• Korean Journal of Materials Research
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• v.17 no.5
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• pp.273-277
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• 2007

Vertically aligned Zinc Oxide rod arrays were grown by the self-assembly hydrothermal process on the GaN epitaxial layer which has a same lattice structure with ZnO. Zinc nitrate and DETA solutions are used in the hydrothermal process. The $(HfO_2)$ thin film was deposited on GaN and the patterning was made by the photolithography technique. The selective growth of ZnO rod was achieved with the patterned GaN substrate. The fabricated ZnO rods are single crystal, and have grown along hexagonal c-axis direction of (002) which is the same growth orientation of GaN epitaxial layer. The density and the size of ZnO rod can be controlled by the pattern. The optical property of ordered array of vertical ZnO rods will be discussed in the present work.

• Nuclear Engineering and Technology
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• v.48 no.1
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• pp.33-42
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• 2016

Spacer grids play an important role in maintaining the proper form of the fuel assembly structure and ensuring the safety of reactor core design. This study applies the Monte Carlo method to the analysis of the neutronics effects of spacer grids in a typical pressurized water reactor (PWR). The core problem used to analyze the neutronics effects of spacer grids is a modified version of Korea Advanced Institute of Science and Technology benchmark problem 1B, based on an Advanced Power Reactor 1400 (APR1400) core model. The spacer grids are modeled and added to this test problem in various ways. Then, by running MCNP5 for all cases of spacer grid modeling, some important numerical results, such as the effective multiplication factor, the spatial distributions of neutron flux, and its energy spectrum are obtained. The numerical results of each case of spacer grid modeling are analyzed and compared to assess which type has more advantages in accuracy of numerical results and effectiveness in terms of geometry building. The conclusion is that the most realistic modeling for Monte Carlo calculation is the "volume-preserving" streamlined heterogeneous spacer grids, but the "banded" dissolution spacer grids modeling is a more practical yet accurate model for routine (deterministic) analysis.

• Journal of the Korea Institute of Building Construction
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• v.13 no.4
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• pp.400-406
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• 2013

In high-rise buildings, high-strength concrete is widely used to reduce the section of structure members under axial load. Also, the price increase of materials is very important item in the high-rise buildings. Especially, concrete used high-pressure pump due to consecutive structural assembly. Unlike slump type of ordinary concrete, high strength concrete has different properties of concrete pumping due to viscosity. However, there have been no Korean studies on the pumping properties of high strength concrete. Therefore, this paper measures the friction factor of high strength concrete with changes in the pressure of concrete pumping. We analyzed the trends of the friction factor based on changes in the pressure of concrete pumping, and then calculated the quantity of concrete deposited for each specified concrete strength and location of placement. After comparing these results with the quantity of concrete deposited measured in field, we evaluated the pumping properties of high strength concrete. Through the tests and the review, we attempt to suggest some basic information for the In-Situ application of high strength concrete.

• Proceedings of the KIEE Conference
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• 1987.07a
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• pp.284-287
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• 1987

In this paper, the design and implementation of a multiprocessor based Die Bonder Machine for the semiconductor will be described. This the partial research result, that is, the 1st year portion of the project to be performed for a period of two years from June, 1986 to May, 1988. The mechanical system consists of the following three subsystems : (i) transfer head unit, (ii) die feeding XY-table unit, and (iii) plunge up unit. The overall control system is designed to be essentially a master-slave type in which each slave is functionally fixed in view of software and also the time shared common bus structure with hardwired bus arbitration scheme is utilized, the control system consists of the following three subsystems each of which employs a 16 bits microprocessor MC 68000 : (i) die bonder processor controller, (ii) visual recognition/inspection and display system, (iii) the servo control system. It is reported that the proposed control system were applied to Working Sample and tested in real system, and the results are successful as a working sample phase.

• Journal of Korean Institute of Industrial Engineers
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• v.41 no.5
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• pp.470-480
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• 2015

There are many challenges in manufacturing system for new factory construction. Although factories produce same product, the layout of each factory may be different. The body shop in an automotive factory is a typical flow line with assembly, but the layout concept of the line varies among factories. In this paper, two types of layouts in the body shops of automotive factories, one for layered build and the other for modular build, are compared using simulation study. The simulation experiments indicate that the modular build layout is better than the layered build layout with respect to production rate. The effects of various failure distributions on the throughputs are also investigated, and some insights are suggested regarding the layout concept.

