• 한국세라믹학회지
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• 제40권12호
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• pp.1197-1201
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• 2003

대기 중에서 침전이 생기지 않고 코팅에 적합한 나노크기 Au 미립자가 분산된 ZrO$_2$ 용액을 제조하여, 딥-코팅법으로 SiO$_2$ 유리기판 위에 박막을 제조했다. 이 박막을 열처리하여 열분석, 엑스선 회절분석, 분광분석, 원자력간 현미경, 주사전자현미경 및 투과전자현미경 관찰 등을 통하여 박막의 특성을 조사하였다. ZrO$_2$ 박막은 50$0^{\circ}C$에서 정방정상으로 결정전이가 관찰되었고, 박막의 두께는 약 100nm였다. 분산된 입자의 크기는 약 15∼40nm이며, 표면 거칠기는 0.84nm로 우수한 막질을 나타냈다. 그리고 Au 입자의 표면플라즈마 공명에 의한 흡수피크를 630∼670nm 파장범위에서 확인할 수 있었다.

• 청정기술
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• 제20권2호
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• pp.141-145
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• 2014

본 연구에서는 자기조립다층박막을 활용하여 금 나노막대와 유기염료로 이루어진 복합체의 형성과 나노막대-염료간의 광학적 특성에 관한 연구를 진행하였다. 이를 위해 이온성 고분자로는 폴리아릴아민 하이드로클로라이드와 폴리스티렌 술폰산염을 선택하였으며, 나노막대와의 스펙트럼 중첩을 고려하여 유기염료는 로다민 비 이소디오시아네이트를 사용하였다. 자기조립적인 관점에서는 수용액상에서 이들 화합물을 순차적으로 금 나노막대 표면에 코팅시킴으로써 표면 플라즈몬 특성과 형광특성을 동시에 갖는 조립체를 형성하였으며, 그 후 금 나노막대를 화학적으로 제거 해나가면서 나노막대-염료간의 상호의존 특성을 연구하였다.

• Applied Science and Convergence Technology
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• 제26권3호
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• pp.47-49
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• 2017

Photocurrent enhancement has been investigated in monolayer (1L) $MoS_2$ with PbS quantum dots (QDs). A metal-semiconductor-metal (Au-1L $MoS_2$-Au) junction device is fabricated using a standard photolithography method. Considerably improved photo-electrical properties are obtained by coating PbS QDs on the Au-1L $MoS_2$-Au device. Time dependent photoconductivity and current-voltage characteristics are investigated. For the QDs-coated $MoS_2$ device, it is observed that the photocurrent is considerably enhanced and the decay life time becomes longer. We propose that carriers in QDs are excited and transferred to the $MoS_2$ channel under light illumination, improving the photocurrent of the 1L $MoS_2$ channel. Our experimental findings suggest that two-dimensional layered semiconductor materials combined with QDs could be used as building blocks for highly-sensitive optoelectronic detectors including radiation sensors.

• Transactions on Electrical and Electronic Materials
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• 제10권3호
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• pp.85-88
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• 2009

This report demonstrates the immobilization of uniformly sized gold nanoparticles (AuNPs) on UV cross-linked poly(4-vinylpyridine) (P4VP) polymer thin films and the preparation of micropatterned structures of AuNPs on these films. The polymer thin films were prepared by a spin-coating of P4VP onto a cleaned silicon wafer surface. Upon UV irradiation, these films were then photo cross-linked. Gold nanoparticles were immobilized by immersing the polymer surface in a colloidal solution of gold nanoparticles stabilized by citric acid. The morphology of the films and the immobilization of AuNPs were studied by atomic force microscopy (AFM) and UV-visible spectroscopic techniques. The micropatterned gold structures that were produced on the polymer surface are delineated by combining with the photolithographic method. While untreated and simply spin coated films were physisorbed and unstable that could be easily removed by rinsing with a solvent, the cross-linked and AuNPs immobilized P4VP films were found to be highly stable even after repeated solvent extractions.

