• Journal of the Mineralogical Society of Korea
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• v.6 no.2
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• pp.94-104
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• 1993

The compositional variation of electrums from gold-silver and antimony deposits in the Dunjeon Baegjeon mining area, range from 22.6 to 69.5 atom% of Ag. Ag contents in electrums vary with paragenetic sequences and associated minerals. Ag contents increase from core to margin in a single grain. Compositional range of electrums from the North ore deposits of the Dunjeon gold mine are from 22.6 to 29.5 atom% of Ag. Electrums contain Cu(0.40 to 0.55 atom%) and Bi(0.35 to 0.67 atom%). Composition of electrums from the South ore deposits of the Dunjeon gold mine vasies from 33.6 to 69.5 atom% of Ag. Cu and As contents in electrums range from 0.20 to 1.92 and from 0.70 to 1.90 atom%, respectively. As the content of Ag in electrums increase, the contents of Bi and As in electrums increase but that of Cu decrease. Electrums of the Baegjeon gold deposits contain 35.6 to 63.5 atom% of Ag, suggesting that Au contents in electrums associated with base metal sulfied be higher than those associate with Ag-minerals. Ag/Au rations in electrums increase with decreasing temperature, salinity and $fs_2$ of the mineralizing solution.

• Bulletin of the Korean Chemical Society
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• v.33 no.8
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• pp.2609-2612
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• 2012

A simple green method was developed for rapid synthesis of silver and gold nanoparticles (AgNPs and AuNPs) has been reported using Lonicera japonica flower extract as a reducing and a capping agent. AgNPs and AuNPs were carried out at $70^{\circ}C$. The successful formation of AgNPs and AuNPs have been confirmed by UV-Vis spectro photometer, fourier transform infrared spectroscopy (FTIR), X-ray diffraction (XRD), energy dispersive X-ray Analysis (EDAX), scanning electron microscopy (SEM) and high-resolution transmission electron microscopy (HRTEM). To our knowledge, this is the first report where Lonicera japonica flower was found to be a suitable plant source for the green synthesis of AgNPs and AuNPs.

• Journal of Welding and Joining
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• v.20 no.6
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• pp.59-59
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• 2002

Sn-Ag-Cu solder is known as most competitive in many kinds of Pb-free solders. In this study, effects of solderability with plated layers such as Cu, Cu/Sn, Cu/Ni and Cu/Ni/Au were investigated. Sn-3.5Ag-0.7Cu solder balls were reflowed in commercial reflow machine (peak temp. : 250℃ and conveyer speed : 0.6m/min). In wetting test, immersion speed was 5mm/sec., immersion time 5sec., immersion depth 4mm and temperature of solder bath was 250℃. Wettability of Sn-3.5Ag-0.7Cu on Cu, Cu/Sn (5㎛), Cu/Ni (5㎛), and Cu/Ni/Au (5㎛/500Å) layers was investigated. Cu/Ni/Au layer had the best wettability as zero cross time and equilibrium force, and the measured values were 0.93 sec and 7mN, respectively. Surface tension of Sn-3.5Ag-0.7Cu solder turmed out to be 0.52N/m. The thickness of IMC is reduced in the order of Cu, Cu/Sn, Cu/Mi and Cu/Ni/Au coated layer. Shear strength of Cu/Ni, Cu/Sn and Cu was around 560gf but Cu/Ni/Au was 370gf.

• Journal of Welding and Joining
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• v.20 no.6
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• pp.783-788
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• 2002

