• Korean Journal of Materials Research
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• v.3 no.6
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• pp.575-584
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• 1993

The effects of atmosphere on the creep rupture properties of Ni-base superalloy Ren6 80 were investigated. Creep rupture tests were performed at $760^{\circ}C$, 657MPa and 982%, 157MPa under Ar gas atmospheres. Creep rupture mode and rupture properties (rupture life and elongation) were similar in two different atmospheres under the condition of $760^{\circ}C$, 657MPa. However, the results at $982^{\circ}C$, 157MPa showed different creep rupture mode and life between air and Ar gas atmospheres. In air, it was shown that creep cracks were initiated at surface-exposed grain boundaries and propagated along grain boundaries. In Ar gas atmosphere, the cracks were initiated at inner grain boundaries and coalesced to surface cracks which cause cup-and-cone type fracture. Due to protective oxide layer formation, air test showed longer rupture life than Ar test.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.12 no.6
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• pp.283-287
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• 2002

We have studied Zr(Si)N film as a diffusion barrier between Cu metal and Si substrate for application of interconnection metal in ULSI circuits. Zr(Si)N film was deposited with reactive DC magnetron sputtering system using $Ar/N_2$mixed gas. The value of the resistivity was the lowest for the ZrN film using 29 : 1 of Ar : $N_2$reactant gas ratio at room temperature and decreased with increasing of Si substrate temperature. As the value of ZrN film resistivity was decreased, the direction of crystal growth was toward to (002) plane. The barrier property of ZrN film added with Si was improved. But Si was added too much in ZrN film, the barrier property was degraded. The adhesive property was improved with increasing of Si in ZrN. For the analysis of the film, XRD, Optical microscopy, Scretch tester, so on were used.

• Journal of the Korean Vacuum Society
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• v.10 no.1
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• pp.51-56
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• 2001

$CeO_2$ thin films as insulator for MFISFET (Metal-ferroelectric-insulator- semiconductor-field effect transistor) were deposited by r.f. magnetron sputtering. Ar and $O_2$ gas as the deposition gas were used and the effects of oxygen partial pressure during sputtering on texture and electrical properties of $CeO_2$ thin films were evaluated. All $CeO_2$ thin films deposited on p-type Si(100) substrate at $600^{\circ}C$ exhibited (200) preferred orientation. The films deposited with only Ar gas among various condition had highest preferred orientation but show large hysteresis characteristics in capacitance-voltage measurement due to relatively many charged paricles and roughness. Films show smooth surface state and good C-V characteristics with increasing oxygen partial pressure. It was thought that this trend in C-V characteristics was due to the amount of mobile ionic charge within $CeO_2$ films. The composition of films show oxygen excess, that is, O/$Ce_2$ ratio of films was 2.22~2.42 range and leakage current of films show $10^{-7}~10^{-8}A$order at 100 kV/cm.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.168-168
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• 2008

Dimension of a transistor has rapidly shrunk to increase the speed of device and to reduce the power consumption. However, it is accompanied with several problems like direct tunneling through the gate dioxide layer and low conductivity characteristic of poly-Si gate in nano-region. To cover these faults, study of new materials is urgently needed. Recently, high dielectric materials like $Al_2O_3$, $ZrO_2$, and $HfO_2$ are being studied for equivalent oxide thickness (EOT). However, poly-Si gate is not compatible with high-k materials for gate-insulator. Poly Si gate with high-k material has some problems such as gate depletion and dopant penetration problems. Therefore, new gate structure or materials that are compatible with high-k materials are also needed. TiN for metal/high-k gate stack is conductive enough to allow a good electrical connection and compatible with high-k materials. According to this trend, the study on dry etching of TiN for metal/high-k gate stack is needed. In this study, the investigations of the TiN etching characteristics were carried out using the inductively coupled $BCl_3$-based plasma system and adding $Cl_2$ gas. Dry etching of the TiN was studied by varying the etching parameters including $BCl_3$/Ar gas mixing ratio, RF power, DC-bias voltage to substrate, and $Cl_2$ gas addition. The plasmas were characterized by optical emission spectroscopy analysis. Scanning electron microscopy was used to investigate the etching profile.

• Resources Recycling
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• v.20 no.4
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• pp.71-77
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• 2011

$MoO_3$ powders were reduced to $MoO_2$ under Ar+$H_2$ gas mixture in a tubular furnace at temperature range 723~873 K. Reaction rate was quantitatively deduced by measuring relative humidity of off gas. Observed reaction rate increased significantly with hydrogen partial pressure and reaction temperature and the rate of $H_2O$ evolution increased drastically during the initial period of reduction. As reduction proceeded, however, $H_2O$ partial pressure decreased noticeably. During the initial period of the reduction, a linear relationship for time dependence of the reduction fraction was observed. The activation energy for the reduction of $MoO_3$ to $MoO_2$was 73.56 kJ/mol during the initial period of reduction.

