• Proceedings of the KWS Conference
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• 2002.10a
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• pp.469-474
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• 2002

Laser and hot air reflow soldering of PBGA solder ball was investigated. Experimental results showed that surface quality and shear strength of solder bumps reflowed by laser was superior than the solder bumps reflowed by hot air, and the microstructure inside the solder bumps reflowed by laser was much finer. Analysis on interfacial reaction showed that eutectic solder reacted with Au/Ni/Cu pad shortly after the solder was melted. Interface of solder bump reflowed by laser consists of a continuous AuSn$_4$ layer and remnant Au element. Needle-like AuSn$_4$ grew sidewise from interface, and then spread out to the entire interface region. A thin layer of Ni$_3$Sn$_4$ intermetallic compound was found at the interface of solder bump reflowed by hot air, AuSn$_4$ particles distributed inside the whole solder bump randomly. It is the combination effect of the continuous AuSn$_4$ layer and finer eutectic microstructure inside the solder bump reflowed by laser that resulted in higher shear strength.

• Korean Journal of Mineralogy and Petrology
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• v.33 no.3
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• pp.243-250
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• 2020

The purpose of this study is to find out the possibility of applying microwave-hypochlorous acid leaching to effectively leaching Au in hydrothermal minerals on board. The comparative leaching experiment were confirmed that the leaching rate of Au with(T1)/with out(T2) of microwave nitric acid leaching. In addition, the leaching rate of Au on the conventional leaching by mechanical agitation(T3) and microwave leaching was compared. The result of microwave nitric acid leaching(solid-liquid ratio; 10%, leaching temperature; 90 ℃, leaching time; 20 min) confined that the metal leaching rate was high in the order of As>Pb>Cu>Fe>Zn, and the content of Au in the leaching residue was increased from 33.77 g/ton to 60.02 g/ton. As a result of the comparative leaching experiment using a chloride solvent, the dissolution rate of Au was high in the order of T1(61.10%)>T3(53.30%)>T2(17.30%). Therefore, chloride, which can be manufactured using seawater and that can be recycled by collecting chlorine gas generated in the leaching process, is expected to be an optimal solvent for Au leaching. In addition, the application of microwaves is believed to be effective in terms of time, efficiency and energy.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.348-348
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• 2011

We present the interfacial electronic structures of electrodeposited Cu and Fe on bare and 1,4-phenylene diisocyanide (PDI)-functionalized Au nanoisland templates (NITs), and Au and Ag nanoparticles on transition metal oxide supports. Our discussion is based on the depth-profiling X-ray photoelectron spectroscopy (XPS) and scanning electron microscopy (SEM).

• Economic and Environmental Geology
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• v.21 no.4
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• pp.389-400
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• 1988

Minor elements such as Ag, As, Au, Bi, Cd, Cu, Co, Ni, Pb, Rb, Sb, Sr and Te were analyzed by atomic absorption spectrophotometry and induced coupled plasma spectrophotometry in order to investigate pathfinders for gold in quartz porphyry, granite porphyry and vein materials in Jeonjuil gold - silver mine, and in altered biotite granites and vein materials in Dukum gold - silver mine. In Dukum gold - silver mine, it is observed that Au contents have positive relation with As, Co, and Rb contents, but negative relation with Bi contents in altered biotite granites. Au contents have positive relation with Ag, As, Co and Te contents in vein materials. In Jeonjuil gold - silver mine, it is observed that Cd, Rb, Sr and Te are enriched near ore vein in quartz porphyry and granite porphyry. Au contents have positive relation with As, Cd, Cu, $Fe_2O_3$ and $K_2O$ in vein materials.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.1
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• pp.45-51
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• 2001

The effects of wettability and surface oxidation on the low temperature and ultra-fine solder bump formation have been studied. Difference sequences of near eutectic In-Ag and eutectic Bi-Sn solders were evaporated on Au/Cu/Cr or Au/Ni/Ti Under Bump Metallurgy (UBM) pads. Solder bumps were formed using lift-off method and were reflowed in Rapid Thermal Annealing (RTA) system. The solder bumps in which In was in contact with UBM in In-Ag solder and the solder bumps in which Sn was in contact with UBM in Bi-Sn solder showed better bump formability during reflow than other solder bumps. The ability to form spherical solder bumps was affected mainly by the wettability of solders to UBM pads.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2007.04a
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• pp.37-47
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• 2007

