• The Transactions of the Korean Institute of Electrical Engineers C
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• v.52 no.10
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• pp.447-450
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• 2003

This paper presents a process optimization of antireflection (AR) coating on crystalline Si solar cells. Theoretical and experimental investigations were performed on a double-layer AR (DLAR) coating of MgF$_2$/CeO$_2$. We investigated CeO$_2$ films as an AR layer because they have a proper refractive index of 2.46 and demonstrate the same lattice constant as Si substrate. RF sputter grown CeO$_2$ film showed strong dependence on a deposition temperature. The CeO$_2$ deposited at 40$0^{\circ}C$ exhibited a strong (111) preferred orientation and the lowest surface roughness of 6.87 $\AA$. Refractive index of MgF$_2$ film was measured as 1.386 for the most of growth temperature. An optimized DLAR coating showed a reflectance as low as 2.04% in the wavelengths ranged from 0.4${\mu}{\textrm}{m}$ to 1.1${\mu}{\textrm}{m}$. We achieved the efficiencies of solar cells greater than 15% with 3.12% improvement with DLAR coatings. Further details on MgF$_2$, CeO$_2$ films, and cell fabrication parameters are presented in this paper.

• Journal of the Semiconductor & Display Technology
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• v.13 no.2
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• pp.29-35
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• 2014

In this study general solar cell production process was complemented, with research on improvement of solar cell efficiency through surface structure and thermal annealing process. Firstly, to form the pyramid structure, the saw damage removal (SDR) processed surface was undergone texturing process with reactive ion etching (RIE). Then, for the formation of smooth pyramid structure to facilitate uniform doping and electrode formation, the surface was etched with HND(HF : HNO3 : D.I. water=5 : 100 : 100) solution. Notably, due to uniform doping the leakage current decreased greatly. Also, for the enhancement and maintenance of minority carrier lifetime, antireflection coating thermal annealing was done. To maintain this increased lifetime, front electrode was formed through Au plating process without high temperature firing process. Through these changes in two processes, the leakage current effect could be decreased and furthermore, the conversion efficiency could be increased. Therefore, compared to the general solar cell with a conversion efficiency of 15.89%, production of high efficiency solar cell with a conversion efficiency of 17.24% was made possible.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.21 no.7
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• pp.1850-1860
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• 1996

We present the results for the design ofantireflection (AR) coatings on facets of a multilayered structure waveguide device. The method, whose results agree very well with the reusults of the rigorous method in the case of a symmetric three layer structure deveice, is extended for the design of AR coatings on the facets of a multilayered structure waveguide device. the field profile in a multilayered structure waveguide necessary for the use of the extended method is obtained from the transfer matrix method. The virtual four layered structure method (VFLM) is proposed to reduce the time for the design ofAR coatings because the time for the design of AR coatings using the extended method increases as the number of layers increases. The optimum coating parameters and tolerance mapsfor two different six layered waveguide devices in Ref. [9] and [10] are obtained using the extendedmethod and the VFLM,and for the three different cases approximated as three layered waveguide devices to compare the results of each case. The results of the VFLM are similar to those of the extended methodcompared to those of the three layered structure waveguide. The main reason for the above results is that the field profile in the device calculated usingthe VFLM is similar to that calculated using the extended method compared to that for three layered structure wavegjide. We conclude that the extended method or VFLM should be used for the design of AR coatings on facets of a deice required for the facet reflectivity less than 10$^{-3}$ such as a semiconductor otical amplifier.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.18 no.6
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• pp.697-701
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• 2009

A simple method for the fabrication of porous nano-master for the anti-reflection effect on the transparent substrates is presented. In the conventional fabrication methods for antireflective surface, coating method using materials with low refractive index has usually been used. However, it is required to have a high cost and long processing time for mass production. In this paper, we developed a porous nano-master with anti-reflective surface for the molding stamper of the injection mold, hot embossing and UV imprinting by using the aluminum anodizing process. Through two-step anodizing and etching processes, a porous nano-master with anti-reflective surface was fabricated at the large area. Pattern size Pore diameter and inter-pore distance are about 130nm and 200nm, respectively. In order to replicate anti-reflective structure, hot embossing process was performed by varying the processing parameters such as temperature, pressure and embossing time etc. Finally, antireflective surface can be successfully obtained after etching process to remove selectively silicon layer of AAO master.

• Journal of the Korean Solar Energy Society
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• v.23 no.3
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• pp.81-91
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• 2003

본 연구에서는 복층으로 구성된 $WSio_2Al$ 금속절연체의 상세를 보여주고 있는데, 금속과 절연체의 합성물질은 태양 흡수율의 설계와 열적인 현상을 보여주기 위해 종종 사용된다. 금속의 접착기면 위에 얇은 복층 코팅으로 구성되는 디자인은 태양 스펙트럼의 파장권역에서 선택적 흡수를 위함이다. 본 연구는 태양 복사의 열성능 평가를 위해 금속과 절연체 필름의 방사율, 태양흡수율, 코팅순서, 미 반사층(AR)의 두께, 코팅 두께와 코팅 면수, 전체 코팅 두께 등에 대해 시뮬레이션 하였다. 그 결과 네 겹의 코팅설계에서 $Sio_2AR$ 75 nm 두께와 각각의 층에서 $0.5\sim0.7$의 가변 금속부분 구성이 가장 우수한 성능을 갖는 것으로 나타났다. 또한 시뮬레이션으로 금속과 절연체 합성물의 최적의 구성과 각각의 코팅 두께에 대한 예측이 가능했으며, 최대 태양흡수율은 0.94, 방사율은 0.115의 금속과 절연체의 합성물을 구성할 수 있었다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.9
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• pp.593-597
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• 2015

