• Nuclear Engineering and Technology
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• 제52권9호
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• pp.2034-2040
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• 2020

The gas evolution from mixtures consisting of 0.2 M solution of N,N,N',N'-tetra-n-octyldiglycolamide (TODGA) in n-alcohol (n-decanol or n-nonanol) with Isopar-M diluent was investigated during thermal oxidation. The effect of ionizing radiation on their thermal stability has been studied. It has been determined that the volume of gaseous thermolysis products increases by 260% in the case of n-nonanol and 80% in the case of n-decanol compared to non-irradiated solutions. It has been shown that the gas evolution rate and gas volume increase when the irradiated mixture saturated with nitric acid is heated. However, there are no prerequisites for the development of autocatalytic oxidation.

• 대한전기학회논문지
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• 제40권6호
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• pp.574-581
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• 1991

Damage in film capacitors has been investigated, using FTIR and ESCA, aiming to elucidate the nature of electrode removal and the possibility of base films to be damaged. Also, tests were conducted to investigate the effect of a long-term thermal aging at elevated temperatures. Unsuccessful clearing or grape-clustering processes can induce a long-term degradation which involves the chemical and morphological changes. Major changes are the oxidation and the decrease in surface crystallinity possibly arising from the corona discharge. An immediate deterioration of BOPP film may occur when the air entrapped between the film layers induces an extensive autocatalytic oxidative degradation. This type of immediate damage may result in a premature failure at an early stage of qualification test. As far as the nature of electrode removal is concerned, a permanent removal of electrode materials was observed in the main erosion area.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1993년도 한국자동제어학술회의논문집(국제학술편); Seoul National University, Seoul; 20-22 Oct. 1993
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• pp.48-53
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• 1993

In this paper, it is shown that chaotic nonlinear chemical process can be controlled based on the Poincare map based control algorithm. An isothermal autocatalytic CSTR, which has chaotic dynamics, is successfully controlled and period 2 orbit is generated in a normal chaotic region with small perturbation of the control parameter.

• 한국인쇄학회지
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• 제21권1호
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• pp.21-34
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• 2003

Acid amplifiers derived from a certain class of sulfonates suffer from autocatalytic decomposition in the presence of a strong acid to give corresponding sulfonic acid, which catalyze the composition of the parent sulfonates, leading to the liberation of more of the same sulfonic acids in an exponential manner. In this research we synthesized and evaluated 4-hydroxy-4'-(2-trifluoromethyl)benzenesulfonyloxy isopropylidene dicyclohexane (1), 4,4'-di-(2-trifluoromethyl)benzenesulfonyloxy isopropylidene dicyclohexane (2), 4-hydroxy-4'-(3-trifluoromethyl)benzenesulfonyloxy isopropylidene dicyclohexane (3) and 4,4-di-(3-trifluoromethyl)benzenesulfonyloxy isopropylidene dicyclohexane (4) as novel acid amplifiers with electron withdrawing group. These acid amplifiers (1-4) showed reasonable thermal stability for resist processing temeprature and exhibited higher photosensitivity compared to poly(tert-butyl methacrylate) film without acid amplifiers. Application of acid amplifiers to photofunctional materials, including photoresists, are described as a consequence of the combination of the acid amplifiers with photoacid generator.

• Journal of Advanced Marine Engineering and Technology
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• 제39권5호
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• pp.516-521
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• 2015

This study is about a hydrogen mitigation system in a containment building like an offshore or a nuclear plant. A hydrogen explosion is possibly happened after condensation of steam if hydrogen releases with steam in a containment buildings. Passive autocatalytic recombiner is the one of the measures, but the performance of this equipment is not sure because the distribution of hydrogen is very irregular and is not predicted correctly. This study proposes a new approach for improving the hydrogen removing performance with hydrogen-guiding property. The steam is simulated and analysed. The results show that the shallow air containment reduced over 55% of the released hydrogen and the deep air containment type reduces over 80% of released hydrogen.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 1999년도 제30회 추계학술대회
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• pp.49-56
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• 1999

