• Journal of the Korean Vacuum Society
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• v.1 no.1
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• pp.100-105
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• 1992

Auger electron spectroscopy (AES) and X-ray photoelectron spectroscopy (XPS) analyses have been performed on double-structured Au/V and Au/Ti thin films after heat treatment at 500$^{\circ}$C in air. V- and Tiunderlays sandwiched between gold thin films and SiOz substrates form oxides on the free surface of gold films during the heat treatment. The chemical compositions of the oxides were identified as V205 and TiOz in Au/V and Au/Ti thin films, respectively.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.271-271
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• 2013

The defect states of a Ar-sputtered SiO2 surface on Si (001) were investigated using Auger electron spectroscopy (AES) and reflection electron energy loss spectroscopy (REELS). The REELS spectra at the primary electron energy of 500 eV showedthat three peaks at 2.5, 5.1, and 7.2 eV were found within the band gap after sputtering. These peaks do not appear at the primary electron energies of 1,000 and 1,500 eV, which means that the defect states are located at the extreme surface of a SiO2/Si thin film. According to the calculations, two peaks at 7.2 and 5.1 eV are related to neutral oxygen vacancies. However, the third peak at 2.5 eV has never been previously reported and the theories proposed that this defect state may be due to Si-Si bonding. Our Auger data showed that a peak for Si-Si bonding at 89 eV appears after Ar ion sputtering on the surface of the sample, which is consistent with the theoretical models.

• Journal of the Semiconductor & Display Technology
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• v.2 no.4
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• pp.31-35
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• 2003

We present a formation technique of thin film heater for heat transfer components. Thin film structures of Cr-Si have been prepared on top of alumina substrates by magnetron sputtering. More samples of Mo thin films were prepared on silicon oxide and silicon nitride substrates by electron beam evaporation technology. The electrical properties of the thin film structures were measured up to the temperature of $500^{\circ}C$. The thickness of the thin films was ranged to about 1 um, and a post annealing up to $900^{\circ}C$ was carried out to achieve more reliable film structures. In measurements of temperature coefficient of resistance (TCR), chrome-rich films show the metallic properties; whereas silicon-rich films do the semiconductor properties. Optimal composition between Cr and Si was obtained as 1 : 2, and there is 20% change or less of surface resistance from room temperature to $500^{\circ}C$. Scanning electron microscopy (SEM) and Auger electron spectroscopy (AES) were used for the material analysis of the thin films.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.39 no.9
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• pp.1-10
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• 2002

We have done various treatments of indium tin oxide (ITO) surface for organic light-emitting diodes (OLEDs), and investigated the surface states by different surface treatments using atomic force microscopy (AFM) and Auger electron spectroscopy (AES). We have fabricated OLEDs deposited by ultra-high vacuum molecular beam deposition system and studied the characteristics of the OLEDs. We have observed the dramatical improvement of the performance of OLEDs fabricated on ITO substrates treated by $O_2$ plasma treatment reduces the carbon comtamination of ITO surfaces and increases the work function of ITO.

• The Transactions of the Korean Institute of Electrical Engineers
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• v.41 no.8
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• pp.875-882
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• 1992

Titanium carbide(TiC) films, known as having excellent characteristics of resistance to wear and corrosion, were deposited on SUS-304 sheets using HCD(Hollow Cathode Discharge) reactive ion plating with acetylene gas as the reactant gas. The characteristics of TiC films were examined by X-ray diffraction, micro-Vickers hardness tester, ${\alpha}$-step, SEM(Scanning Electron Spectroscopy), ESCA(Electron Spectroscopy for Chemical Analysis), and AES(Auger Electron Spectroscopy) and the results were discussed with regard to the changes of various deposition conditions(bias voltage, acetylene flow rate, temperature).