• Journal of Ceramic Processing Research
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• v.13 no.spc2
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• pp.260-264
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• 2012

We have investigated the effect of ambient gases on the structural, electrical, and optical characteristics of IZO thin films intended for use as anode contacts in the organic light emitting diodes (OLED) devices. These IZO thin films were deposited on the PES film by radio frequency (RF) magnetron sputtering under different ambient gases (Ar, Ar + O2, and Ar + H2) at room temperature. In order to investigate the influences of the ambient gases, the flow rate of oxygen and hydrogen in argon has been changed from 0.1 sccm to 0.5 sccm, respectively. All the IZO thin film has an (222) preferential orientation regardless of ambient gases. The electrical resistivity of the IZO film increased with increasing O2 flow rate, whereas the electrical resistivity decreased sharply under an Ar + H2 atmosphere and was nearly similar regardless of the H2 flow rate. The change of electrical resistivity with changes in the ambient gas composition was mainly interpreted in terms of the charge carrier concentration rather than the charge carrier mobility. All the films showed the average transmittance over 85% in the visible range. The OLED device was fabricated with different IZO substrates made with the configuration of IZO/α-NPD/DPVB/Alq3/LiF/Al in order to elucidate the performance of the IZO substrate. The current density and the luminance of OLED devices with IZO thin films deposited in 0.5 sccm H2 ambient gas are the highest amongst all other films.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2009.05a
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• pp.252-253
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• 2009

In this study, the deformation and etch characteristics of ArF and EUV photoresists were compared in a dual frequency superimposed capacitively coupled plasma (DFS-CCP) etcher systems using $CF_{4}/O_{2}/Ar$ and $CF_{4}/CHF_{3}/O_{2}/Ar$ mixture gas chemistry which are typically used for BARC open and $Si_{3}N_{4}$ teching chemistry, respectively. Etch rate of the resists tend to increase with low-frequency source power ($P_{LF}$) and high-frequency source ($f_{HF}$). The etch rate of ArF resist was hgither than that of EUV resist.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.7
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• pp.564-568
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• 2003

The etching of Au thin films have been performed in an inductively coupled CF$_4$/Cl$_2$/Ar plasma. The etch rates were measured as CF$_4$ contents added from 0 to 30 % to Cl$_2$/Ar plasma, of which gas mixing ratio was fixed at 20%. Other parameters were fixed at an rf power of 700 W, a dc bias voltage of 150 V, a chamber pressure of 15 mTorr, and a substrate temperature of 3$0^{\circ}C$. The highest etch rate of the Au thin film was 3700 $\AA$m/min at a 10% additive CF$_4$ into Cl$_2$/Ar plasma. The surface reaction of the etched Au thin films was investigated using x-ray photoelectron spectroscopy (XPS) analysis. XPS analysis indicated that Au reacted with Cl and formed Au-Cl, which is hard to remove on the surface because of its high melting point. The etching products could be sputtered by Ar ion bombardment.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1321-1322
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• 2007

$Ar/Cl_2$, $Ar/CH_4$ 및 $Ar/Cl_{2}/CH_{4}$ 유도결합 플라즈마의 가스 혼합비에 따른 BLT 박막의 식각 메커니즘과 선택비, 식각 후 박막 표면의 조성변화를 조사하였다. BLT 박막의 최대식각률은 $Ar/Cl_2$ 플라즈마에서의 Ar 가스 혼합비가 80%일 때 50.8 nm의 값을 보였다. 이 때, 1sccm의 $CH_4$ 첨가를 통하여 선택비와 식각률을 개선할 수 있었다. 박막 표면의 xPS 분석을 통해 BLT 박막 표면의 조성변화는 Cl 원자와의 반응에 의한 화학적 식각 손상이 H 원자와의 반응에 의한 그것보다 크다는 것을 알 수 있었다.

• Proceedings of the KIEE Conference
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• 1997.07e
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• pp.1666-1668
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• 1997

This paper reports the optimal gas mixing ratio for color plasma display panel to improve luminous efficiency using gas dischage simulation which contains energy equation. We verified a simulation by measuring vacuum ultraviolet. The luminous efficiency has improved considerably(about 30%) by adding Ar (0.5%), compared with Ne-Xe(4%) mixing gas.