• The Journal of Korean Institute of Communications and Information Sciences
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• v.25 no.6B
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• pp.1127-1135
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• 2000

The beamforming procedure in Adaptive Array Antenna System is affected by signal degradation and data rate due to DS-CDMA characteristics. Until this time, a lot of techniques are suggested to overcome this problems. This paper shows the simulation result about the beamforming performance of symbol level system that process slow data rate, compensated signal by despreading procedure in front of beamformer, and that of chip level system that process chip level signal without it. we analysis the performance using MSE, beam pattern, scattering points of beamformer output. chip level system is superior to symbol level system in time varying channel, while the performance of them didn't have difference in static channel.

• 제어로봇시스템학회:학술대회논문집
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• 2003.10a
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• pp.360-365
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• 2003

In this paper, we have developed a general purpose motion controller using an FPGA(Field Programmable Gate Array). The multi-PID controllers on a single chip are implemented as a system-on-chip for multi-axis motion control. We also develop a PC GUI for an efficient interface control. Comparing with the commercial motion controller LM 629 it has multi-independent PID controllers so that it has several advantages such as space effectiveness, low cost and lower power consumption. In order to test the performance of the proposed controller, robot finger is controlled. The robot finger has three fingers with 2 joints each. Finger movements show that position tracking was very effective. Another experiment of balancing an inverted pendulum on a cart has been conducted to show the generality of the proposed FPGA PID controller. The controller has well maintained the balance of the pendulum.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.07a
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• pp.119-126
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• 2001

Chip-on-glass(COG) mounting of area array electronic packages was attempted by heating the rear surface of a contact pad film deposited on a glass substrate. The pads consisted of an adhesion(i.e. Cr or Ti) and a top coating layer(i.e. Ni or Cu) was heated by an UV laser beam transmitted through the glass substrate. The laser energy absorbed on the pad raised the temperature of a solder ball which is in physical contact with the pad, forming a reflowed solder bump. The effects of the adhesion and top coating layer on the laser reflow soldering were studied by measuring temperature profile of the ball during the laser heating process. The results were discussed based on the measurement of reflectivity of the adhesion layer. In addition, the microstructures of solder bumps and their mechanical properties were examined.

• Journal of Sensor Science and Technology
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• v.14 no.1
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• pp.28-32
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• 2005

In this paper, a CMOS integrated detection circuit for capacitive type fingerprint sensor signal processing is described. We designed a detection circuit of charge-sharing sensing scheme. The proposed detection circuit increases the voltage difference between a ridge and valley. The test chip is composed of $160{\times}192$ array sensing cells (12 by $12.7{\;}mm^{2}$). The chip was fabricated on a 0.35 m standard CMOS process. Measured difference voltage between a ridge and valley was 0.95 V.

• Electronics and Telecommunications Trends
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• v.38 no.1
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• pp.46-54
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• 2023

The announcement of the US Environmental Protection Agency that it will stop conducting or funding experimental studies on mammals by 2035 should prioritize ongoing efforts to develop and use alternative toxicity screening methods to animal testing. Toxicity screening is likely to be further developed considering the combination of human-induced pluripotent-stem-cell-derived organ-on-a-chip and multielectrode array (MEA) technologies. We briefly review the current status of MEA technology and MEA-based neuropharmacological drug screening using various cellular model systems. Highlighting the coronavirus disease pandemic, we shortly comment on the importance of early prediction of toxicity by applying artificial intelligence to the development of rapid screening methods.

• Journal of the Korean Institute of Telematics and Electronics
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• v.26 no.11
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• pp.1880-1885
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• 1989

In this paper, a new approach for systolic array realizing the discrete cosine transform (DCT) based on discrete Fourier transform (DFT) of an input sequence is presented. The proposed array is based on a simple modified DFT(MDFT) version of the Goertzel algorithm combined with Kung's approach and is proved perfectly. This array requires N cells, one multiplier and takes N clock cycles to produce a complete N-point DCT and also is able to process a continuous stream of data sequences. We have analyzed the output signal-to-noise ratio(SNR) and designed the circuit level layout of one-PE chip. The array coefficients are static adn thus stored-product ROM's can be used in place of multipliers to limit cost as eliminate errors due to coefficients quantization.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.3
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• pp.19-24
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• 2014

This article reviews the recent progress in nanowell array biosensors that use the label-free detection protocol, and are detected in their natural forms. These nanowell array biosensors are fabricated by nanofabrication technologies that should be useful for developing highly sensitive and selective also reproducible biosensors. Moreover, electrochemical method was selected as analysis method that has high sensitivity compared with other analysis. Finally, highly sensitive nanobiosensor was achieved by combining nanofabrication technologies and classical electrochemical method. Many examples are mentioned about the sensing performance of nanowell array biosensors will be evaluated in terms of sensitivity and detection limit compared with other micro-sized electrode without nanowell array.

• ETRI Journal
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• v.41 no.2
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• pp.262-269
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• 2019

This paper introduces a low-cost, high-performance mmWave antenna array module at 77 GHz. Conventional waveguide transitions have been replaced by 3D CPW-microstrip transitions which are much simpler to realize. They are compatible with low-cost substrate fabrication processes, allowing easy integration of ICs in 3D multi-chip modules. An antenna array is designed and implemented using multilayer coupled-fed patch antenna technology. The proposed $16{\times}16$ array antenna has a fractional bandwidth of 8.4% (6.5 GHz) and a 23.6-dBi realized gain at 77 GHz.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2449-2452
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• 2007

Hot spots on thin wafers of IC packages are becoming important issues in thermal and electrical engineering fields. To investigate these hot spots, we developed a Diode Temperature Sensor Array (DTSA) that consists of an array of 32 ${\times}$32 diodes (1,024 diodes) in a 8 mm ${\times}$ 8 mm surface area. To know specifically the hot spot temperature which is affected by the chip thickness and a generated power, we made the DTSA chips, which have 21.5 ${\mu}m$, 31 ${\mu}m$, 42 ${\mu}m$, 100 ${\mu}m$, 200 ${\mu}m$, and 400 ${\mu}m$ thickness using the CMP process. And we conducted the experiment using various heater power conditions (0.2 W, 0.3 W, 0.4 W, 0.5 W). In order to validate experimental results, we performed a numerical simulation. Errors between experimental results and numerical data are less than 4%. Finally, we proposed a correlation for the hot spot temperature as a function of the generated power and the wafer thickness based on the results of the experiment. This correlation can give an easy estimate of the hot spot temperature for flip chip packaging when the wafer thickness and the generated power are given.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.25 no.1
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• pp.130-136
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• 2014

This paper reviews the research on silicon based phased array system operating from microwave to millimeter wave frequencies. First, the design of phase shifter using CMOS technology is presented. The passive phase shifter is applied to the transmit/receive module from one to 16 channel in a single chip. The 35 GHz 4-element T/R module consumes less than 200 mW both transmit and receive modes. The architecture can extend to 16-channel operating at 44 GHz, thereby improving transmit power and linearity. The Ku-band 2-antenna 4-element receiver was developed using active phase shifter based on vector sum method. It is important to minimize coupling between beams because the chip contains four independent beams. The method of coupling is presented and verified.