• 한국재료학회:학술대회논문집
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• 한국재료학회 2003년도 춘계학술발표강연 및 논문개요집
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• pp.88-88
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• 2003

Optical Emission Spectroscopy(OES) is a very important technology for real-time monitoring of plasma in a reactor during dry etching process. OES technology is non-invasive to the plasma process. It can be used to collect information on excitation and recombination between electrons and ions in the plasma. It also helps easily diagnose plasma intensity and monitor end-point during plasma etch processing. We studied high density planar inductively coupled BCl$_3$ and BCl$_3$/Ar plasma with an OES as a function of processing pressure, RIE chuck power, ICP source power and gas composition. The scan range of wavelength used was from 400 nm to 1000 nm. It was found that OES peak Intensity was a strong function of ICP source power and processing pressure, while it was almost independent on RIE chuck power in BCl$_3$-based planar ICP processes. It was also worthwhile to note that increase of processing pressure reduced negatively self-induced dc bias. The case was reverse for RIE chuck power. ICP power and gas composition hardly had influence on do bias. We will report OES results of high density planar inductively coupled BCl$_3$ and BCl$_3$/Ar Plasma in detail in this presentation.

• Korean Chemical Engineering Research
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• 제43권1호
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• pp.76-79
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• 2005

Magnetic random access memory(MRAM) 소자재료로 사용되고 있는 NiFe, NiFeCo, Ta 등의 박막을 $Cl_2/Ar$ 유도 결합 플라즈마를 이용하여 식각하였다. NiFe와 NiFeCo의 식각 속도는 특정 ICP 공급 전력에서 최대값을 나타냈지만, Ta의 식각 속도는 ICP 공급 전력이 증가함에 따라 증가하였다. RF 하부전극 전력이 증가하면서 자성박막의 식각 속도는 증가하였지만, 공정압력과 $Cl_2$의 농도가 증가함에 따라 점진적으로 감소하였다. 식각 후에 염소에 의한 표면 부식을 방지하기 위해 이온수로 5분간 세척하였다. 식각 프로파일은 $Cl_2$ 농도가 50%일 경우에 식각 단면에 식각 잔유물들이 존재하지 않는 부드러운 단면을 얻을 수 있었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.168-168
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• 2008

Dimension of a transistor has rapidly shrunk to increase the speed of device and to reduce the power consumption. However, it is accompanied with several problems like direct tunneling through the gate dioxide layer and low conductivity characteristic of poly-Si gate in nano-region. To cover these faults, study of new materials is urgently needed. Recently, high dielectric materials like $Al_2O_3$, $ZrO_2$, and $HfO_2$ are being studied for equivalent oxide thickness (EOT). However, poly-Si gate is not compatible with high-k materials for gate-insulator. Poly Si gate with high-k material has some problems such as gate depletion and dopant penetration problems. Therefore, new gate structure or materials that are compatible with high-k materials are also needed. TiN for metal/high-k gate stack is conductive enough to allow a good electrical connection and compatible with high-k materials. According to this trend, the study on dry etching of TiN for metal/high-k gate stack is needed. In this study, the investigations of the TiN etching characteristics were carried out using the inductively coupled $BCl_3$-based plasma system and adding $Cl_2$ gas. Dry etching of the TiN was studied by varying the etching parameters including $BCl_3$/Ar gas mixing ratio, RF power, DC-bias voltage to substrate, and $Cl_2$ gas addition. The plasmas were characterized by optical emission spectroscopy analysis. Scanning electron microscopy was used to investigate the etching profile.

• KEPCO Journal on Electric Power and Energy
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• 제1권1호
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• pp.135-140
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• 2015

유도 결합 플라즈마를 활용하여 $Ar/CO_2$ 혼합가스에서 이산화탄소를 분해하는 연구이다. 고밀도 플라즈마를 발생시키기 위해 Ar 가스를 첨가하였고 이산화탄소 분해율을 측정하기 위해 광학적 광량 측정법을 사용 하였다. 유도 결합 플라즈마를 방전시키고 인가 전력, 압력, 혼합가스 비율을 변경하가며 단일 랭뮤어 프로브를 이용해 플라즈마 변수를 얻고 방출 분광기로 얻은 빛의 스펙트럼을 이용하여 분해율을 측정하였다. 측정된 플라즈마 변수로부터 $CO_2$ 유도 결합 플라즈마의 소스 특성을 확인했고 $CO_2$ 분해 메커니즘은 플라즈마 변수에 직접적인 영향을 받기 때문에 그 상관관계를 분석하였다.

