the thermal management of high power IGBT inverter. Since the computational time is critical for real time simulation, look-up tables of IGBT module characteristic curve are implemented. The power loss from IGBT provides a clue to calculate the temperature of each module of IGBT. In this study, temperature of each layer in IGBT is predicted by lumped capacitance analysis of layers with convective heat transfer. The power loss and temperature of layers in IGBT is then communicated due to mutual dependence. In the dynamic model, PWM pulses are employed to calculation real time IGBT and diode power loss. Under Matlab/Simulink$^{(R)}$ environment, the dynamic model is validated with experiment. Results showed that the dynamic response of power loss is closely coupled with effective thermal management. The convective heat transfer is enough to achieve proper thermal management under guideline temperature.

• JSTS:Journal of Semiconductor Technology and Science
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• v.14 no.3
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• pp.274-283
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• 2014

In this paper, the epi layer of npn SOI HBT with n+ buried layer has been studied through Sentaurus process and device simulator. The doping value of the deposited epi layer has been varied for the npn HBT to achieve improved $f_tBV_{CEO}$ product (397 GHzV). As the $BV_{CEO}$ value is higher for low value of epi layer doping, higher supply voltage can be used to increase the $f_t$ value of the HBT. At 1.8 V $V_{CE}$, the $f_tBV_{CEO}$ product of HBT is 465.5 GHzV. Further, the film thickness of the epi layer of the SOI HBT has been scaled for better performance (426.8 GHzV $f_tBV_{CEO}$ product at 1.2 V $V_{CE}$). The addition of this HBT module to fully depleted SOI CMOS technology would provide better solution for realizing wireless circuits and systems for 60 GHz short range communication and 77 GHz automotive radar applications. This SOI HBT together with SOI CMOS has potential for future high performance SOI BiCMOS technology.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.3
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• pp.25-35
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• 1999

LTCC (Low Temperature Cofired Ceramic) or LTCC-M (Low Temperature Cofired ceramic on Metal) technology is one of MCM-C (Multichip Module on Ceramic) technologies and becomes to be widely used in consumer, RF and automotive electronics. As green sheets for LTCC are cofired below $1000^{\circ}C$ in comparison with those for HTCC (High Temperature Cofired Ceramic), high conductivity metal traces such as gold, silver and copper can be used. The dimensional stability in LTCC-M technology enables embedded passives to be integrated inside modules, which enhances the electrical performance and increases the reliability of the modules. Coefficient of thermal expansion and dielectric constant can be controlled by changing composition and heating profile for cofiring. In this technical review, LTCC and LTCC-M technologies are introduced and advantages of those technologies are explained.

• Journal of Mechanical Science and Technology
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• v.17 no.9
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• pp.1249-1260
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• 2003

This present work focuses on the influence of nonlinearities associated with impact on the rocking behavior of a rigid body block subjected to a two-dimensional excitation in the horizontal and vertical directions. The nonlinearities in rocking system are found to be strongly dependent on the impact between the block and the base that abruptly reduces the kinetic energy. In this study, the rocking systems of the two types are considered : The first is an undamped rocking system model that disregards the energy dissipation during the impact and the second is a damped rocking system, which incorporates energy dissipation during the impact. The response analysis is carried out by a numerical method using a non-dimensional rocking equation in which the variations in the excitation levels are considered. Chaos responses are observed over a wide range of parameter values, and particularly in the case of large vertical displacements, the chaotic characteristics are observed in the time histories, Poincare sections, the power spectral density and the largest Lyapunov exponents of the rocking responses. Complex behavior characteristics of rocking responses are illustrated by the Poincare sections.

• Journal of the Korean Society for Precision Engineering
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• v.32 no.6
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• pp.509-515
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• 2015

Recent trends to reduce the size of mobile electronics products have driven miniaturization of various components, including screw parts for assembling components. Considering that the size reduction of screws may degenerate their joining capabilities, the size reduction should not be limited to the thread region but should be extended to its head region. The screw head is usually manufactured by forging in which a profiled punch presses a billet so that plastic deformation occurs to form the desired shape. In this study, finite element (FE) analysis was performed to simulate the forging process of a subminiature screw; a screw head of 1.7 mm diameter is formed out of a 0.82 mm diameter billet. The FE analysis result indicates that this severe forging condition leads to a generation of folding defects. FE analyses were further performed to find appropriate punch design parameters that minimize the amount of folding defects.

• Journal of IKEEE
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• v.24 no.2
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• pp.665-668
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• 2020

When a node in automotive CAN bus is hacked, such node should be blocked to prevent severe danger in the car. In order to do that, such node should be uniquely identified. However, there is no way to identify individual nodes in a CAN bus. In this paper, a physical layer security method is proposed where individual nodes are identified by assigning unique ID to the nodes during booting process. The proposed method was implemented in a CAN controller using Verilog HDL, and it is verified that the node ID auto-setting and internal attack defense are successfully performed.

• Design & Manufacturing
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• v.14 no.1
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• pp.15-21
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• 2020

Smart systems in different application areas such as automotive, medical and consumer electronics require a novel manufacturing method of electronic, optical and mechanical functions into products. Traditional methods including mechanical assembly, bonding of plastic and electronic circuit cause the problems in large size of products and complicated manufacturing processes. In this study, thermoforming and film insert molding were applied to fabricate a dome shaped plastic part embedded with electronic circuits. The deformation of patterns printed on PET film was predicted by thermoforming simulation using T-SIM, and the results were compared with those by experiment. In order to decrease spring-back after thermoforming, the Taguchi method of design of experiment was used. Through ANOVA analysis, it was found that mold temperature was the most dominant parameter for spring-back. By using flow analysis, gate design was performed to decrease injection pressure. During film insert molding, the wash-out of ink printed on film occurred for Polycarbonate. When the resin was changed to PMMA, the wash-out disappeared due to low melt temperature.