Factor : Structure Metal pad & SMO size Board level TC test : - Large SMO size better Board level Drop test : - Large SMO size better Factor : Structure Substrate thickness Board level TC test : - Thick substrate better Board level Drop test : - Substrate thickness is not a significant factor for drop test Factor : Material Solder alloy Board level TC test : - Not so big differences over Pb-free solder and NiAu, OSP finish Board level Drop test : - Ni/Au+SAC105, CuOSP+LF35 are better Factor : Material Pad finish Board level TC test : - NiAu/NiAu is best Board livel Drop test : - CuOSP is best Factor : Material Underfill Board level TC test - Several underfills (reworkable) are passed TCG x500 cycles Board level Drop test : - Underfill lots have better performance than non-underfill lots Factor : Process Multiple reflow Board level TC test : - Multiple reflow is not a significant actor for TC test Board level Drop test : N/A Factor : Process Peak temp Board level TC test : - Higher peak temperature is worse than STD Board level Drop test : N/A Factor : Process Stack method Board level TC test : - No big difference between pre-stack and SMT stack Board level Drop test : - Flux dipping is better than paste dipping but failure rate is more faster

• Corrosion Science and Technology
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• v.4 no.1
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• pp.19-22
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• 2005

Two Au-Ag-Cu-Pd dental casting alloys (Au:12% and 20%) used. The test solutions used 0.9 % NaCl solution (isotonic sodium chloride solution), 0.9 % NaCl solution containing 1 % lactic acid, and 0.9 % NaCl solution containing 1 % lactic acid and 0.1 mol $dm^{-3}$ $Na_2S$. The surface of two samples in three sample solutions was not natural discoloration during one year. The alloy containing 12 % gold was easily alloyed and the composition was uniform comparing with the alloy containing 20 % gold. The rest potentials have not a little effect after three months. The kinds of metals could not definitely from the oxidation and reduction waves of metal on the cyclic voltammograms. The dissolutions of gold and palladium were 12 % Au sample in the 0.9 % NaCl solution containing 1 % lactic acid and 0.1 mol $dm^{-3}$ $Na_{2}S$. The pH of solution had an affect on dissolution of copper, and sulfur ion had an affect on dissolution of silver. The copper dissolved amount from 20 % gold sample was about 26 times comparing with that of 12 % gold sample in the 0.9 % solution containing 1 % lactic acid. Corrosion products were silver chloride and copper chloride in NaCl solution, and silver sulfide and copper sulfide in NaCl solution containing $Na_{2}S$.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.1
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• pp.1-9
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• 2007

OSP(organic solderability preservatives) finish has been considered as a very effective process for substituting the metal surface treatment of Ni/Au finish because of lower cost, interface property and environmental issue of OSP finish. However, the discoloration of OSP layer is formed during assembly process consisting of various steps of temperature. The causes of discoloration and the characterization of solder joint were investigated with a degree of discoloration and the assembly process of OSP finished products, which was also compared statistically with that of conventional Ni/Au finished products. As the results, the solution of process trouble for OSP finished products is able to be offered.

• 한국지구물리탐사학회:학술대회논문집
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• 2003.11a
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• pp.536-539
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• 2003

The Dongjung Au-Ag-Cu mine area was seriously contaminated with As and heavy metals-Cd, Cu, Hg, Mn, Pb and Zn etc. Those elements were highly accumulated in plants grown at farmland as well as farmland soil. Stream waters and groundwater which has been used as drinking water around the mine site contain high levels of heavy metals, especially As. As a result of human health risk assessment using EHS(Extraction of Heavy metals in Stomach and Small intestine) test for bioaccessible contents of heavy metals, there is a potential of cancer and adverse effects on human health for the residents of the mine area.

• Journal of Welding and Joining
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• v.20 no.1
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• pp.91-96
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• 2002

Three different kinds of substrate used in this study : bare Cu, electroless Ni/Cu substrate with a Nilayer thickness of $5\mu\textrm{m}$, immersion Au/electroless Ni/Cu substrate with the Au and Ni layer of $0.15\mu\textrm{m}$ and $5\mu\textrm{m}$ thickness, respectively. The wettability and interfacial tension between various substrate and Sn-3.5Ag solder were examined as a function of soldering temperature, types of flux. The wettability of Sn-3.5Ag solder increased with soldering temperature and solid content of flux. The wettability of Sn-3.5Ag solder was affected by the substrate metal finish used, i.e., nickel, gold and copper. Intermetallic compound formation between liquid solder and substrate reduced the interfacial energy and decreased wettability.