• Macromolecular Research
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• v.17 no.8
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• pp.597-602
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• 2009

Although the existing design principle of full-sequence ionic complement is convenient for the development of peptides, it greatly constrains the exploration of peptides with other possible assembly mechanisms and different yet essential functions. Herein, a novel designed half-sequence ionic complementary peptide (referred to as P9), AC-Pro-Ser-Phe-Asn-Phe-Lys-Phe-Glu-Pro-$NH_2$, is reported. When transferred from pure water to sodium chloride solution, P9 underwent a dramatic morphological transformation from globular aggregations to nanofibers. Moreover, the rheological experiment showed that the P9 could form a hydrogel with a storage modulus of about 30 Pa even at very low peptide concentration (0.5% (wt/vol)). The P9 hydrogel formed in salt solution could recover in a period of about 1,800 sec, which is faster than that in the pure water. The data suggestcd that the half-sequence, ionic complementary peptide might be worthy of further research for its special properties.

• Nuclear Engineering and Technology
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• v.50 no.2
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• pp.292-296
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• 2018

Recent events in the nuclear industry have resulted in a movement towards increased seismic and LOCA excitations and requirements that challenge current fuel designs. AREVA NP's GAIA fuel design introduces unique and robust characteristics to resist the effects of seismic and LOCA excitations. For demanding seismic and LOCA scenarios, fuel assembly spacer grids can undergo plastic deformations. These plastic deformations must not prohibit the complete insertion of the control rod assemblies and the cooling of the fuel rods after the accident. The specific structure of the GAIA spacer grid produces a unique and stable compressive deformation mode which maintains the regular array of the fuel rods and guide tubes. The stability of the spacer grid allows it to absorb a significant amount of energy without a loss of load-carrying capacity. The GAIA-specific grid behavior is in contrast to the typical spacer grid, which is characterized by a buckling instability. The increased mechanical robustness of the GAIA spacer grid is advantageous in meeting the increased seismic and LOCA loadings and the associated safety requirements. The unique GAIA spacer grid behavior will be incorporated into AREVA NP's licensed methodologies to take full benefit of the increased mechanical robustness.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.1051-1054
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• 2005

On this study, we optimized minimizing the characteristic function for mixed result of the structural contact analysis and the buckling analysis according to the pin jig initial model's level change using mixed the table of orthogonal away and ANOM, Pin jig's weight is reduced up to 20 percent considering constraint conditions. Also we optimized reducing 20 percent weight of pin jig model using topology optimization.

• Proceedings of the KSR Conference
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• 2008.11b
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• pp.1999-2004
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• 2008

This study is about to constructing BOM for managing and integrating information, which is drawing, technical data, attribution, design, ordering, cost, weight, process, service, etc. based on train's system, elements, substructure, assembly, components, parts during whole train's lifetime of the next generation. The BOM is the mostly basic structure information as hierarchical data what are parts consisted specific products. The BOM was utilized as essential elements for collectively managing through informing all of the business activity from ordering to supplying. The BOM in railroad is consist of two parts. One is Engineering BOM for design, the other is Production BOM for production, which are utilized in development calculating the quantity of materials. Also the Maintenance BOM is applied to suppling parts and managing malfunction in railroad corporation like the Seoul Metro. There are many kind of BOMs, because of the special character for each step. Therefore We have need to develop BOM which is able to integrate drawing, technical data for helping good circulation between RAMS applied maintenance using database and helpful know-how for development and production. Also the BOM of the next generation must be consisted regard to whole life-cycle.

• Journal of the Semiconductor & Display Technology
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• v.18 no.4
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• pp.149-153
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• 2019

The technology of electronic packaging among semiconductor technologies is evolving as an axis of the market in its own field beyond the simple assembly process of the past. In the field of electronic packaging technology, the packaging of power modules plays an important role for green electric vehicles. In this power module packaging, the thermal reliability is an important factor, and silicon nitride plays an important part of package substrates, Silicon nitride is a compound that is not found in nature and is made by chemical reaction between silicon and nitrogen. In this study, this core material, silicon nitride, was fabricated by reaction bonded silicon nitride. The fabricated silicon nitride was studied for thermo-mechanical properties, and through this, the structure of power module packaging was made using reaction bonded silicon nitride. And the characteristics of stress were evaluated using finite element analysis conditions. Through this, it was confirmed that reaction bonded silicon nitride could replace the silicon nitride as a package substrate.