• 한국전기전자재료학회논문지
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• 제20권12호
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• pp.1044-1048
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• 2007

With development of electronic products the demands for miniaturization and weight-lightening have increased until a recent date. Accordingly, The effort to substitute glass substrates was widely made. However, polymer substrates have weak point that substrates were damaged at high temperature. In this paper, we deposited transparent conductive film at low temperature. And we inserted Au thin film between oxide to compensate for deteriorated electrical characteristics. Ga-doped ZnO(GZO) multilayer coatings were deposited on glass substrate by DC sputtering. The optimization of deposition conditions of both AZO and Au layers were performed to obtain better electrical and optical characteristics in advance. We presumed that the properties of multilayer were affected by the deposition process of both GZO and Au layers. The best multilayer coating exhibited the resistivity of $2.72{\times}10^{-3}\;{\Omega}-cm$ and transmittance of 77 %. From these results, we can confirm a possibility of the application as transparent conductive electrodes.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.450-455
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• 2002

Cu-cored Sn-Ag solder balls were fabricated by coating pure Sn and Ag on Cu balls. The melting behavior and the solderability of the BGA joint with the Ni/Au coated Cu pad were investigated and were compared with those of the commercial Sn-Ag and Sn-Ag-Cu balls. DSC analyses clarified the melting of Cu-cored solders to start at a rather low temperature, the eutectic temperature of Sn-Ag-Cu. It was ascribed to the diffusion of Cu and Ag into Sn plating during the heating process. After reflow soldering the microstructures of the solder and of the interfacial layer between the solder and the Cu pad were analyzed with SEM and EPMA. By EDX analysis, formation of a eutectic microstructure composing of $\beta$-Sn, Ag$_3$Sn, ad Cu$_{6}$Sn$_{5}$ phases was confirmed in the solder, and the η'-(Au, Co, Cu, Ni)$_{6}$Sn$_{5}$ reaction layer was found to form at the interface between the solder and the Cu pad. By conducting shear tests, it was found that the BGA joint using Cu-cored solder ball could prevent the degradation of joint strength during aging at 423K because of the slower growth me of η'-(Au, Co, Cu, Ni)$_{6}$Sn$_{5}$ reaction layer formed at the solder, pad interface. Furthermore, Cu-cored multi-component Sn-Ag-Bi balls were fabricated by sequentially coating the binary Sn-Ag and Sn-Bi solders on Cu balls. The reflow property of these solder balls was investigated. Melting of these solder balls was clarified to start at the almost same temperature as that of Sn-2Ag-0.75Cu-3Bi solder. A microstructure composing of (Sn), Ag$_3$Sn, Bi and Cu$_{6}$Sn$_{5}$ phases was found to form in the solder ball, and a reaction layer containing primarily η'-(Au, Co, Cu, Ni)$_{6}$Sn$_{5}$ was found at the interface with Ni/Au coated Cu pad after reflow soldering. By conducting shear test, it was found that the BGA joints using this Cu-core solder balls hardly degraded their joint shear strength during aging at 423K due to the slower growth rate of the η'-(Au, Cu, Ni)$_{6}$Sn$_{5}$ reaction layer at the solder/pad interface.he solder/pad interface.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.74-79
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• 2000

In an attempt to estimate the wetting properties of wettable metal layers by wetting balance method, an analysis of wetting curves of the coating layer was performed. Based on the analysis, wetting properties of UBM-coated Si-plate were estimated by the new wettability indices. The wetting curves of the one and both sides-coated UBM layers have the similar shape and show the similar tendency to the temperature. So the wetting property estimation of one side coating is possible with wetting balance method. For UBM of Si-chip, Cr/Cu/Au UBM is better than Ti/Ni/Au in the point of wetting time. At general reflow temperature, the wettability of high melting point solders(Sn-Sb, Sn-Ag) is better than that of few melting point ones(Sn-Bi, Sn-In).The contact angle of the one side coated plate to the solder can be calculated from the farce balance equation by measuring the static state force and the tilt angle.