• Journal of the Korean Vacuum Society
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• v.4 no.S1
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• pp.28-33
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• 1995

TiN 박막은 저온(<$500^{\circ}C$), 저압(1Torr)에서 Tetrakis(diethylamido)titanium[TDEAT, Ti(NEt2)4]single precursor를 사용하여 증착하였다. 증차고딘 박막은 SEM(Scanning Electron Microscopy)으로 surface morphology와 step coverage를 측정하였고, TEM(Transmission Electron Microscopy)분석결과 microcrystalline의 TiN을 확인하였다. XPS(X-ray Photoelectron Spectroscopy)분석결과에 따르면 $200-500^{\circ}C$구간에서는 $\beta$-hydogen elimination에 의한 반응이 일어나고 $600-700^{\circ}C$구간에서는 thermal decomposition에 의한 반응이 일어나고 있음을 알 수 있다. Carbon과 oxygen의 농도는 AES(Auger Electron Spectroscopy)를 사용하여 측정하였으며 온도가 감소할수록 carbon의 농도가 감소하는 경향을 보여주고 있다.

• Journal of the Korean Vacuum Society
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• v.4 no.1
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• pp.51-59
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• 1995

(001)방향 GaAs 기판과 Si/Co 박막의 계면반응 및 상평형에 관한 연구를 300-$700^{\circ}C$ 열처리 구간에서 행하였다. 반응에 의한 상전이 과정은 glancing angle X-ray diffraction(GXRD), Auger electron spectroscopy(AES) 및 cross-sectional transmission electron microscopy(GXRD), Auger electron spectroscopy(AES) 및 corss-sectional transmission electron microscopy(XTEM)을 이용하여 분석하였다. Si/Co/GaAs계의 계면반응에서 Co는 $380^{\circ}C$에서 GaAs 기판 및 Si와 반응하여 Co2GaAs과 Co2Si상을 형성하였다. $420^{\circ}C$에서 열처리 후, Co층은 모두 소모되었으며 단면구조는 Si/CoSi/CoGa(CoAs)/Co2GaAs/GaAs으로 전이되었다. $460^{\circ}C$까지 온도를 올려 계속적인 반응을 일으키면 CoGa와 CoAs이 분해되면서 CoSi가 성장하였고, $600^{\circ}C$에서는 Co2GaAs마저 분해되고 CoSi상이 성장하여 GaAs와 계면을 형성하였다. CoSi와 GaAs사이의 계면은 $700^{\circ}C$의 고온까지 안정하였으며 이러한 계면반응 결과는 계산에 의하여 구한 Si-Co-Ga-As 4원계 상태도로부터 이해될 수 있었다.

• Journal of the Korean Vacuum Society
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• v.16 no.3
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• pp.205-209
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• 2007

ZnO thin films were deposited on a Si wafer and a soda lime glass using atomic layer deposition(ALD). The substrate temperature were between $130^{\circ}C{\sim}150^{\circ}C$. The deposition rate of the ZnO film was measured to be $2.72{\AA}$ per cycle. The films were analyzed using field emission scanning electron microscopy(FESEM), X-ray diffractometer(XRD), and Auger electron spectroscopy(AES). Impurity-free ZnO thin films were obtained and the crystallinity was found to be dependant upon the substrate temperature.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.1
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• pp.15-20
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• 2004

The interfacial layer between the oxide film and the metal film according to RTP annealing temperature of metal film has been studied. Two types of oxides, BPSG and PETEOS, were used as a bottom layer under multi-layered metal films. We observed the interface between oxide and metal films using SEM (scanning electron microscopy), TEM (transmission electron microscopy), AES (auger electron spectroscopy). Bonding failure was occurred by interfacial reaction between the BPSG oxide and the multi-layered metal films above $650^{\circ}C$ RTP anneal. The phosphorus accumulation layer was observed at interface between BPSG oxide and metal films by AES and TEM measurements. On the other hand, bonding was always good in the sample using PETEOS oxide as a bottom layer. We have known that adhesion between BPSG and multi-layered metal films was improved when the sample was annealed below $650^{\circ}C$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1989.06a
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• pp.83-86
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• 1989

Lead titanate thin films with a perovskite structure were successfully structure were successfully fabricated on titanium substrate by Chemical Vapour Deposition(CVD). Analyses of Auger Electron Spectroscopy(AES) and X-ray Photoelectron Spectroscopy (XPS) have been performed in order to find a chemical composition of lead titanate films. The analysis of chemical composition by AES and XPS was investigated for variations of deposition temperature and Ti(C$_2$H$_{5}$O)$_4$ fractions. The chemical composition of PbTiO$_3$by XPS analysis was almost constant regardless of deposition parameters and the comparison of chemical composition by AES and XPS was performed.d.