Ni ink for electrohydrodynamic (EHD) continuous jet printing has been developed by using Ni nanoparticles mixed with conhesiveness provider. EHD continuous jet printing was used in order to realize $20{\mu}m$ pattern width. Ink stability was investigated by using Turbi-scan which monitors agglomeration and precipitation of nanoparticles in the ink for three days. The Turbi-scan results showed that the formulated Ni ink had been stable for 3 days without any indication of precipitation across the entire ink. Antireflection coating (ARC) layer in crystalline solar cell wafers was removed by laser ablation technique leading to the formation of 84 grooves where the Ni ink was printed by EHD continuous jet printing. The printability and microstructure of EHD-jet-printed Ni lines were investigated by using optical and electron microscopes. 84 Ni lines with the width less than $20{\mu}m$ were successfully printed by one-time printing without any misalignment and fill the laser-ablated ARC grooves.

• Korean Journal of Optics and Photonics
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• v.13 no.5
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• pp.396-399
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• 2002

Using a bi-layer anti-reflection coating of $TiO_2$and $SiO_2,$ we have achieved a minimum facet reflectivity of $~10^{-5}$ and a band width of 27 nm for a reflectivity of $~10^{-4}$ or less for 1.3 $\mu\textrm{m}$ spot size converter integrated semiconductor lasers. This coating is applicable to external-cavity-tuned laser sources and semiconductor optical amplifiers.

• Journal of the Optical Society of Korea
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• v.17 no.1
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• pp.1-4
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• 2013

For the conventionally polished fused silica substrate, an around 100 nm depth redeposition polishing layer was formed on the top of surface. Polishing compounds, densely embedded in the redeposition polishing layer were the dominant factor that limited the laser induced damage threshold (LIDT) of transmission elements in nanosecond laser systems. Chemical etching, super-precise polishing and ion beam etching were employed in different ways to eliminate these absorbers from the substrate. After that, Antireflection (AR) coatings were deposited on these substrates in the same batch and then tested by 1064 nm nano-pulse laser. It was found that among these techniques only the ion beam etching method, which can effectively remove the polishing compound and did not induce extra absorbers during the disposal process, can successfully improve the LIDT of AR coatings.

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.85.1-85.1
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• 2010

$Cu(In,Ga)Se_2$ (CIGS) thin film solar cell is currently 19.5% higher efficiency and developing a large area technology. The structure of CIGS solar cell that make five unit layers as back contact, light absorption, buffer, front transparent conducting electrode and antireflection to make them sequentially forming. Materials and various compositions of thin film unit which also manufacture a variety method used by the physical and chemical method for CIGS solar cell. The construction and performance test of evaporator for CIGS thin film solar cell has been done. The vapor pressures were changed by using vapor flux meter. The vapor pressure were copper (Cu) $2.1{\times}10^{-7}{\sim}3.0{\times}10^{-7}$ Torr, indium (In) $8.0{\times}10^{-7}{\sim}9.0{\times}10^{-7}$ Torr, gallium (Ga) $1.4{\times}10^{-7}{\sim}2.8{\times}10^{-7}$ Torr, and selenium (Se) $2.1{\times}10^{-6}{\sim}3.2{\times}10^{-6}$ Torr, respectively. The characteristics of the CIGS thin film was investigated by using X-ray diffraction (XRD), scanning electron microscopy/energy dispersive spectroscopy (SEM/EDS) and photoluminescence (PL) spectroscopy using a He-Ne laser. In PL spectrum, temperature dependencies of PL spectra were measured at 1137 nm wavelength.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.28-28
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• 2009

Fabrications of antireflection structures on solar cell were investigated to trap the light and to improve quantum efficiency. Introductions of patterned substrate or textured layer for Si solar cell were performed to prevent reflectance and to increase the path length of incoming light. However, it is difficult to deposit conformally flat electrode on perpendicular plane. ZnO is II-VI compound semiconductor and well-known wide band-gap material. It has similar electrical and optical properties as ITO, but it is nontoxic and stable. In this study, Al-doped ZnO thin films are deposited as transparent electrode by atomic layer deposition method to coat on Si substrate with micro-scale structures. The deposited AZO layer is flatted on horizontal plane as well as perpendicular one with conformal 200 nm thickness. The carrier concentration, mobility and resistivity of deposited AZO thin film on glass substrate were measured $1.4\times10^{20}cm^{-3}$, $93.3cm^2/Vs$, $4.732\times10^{-4}{\Omega}cm$ with high transmittance over 80%. The AZO films were coated with polyimide and performed selective polyimide stripping on head of column by reactive ion etching to measure resistance along columns surface. Current between the micro-columns flows onto the perpendicular plane of deposited AZO film with low resistance.