• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 춘계학술대회 논문집 유기절연재료 방전 플라즈마연구회
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• pp.89-91
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• 2003

In this paper, using a Langmuir probe Ar gas characteristic of electrodeless fluorescent lamp which used an inductively coupled plasma were investigated. The RF output changed into 5-50W in 13.56MHz. At this time internal plasma voltage of the chamber and probe current were measured while changing in -70V - +70V with a supply voltage by Langmuir probe. If pressure of Ar gas was increased, the electric current tended to decrease. Also, an electric current was increased according to an increase of a RF output.

• 대기
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• 제17권4호
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• pp.483-492
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• 2007

The objective of this study is to describe scientific progresses in understanding of climate change in the Intergovernmental Panel on Climate Change (IPCC) assessment reports, contributed by Working group I. Since 1988, IPCC's four assessment reports showed significant improvements in understanding of observed climate change, drivers of climate change, detection and attribution of climate change, climate models, and future projection. The results are based on large amounts of observation data, sophisticated analyses of data, improvements of climate models and the simulations. While the First Assessment Report (FAR) in 1990 reported that a detectable anthropogenic influence on climate has little observational evidence, the Fourth Assessment Report (AR4) reported that warming of the climate system is unequivocal and is very likely due to human influences. It is also noted that anthropogenic warming and sea level rise would continue for centuries due to the time scales associated with climate processes and feedbacks, even if greenhouse gas were to be stabilized.

• 한국산학기술학회:학술대회논문집
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• 한국산학기술학회 2011년도 추계학술논문집 2부
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• pp.394-397
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• 2011

The effects of heat input(1.4~3.2kJ/mm), shielding gas(Ar80%+$CO_2$20%) and postweld heat treatment(PWHT, $600^{\circ}C$, 40hr.) on the TMCP HSB600 steel weldments made by GMAW process were investigated. The tensile strength and CVN impact energy of as-welded specimens decreased with increasing heat input. The fine-grained acicular ferrite was mainly formed in the low heat input while polygonal and side plate ferrites were dominated in the high inputs. High performance steel for bridges requires higher performance in tensile and yield strength, toughness, weldability, etc. Thus, the purpose of the experiment is to study HSB 600 in GMAW.

• 한국재료학회지
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• 제12권8호
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• pp.661-668
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• 2002

A study was made to examine the electrical, compositional, structural and morphological properties of Ag thin films deposited by DC magnetron sputtering in $O_2$ atmosphere with deposition temperature from room temperature to 15$0^{\circ}C$ using in-line sputter system. The Ag films deposited at temperature above $100^{\circ}C$ in oxygen atmosphere gave a similar specific resistivity to and even lower oxygen content than those deposited using pure Ar sputter gas The Ag films deposited with pure Ar gas was mainly composed of crystallites with [111] preferred orientation, while, for those deposited in oxygen atmosphere, more than 50% of the volume was composed of crystallites with [100] orientation. The difference in the micro structure did not cause any difference in the specific resistivity of Ag films. The results showed that the transparent conducting oxide films and the Ag films could be processed sequentially in the same deposition chamber with careful control of deposition temperature, which might result in a cost reduction for constructing the large scale in-line deposition system.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집
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• pp.375-378
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• 2002

We investigated the reduction of etching damage by additive O$_2$ in etching gas and recovery of etching damage by O$_2$ annealing. The PZT thin films were etched using additive Ar or O$_2$ into Cl$_2$/CF$_4$ gas mixing ratio of 8/2. In order to recover ferroelectric properties of PZT thin films after etching, the etched PZT thin films were annealed at 600 C in O$_2$ atmosphere for 10 min. The remanent polarization is decreased seriously and fatigue is accelerated in the PZT sample etched in Ar/(C1$_2$+CF$_4$) plasma, whereas these characteristics are improved in O$_2$/(Cl$_2$/CF$_4$). From x-ray photoelectron spectroscopy (XPS) analysis, the intensities of Pb-O, Zr-O and Ti-O peaks are changed and the etch byproducts such as metal chloride and metal fluoride are reduced by O$_2$ annealing. From electron probe micro analyzer (EPMA) and auger electron spectroscopy(AES), O$_2$ vacancy is observed after etching. In x-ray diffraction (XRD), the structure damage in the additive O$_2$ into C1$_2$/CF$_4$ is reduced and the improvement of ferroelectric behavioral annealed sample is consistent with the increase of the (100) and (200) PZT peaks.