Sn-Ag-Cu solder is known as most competitive in many kinds of Pb-free solders. In this study, effects of solderability with plated layers such as Cu, Cu/Sn, Cu/Ni and Cu/Ni/Au were investigated. Sn-3.5Ag-0.7Cu solder balls were reflowed in commercial reflow machine (peak temp.:$250^{\circ}C$and conveyer speed:0.6m/min). In wetting test, immersion speed was 5mm/sec., immersion time 5sec., immersion depth 4mm and temperature of solder bath was $250^{\circ}C$. Wettability of Sn-3.5Ag-0.7Cu on Cu, Cu/Sn ($5\mu\textrm{m}$), Cu/Ni ($5\mu\textrm{m}$), and Cu/Ni/Au ($5\mu\textrm{m}/500{\AA}$) layers was investigated. Cu/Ni/Au layer had the best wettability as zero cross time and equilibrium force, and the measured values were 0.93 sec and 7mN, respectively. Surface tension of Sn-3.5Ag-0.7Cu solder turmed out to be 0.52N/m. The thickness of IMC is reduced in the order of Cu, Cu/Sn, Cu/Mi and Cu/Ni/Au coated layer. Shear strength of Cu/Ni, Cu/Sn and Cu was around 560gf but Cu/Ni/Au was 370gf.

• Bulletin of the Korean Chemical Society
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• v.24 no.6
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• pp.739-743
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• 2003

New quaternary compounds $ANb_2PS_{10}$ (A = Na, Ag) and $AuNb_4P_2S_{20}$ were synthesized and characterized. The structures of three compounds consist of one-dimensional infinite chains built by [$Nb_2S_{12}$] and [$PS_4$] units. Cation atoms are occupied within the van der Waals gap of sulfur atoms between infinite chains to make -S…$M^+$…S- contacts. There is only one Au atom site and so crystallographically a unit cell contains four equivalent Au atoms in $AuNb_4P_2S_{20}$. This is only the half of the numbers of Na or Ag atoms in $NaNb_2PS_{10}$ or $AgNb_2PS_{10}$. The ratio between $Nb_2PS_{10}$ matrix vs the cation is, therefore, 1 : 1 for Ag and Na, but it is 2 : 1 for Au. Mixed valency in Au or Nb was expected to balance the charge in the latter compound. The electronic structures calculated based on the extended Huckel tight-binding method show that $ANb_2PS_{10}$ (A = Ag, Na) are semiconducting, while $AuNb_4P_2S_{20}$ is metallic, which is not consistent with the experimental results of these three compounds that all exhibit semiconducting property. The result of calculation suggests that $AuNb_4P_2S_{20}$ might be a magnetic insulator. Magnetic measurement experiment exactly proved that the compound is a Slater antiferromagnetic material with the Neels' temperature of 45 K. It is recognized, therefore, that electronic structure analysis is very useful to understand the properties of compounds.

• Resources Recycling
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• v.27 no.6
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• pp.23-29
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• 2018

Recently rapid economic growth and technological development have led to an increase in the generation of waste electrical and electronic equipment (WEEE). As the amount of electric and electronic waste generated increases, the importance of processing waste printed circuit boards (PCB) is also increasing. Various studies have been conducted to recycle various valuable metals contained in a waste PCB in an environmentally friendly and economical manner. To get anode slime containing Ag and Au, Anode copper prepared from PCB scraps was used by means of electro-refining. Ag and Au recovery was conducted by leaching, direct reduction, and ion exchange method. In the case of silver, the anode slime was leached at 3 M $HNO_3$, 100 g/L, $70^{\circ}C$, and Ag was recovered by precipitation, alkali dissolution, and reduction method. In the case of gold, the nitrate leaching residues of the anode slime was leached at 25% aqua regia, 200 g/L, $70^{\circ}C$, and Au was recovered by pH adjustment, ion exchange resin adsorption, desorption and reduction method. The purity of the obtained Au and Ag were confirmed to be 99.99%.

• Journal of Welding and Joining
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• v.29 no.6
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• pp.65-70
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• 2011

The effect of flip chip bonding parameters on formation of intermetallic compounds (IMCs) between Au stud bumps and Sn-3.5Ag solder was investigated. In this study, flip chip bonding temperature was performed at $260^{\circ}C$ and $300^{\circ}C$ with various bonding times of 5, 10, and 20 sec. AuSn, $AuSn_2$ and $AuSn_4$ IMCs were formed at the interface of joints and (Au, Cu)$_6Sn_5$ IMC was observed near Cu pad side in the joint. At bonding temperature of $260^{\circ}C$, $AuSn_4$ IMC was dominant in the joint compared to other Au-Sn IMCs as bonding time increased. At bonding temperature of $300^{\circ}C$, $AuSn_2$ IMC clusters, which were surrounded by $AuSn_4$ IMC, were observed in the solder joint due to fast diffusivity of Au to molten solder with increased bonding temperature. Bond strength of Au stud bump joined with Sn-3.5Ag solder was about 23 gf/bump and fracture mode of the joint was intergranular fracture between $AuSn_2$ and $AuSn_4$ IMCs regardless bonding conditions.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.98-103
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• 2002