• 반도체디스플레이기술학회지
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• 제20권4호
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• pp.72-77
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• 2021

The radial distribution of etch rate was analyzed using the ion energy flux model in VHF-CCP. In order to exclude the effects of polymer passivation and F radical depletion on the etching. The experiment was performed in Ar/SF6 plasma with an SF6 molar ratio of 80% of operating pressure 10 and 20 mTorr. The radial distribution of Ar/SF6 plasma was diagnosed with RF compensated Langmuir Probe(cLP) and Retarding Field Energy Analyzer(RFEA). The radial distribution of ion energy flux was calculated with Bohm current times the sheath voltage which is determined by the potential difference between the plasma space potential (measured by cLP) and the surface floating potential (by RFEA). To analyze the etch rate uniformity, Si coupon samples were etched under the same condition. The ion energy flux and the etch rate show a close correlation of more than 0.94 of R² value. It means that the etch rate distribution is explained by the ion energy flux.

• 한국표면공학회지
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• 제41권5호
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• pp.189-193
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• 2008

In this study, we carried out an investigation of the etching characteristics (etch rate, selectivity to $SiO_2$ and $HfO_2$) of TiN thin films in the $CH_4$/Ar inductively coupled plasma. The maximum etch rate of $274\;{\AA}/min$ for TiN thin films was obtained at $CH_4$(80%)/Ar(20%) gas mixing ratio. At the same time, the etch rate was measured as function of the etching parameters such as RF power, Bias power, and process pressure. The X-ray photoelectron spectroscopy analysis showed an efficient destruction of the oxide bonds by the ion bombardment as well as showed an accumulation of low volatile reaction products on the etched surface. Based on these data, the ion-assisted chemical reaction was proposed as the main etch mechanism for the $CH_4$ containing plasmas.

• 대한화학회지
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• 제40권4호
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• pp.235-242
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• 1996

기체 크로마토그래피와 쉽게 연결할 수 있는 Surfatron형의 MIP(Microwave Induced Plasma)용 cavity를 제작하고 헬륨, 아르곤, 질소 등을 플라스마 가스로 사용하여 플라스마를 생성시키고 스펙트럼을 비교하였다. 또한 헬륨과 아르곤, 질소에 미량의 CO2를 혼합하여 각 기체의 스펙트럼을 비교 분석하였으며, 제작한 MIP cavity가 질량분석기와 연결되었을 때 분자이온을 생성시킬 수 있는 이온원으로서의 가능성을 연구하였다. 헬륨과 아르곤 MIP는 높은 준안정 준위의 에너지를 가지기 때문에 분자들이 거의 다 깨어지므로 분자상태로 시료기체의 검출은 거의 불가능하였다. 그러나 질소는 다른 비활성기체에 비하여 낮은 준안정 준위의 어네지를 가지므로 검출하려는 기체성분이 상당부분 분자상태로 존재함을 알 수 있었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제38회 동계학술대회 초록집
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• pp.392-392
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• 2010

In this study, high-speed chemical dry thinning process of Si wafer and evolution of surface roughness were investigated. Direct injection of NO gas into the reactor during the supply of F radicals from $NF_3$ remote plasmas was very effective in increasing the Si thinning rate due to the NO-induced enhancement of surface reaction but thinned Si surface became roughened significantly. Addition of Ar gas, together with NO gas, decreased root mean square (RMS) surface roughness of thinned Si wafer significantly. The process regime for the thinning rate enhancement with reduced surface roughness was extended at higher Ar gas flow rate. Si wafer thinning rate as high as $22.8\;{\mu}m/min$ and root-mean-squared (RMS) surface roughness as small as 0.75 nm could be obtained. It is expected that high-speed chemical dry thinning process has possibility of application to ultra-thin Si wafer thinning with no mechanical damage.

• 한국염색가공학회지
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• 제16권5호
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• pp.28-34
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• 2004

The polarizing film application exploits the unique physicochemical properties between PVA(Poly vinyl alcohol) film and CTA(Cellulose triacetate) film. However, hardly any research was aimed at improving the adhesion characteristics of the CTA film by radio frequency(RF) plasma treatment at argon(Ar) gaseous state. In this report, we deal with surface treatment technology for protective CTA film developed specifically for high adhesion applications. After Ar plasma, surface of the films is analyzed by atomic force microscopy(AFM), roughness parameter and peel strength. Furthermore, the wetting properties of the CTA film were studied by contact angle analysis. Results obtained for CTA films treated with a glow discharge showed that this technique is sensitive to newly created physical functions. The roughness and peel strength value increased with an increase in treatment time for initial treatment, but showed decreasing trend for continuous treatment time. The result of contact angle measurement refer that the hydrophilicity of surface was increased. AFM studies indicated that no considerable change of surface morphology occurred up to 3 minutes of treatment time, but a considerable uneven of surface structure resulted from treating time after 5 minutes.

• 한국진공학회지
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• 제4권1호
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• pp.12-17
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• 1995

Diamondlike carbon(DLC)films having good characteristics in mechanical and optical properties, were synthesized by rf-plasma enhanced chemical vapor deposition method. Methane, methane-hydrogen, or methane-argon were used as source gases. The infrared transparency and composition of the films were investigate. Especially, the anti-reflection effect of KLC film in infrared region was confirmed by depositing it on Ge/Si sample. When DLC films were deposited on the plastic substrates and thermal distortion, which were originated before and during deposition, respectively, played a role as a crack source of the films.