• 한국결정성장학회지
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• 제14권1호
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• pp.33-36
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• 2004

고밀도 GaN 타겟의 레이저 어블레이션으로 상온에서 비정질 GaN 박막을 제조하였다. 다양한 Ar 압력 및 레이저 에너지로 증착된 박막의 표면미세구조 및 조성분석 결과, 10Pa의 압력하에 증착된 박막은 smooth한 표면을 갖는 비정질 GaN로 구성되었음을 확인하였으며, 특히 200mJ/pu1se로 증착된 박막은 저 에너지에서 증착된 박막과 비교하여 결정성의 증가 및 화학양론에 가까운 조성을 나타냈다. 상온 photoluminescence spectra로부터 비정질 GaN 박막은 약 2.8eV에서 강한 band gap발광특성이 관측되었으며, 200mJ/pu1se의 10 Pa에서 가장 높은 발광효율을 나타냈다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1992년도 추계학술대회 논문집
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• pp.22-27
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• 1992

Phosphorus doped hydrogenated microcrystalline silicon (${\mu}c$-Si:H) thin films were deposited by PECVD (Plasma Enhanced Chemical Vapour Deposition) method using 10.2% $SiH_4$ gas (diluted in Ar) and 308ppm $PH_3$ gas (diluted in Ar). The structural, optical and electrical properties of the films were investigated as a function of substrate temperature(15 to $400^{\circ}C$) and RF power(10 to 120W). The thin film deposited by varing substrate temperature had columnar structure and microcrystalline phase. The volume fraction of microcrystalline phase in the films deposited at RF power of 80W, increased with increasing substrate temperature up to $200^{\circ}C$, and then decreased with further increasing substrate temperature. Volume fraction of microcrystalline phase increased monotonously with increasing RF power at substrate temperature of $250^{\circ}C$. With increasing volume fraction of microcrystalline, electrical resistivity of films decreased to 0.274 ${\Omega}cm$.

• Transactions on Electrical and Electronic Materials
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• 제6권1호
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• pp.10-13
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• 2005

$Sr_{0.6}Ba_{0.4}Nb_{2}O_{6}$, hereafter SBN60, thin films of 300 nm thickness were deposited using ion beam sputtering technique, in which sintered ceramic target of the same composition was utilized and the $Ar:O_{2}$ gas ratio was controlled during deposition onto $Pt(100)/TiO_{2}/SiO_{2}/Si$ substrate. Crystallization and orientation behavior as well as electrical properties of the films were examined after annealing treatment at $650{\sim}800{\cric}C$. It was found that the film orientation was dependent upon $Ar:O_{2}$ratio, in which strong (00l) orientation was developed when the gas ratio was about 1:4 at $4.3{\times}10^{-4}$ torr. Typical remanent polarization (2Pr), the coercive field (Ec) and the dielectric constant of Pt/SBN60/Pt thin film capacitor were approximately $10{\mu}C/cm^{2}$, 60 kV/cm, and 615, respectively.

• 한국전기전자재료학회논문지
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• 제14권5호
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• pp.351-355
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• 2001

Via for achieving reliable fabrication of MCM(Multichip Module) substrate was formed on photosensitive BCB layer. The MCM substrate consists of photosensitive BCB(Benzocyclobutene) interlayer dielectric and copper conductors. In order to form the vias in the photosensitive BCB layer, the process of forming the BCB layer and its via forming plasma etch using C$_2$F$\_$6//O$_2$ gas were evaluated. The thickness of the BCB layer after hard bake was shrunk down to 40% of the original. The resolution of vias formed on the BCB was 15㎛ and the slope after develop was 85 degree. AES analysis was done on two vias, one is etched in C$_2$F$\_$6/O$_2$ gas and the other isnot etched. On the via etched in C$_2$F$\_$6//O$_2$, native C was detected and the amount of native C was reduced after Ar sputter. On the via not etched in C$_2$F$\_$6//O$_2$, organic C was detected. As a result of AES, BCB residue was not removed by Ar sputter, so plasma etch is necessary for achieving reliable vias.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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• pp.400-403
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• 2003

Etching characteristics of (Pb,Sr)$TiO_3$(PST) thin films were investigated using inductively coupled chlorine based plasma system as functions of gas mixing ratio, RF power and DC bias voltage. It was found that increasing of Ar content in gas mixture lead to sufficient increasing of etch rate and selectivity of PST to Pt. The maximum etch rate of PST film is $562\;{\AA}$/min and the selectivity of PST film to Pt is 0.8 at $Cl_2/(Cl_2+Ar)$ of 20 %. It was proposed that sputter etching is dominant etching mechanism while the contribution of chemical reaction is relatively low due to low volatility of etching products.