BGA(Ball Grid Array) 패키지의 솔더볼 패드 중의 하나인 Au/Ni-Co/Cu 금속층 위에 Bi가 첨가된 Sn-3.5Ag-$\chi$Bi 솔더볼을 리플로우시켰다. 리플로우한 후 130 $^{\circ}C$에서 열처리함에 따른 계면상 및 솔더 내부의 상변화를 관찰하였다. 계면에는 (Ni,Co)$_3$Sn$_4$외에 (Au,Ni,Co,Bi)Sn$_4$가 생성되었음을 관찰할 수 있었고, 솔더 내부에는 (Au,Ni,Co,Bi)SH$_4$, Ag$_3$Sn, Bi 상이 혼재되어 있었다. Nano-indentation에 의한 경도 측정 결과, Bi 함량 증가에 따라 경도는 증가하였으나, 볼전단(Ball Shear) 테스트 결과는 Bi가 증가됨에 따라 오히려 볼전단 강도값이 감소하였다. 이는 파면 검사 결과, 파괴 경로가 주로 계면의 금속간 화합물과 솔더 사이에서 진행함에 기인한 것이다. 솔더 내부의 파괴 경로를 가진 2.5Bi가 가장 우수한 볼전단 강도값을 나타내었는데, 이는 솔더내의 Bi의 고용강화에 기인한 것으로 보인다.

• Journal of Electrochemical Science and Technology
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• v.12 no.3
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• pp.308-316
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• 2021

In this work, we report synthesis, characterization and corrosion inhibition properties of cationic thiol surfactant-capped silver (SC-Ag-NPs) and gold (SC-Au-NPs) nanoparticles. SC-Ag-NPs and SC-Au-NPs were characterized using regular techniques include TEM. Corrosion study was carried out using carbon steel (CS) in 3.5% NaCl aqueous solution and characterized using multiple electrochemical techniques. Our results suggest that the paint containing SC-Ag-NPs and SC-Au-NPs endow efficient corrosion protection to the CS. Especially, SC-Au-NPs based paint form a stronger barrier between the metal and the corrosive ions, leading to better inhibition properties.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.11
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• pp.88-93
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• 2017

It is important to develop a simple method oftuning localized surface plasmon resonance(LSPR) properties, due to their numerous applications. In addition, the careful examination of the shape, size and combination of metal nanoparticles is useful for understanding the relation between the LSPR properties and metal nanostructures. This article describes the dependence of theLSPR properties on the arrays of metal nanoparticles obtained from a block copolymer(BCP) micellar thin film. Firstly, two different Au nanostructures, having a dot and ring shape, were fabricated using conventional block copolymer micelle lithography. Then, Ag was plated on the Au nanostructures through the silver mirror reaction technique to obtain Au/Ag bimetallic nanostructures. During the production of these metallic nanostructures, the processing factors, such as the pre-treatment by ethanol, silver mirror reaction time and removal or not of the BCP, were varied. Once the Au nanoparticles were synthesized, Ag was properly plated on the Au, providing two distinguishable characteristic plasmonic bands at around 525nm for Au and around 420nm for Ag, as confirmed bythe UV-vis measurements. However, when a small amount of Au seed nanoparticles, which accelerate the Ag plating speed,was formed by usinga block copolymer with a relatively highmolecular weight, all of the Au surfaces were fully covered by Ag during the silver mirror reaction, showing only the characteristic peak for Ag at around 420nm. The Ag plating technique on Au nanoparticles pre-synthesized from a block copolymer is useful to study the LSPR properties carefully.