• 한국표면공학회지
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• 제55권2호
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• pp.102-119
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• 2022

Gold plating is used as a coating of connecter in printed circuit boards, ceramic integrated circuit packages, semiconductor devices and so on, because the film has excellent electric conductivity, solderability and chemical properties such as durability to acid and other chemicals. As increasing the demand for miniaturization of printed circuit boards and downsizing of electronic devices, several types of electroless gold plating solutions have been developed. Most of these conventional gold plating solutions contain cyanide compounds as a complexing agent. The gold film obtained from such baths usually satisfies the requirements for electronic parts mentioned above. However, cyanide bath is highly toxic and it always has some possibility to cause serious problems in working environment or other administrative aspects. The object of this investigation was to develop a cyanide-free electroless gold plating process that assures the high stability of the solution and gives the excellent solderability of the deposited film. The investigation reported herein is intended to establish plating bath composition and plating conditions for electroless gold plating, with thiomalic acid as a complexing agent. At the same time, we have investigated the solution stability against nickel ion and pull strength of solder ball. Furthermore, by examining the characteristics of the plated Au plating film, the problems of the newly developed electroless Au plating solution were improved and the applicability to various industrial fields was examined. New type electroless gold-plating bath which containing thiomalic acid as a complexing agent showing so good solution stability and film properties as cyanide bath. And this bath shows the excellent stability even if the dissolved nickel ion was added from under coated nickel film, which can be used at the neutral pH range.

• 한국콘텐츠학회논문지
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• 제10권10호
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• pp.219-225
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• 2010

티타늄 표면처리방법 중 gold 코팅, TiN 코팅, 그리고 전용결합재를 복합적으로 사용하여 티타늄과 세라믹의 결합강도에 미치는 영향을 분석하고자 하였다. 티타늄과 세라믹의 3점 굽힘 결합강도를 측정한 결과, TiN 코팅과 전용결합재로 처리한 SPTB군이 $72.20({\pm}5.25)MPa$로 가장 높게 나타났으며, 전용결합재로 처리한 SPB군($67.66({\pm}12.10)MPa$), gold 코팅과 전용결합재로 처리한 SPGB군($46.95({\pm}12.48)MPa$), 코팅과 전용결합재로 처리하지 않은 SP군$(43.80({\pm}5.12)MPa)$ 순으로 나타났다. 시편들의 결합강도를 통계 분석한 결과, 전용 결합재로 처리한 SPB군과 TiN코팅과 전용결합재로 처리한 SPTB군이 결합력이 유사하게 나타났으며, 전용결합재로 처리한 군(SPB)이 처리하기 않은 군(SP)에 비하여 결합력이 높게 나타났으며, TiN 코팅한 군(SPTB)이 gold 코팅한 군(SPGB)에 비하여 결합력이 높게 나타난 것으로 관찰되었다.

• 대한치과보철학회지
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• 제33권4호
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• pp.645-661
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• 1995

As the mechanical property of composite resin improved, composite resin has been widely used esthetic dentistry. In the field of esthetic dentistry, the color of prosthetic material is very important. The purpose of this study was to evaluate the color difference of specimens, by the types of alloys and gold electrodeposit. Experimental groups were as follows : Group Prec : Au-Pt alloy with no gold coating and no resin veneer. Group Semi : Pd-Ag alloy with no gold coating and no resin veneer. Group BAse : Ni-Cr alloy with no gold coating and no resin veneer. Group Gsem : Pd-Ag alloy with no gold coating and no resin veneer. Group Gbas : Ni-Cr alloy with no gold coating and no resin veneer. Group PreR : Resin veneer on the Pd-Ag alloy without gold coating. Group SemR : Resin veneer on the Pd-Ag alloy without gold coating. Group GbsR : Resin veneer on the Ni-Cr alloy with gold coating Group BasR : Resin veneer on the Ni-Cr alloy without gold coating. In this study, colors of metal surfaces and veneered resins were evaluated by the CIE $L^{*}a^{*}b$ system. The results obtained were as follows : 1. different alloy types and gold coating make the $L^{*}a^{*}b$ system. 2. The ${\Delta}E^*$ab value between groups semi and Base was less than 1.5 and there was no $a^*$ and $b^*$ value difference between groups Gsem and Gbas 3. The values of $L^*$ and $a^*$ ain groups GsemR and GbasR were so similar that the ${\Delta}E^*$ab value was as small as 0.58. 4. In resin specimens with gold coated semiprecious or base alloys showed yellower and redder deviation than the resin specimens with precious alloy. 5. The ${\Delta}E^*$ab values between goups PreR-GsemR and groups PreR-GbasR were as small as 2.68 and 2.22 respectively.