A material was formulated with Phenol novolac and HEXA only. The cure kinetics and thermal characteristics of phenol novolac with various HEXA contents were peformed by differential scanning calorimetry and thermal gravimetric analysis. All kinetic parameters of the curing reaction including the reaction order, activation energy, and rate constant were calculated and reported. The results indicate that the curing reaction goes through an autocatalytic kinetic mechanism. The friction and wear characteristics of this material were determined using friction material testing machine. The friction coefficient of phenol novolac with various HEXA contents was determined using the PV(pressure & velocity) factor. The most stable and highest friction coefficient with a various pressure and velocity condition was found at HEXA 10 wt.% material. The specific wear rate per unit sliding distance with a various HEXA contents was reported.

• Nuclear Engineering and Technology
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• 제50권8호
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• pp.1421-1425
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• 2018

The dynamics of gas release at thermal oxidation of extraction systems on the basis of diamides of dicarbonic acids in fluorinated sulphones with 14 mol/L $HNO_3$ was investigated. The effect of preirradiation of the mixtures with accelerated electrons on the kinetics of their thermolysis was determined. The mixtures were heated in an autoclave at temperatures of 170 and $200^{\circ}C$ and irradiated using an electron accelerator to absorbed doses of 0.1, 0.5, and 1.0 MGy. It has been shown that no conditions for autocatalytic oxidation at thermolysis of extraction mixtures irradiated up to a dose of 1 MGy were developed.

• 한국표면공학회지
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• 제55권5호
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• pp.299-307
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• 2022

Gold plating is used as a coating of connector in printed circuit boards, ceramic integrated circuit packages, semiconductor devices and so on, because the film has excellent electric conductivity, solderability and chemical properties such as durability to acid and other chemicals. In most cases, internal connection between device and package and external terminals for connecting packaging and printed circuit board are electroless Ni-P plating followed by immersion Au plating (ENIG) to ensure connection reliability. The deposition behavior and film properties of electroless Au plating are affected by P content, grain size and mixed impurity components in the electroless Ni-P alloy film used as the underlayer plating. In this study, the correlation between electroless nickel plating used as a underlayer layer and cyanide-free electroless Au plating using thiomalic acid as a complexing agent and aminoethanethiol as a reducing agent was investigated.

• Nuclear Engineering and Technology
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• 제54권9호
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• pp.3580-3585
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• 2022

The thermal stability of carbohydrazide, hydrazine nitrate, acetohydroxamic acid in nitric acid solutions has been studied at atmospheric pressure and above atmospheric pressure. The volumes of gaseous products of thermolysis and the maximum rate of gas evolution have been determined at atmospheric pressure. It has been shown that, despite the high rate of gas evolution and large volumes of evolved gases, the conditions for the development of autocatalytic oxidation are not created. Exothermic processes are observed in a closed vessel in the temperature range of 50-250 ℃. With an increase in the concentration of nitric acid, the temperatures of the onset of exothermic effects for all mixtures decrease, and the values of the total thermal effects of reactions increase, to the greatest extent for solutions with carbohydrazide.

• 한국표면공학회지
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• 제55권4호
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• pp.202-214
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• 2022

Internal connections between device, package and external terminals for connecting packaging and printed circuit board are normally manufactured by electroless Ni-P plating followed by immersion Au plating (ENIG process) to ensure the connection reliability. In this study, a new non-cyanide-based immersion and electroless Au plating solutions using thiomalic acid as a complexing agent and aminoethanethiol as a reducing agent was investigated on different underlayer electroless Ni-P plating layers. As a result, it was confirmed that the deposition behavior and film properties of electroless Au plating are affected by grain size and impurity of the electroless Ni-P film, which is used as the plating underlayer. Au plating on the electroless Ni-P plating film with a dense surface structure showed the highest bonding strength. In addition, the electroless Au plating film on the Ni-P plating film has a smaller particle size exhibited higher bonding strength than that on the large particle size.