• Transactions on Electrical and Electronic Materials
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• v.11 no.2
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• pp.73-76
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• 2010

The copper indium disulfide ($CuInS_2$) thin film was manufactured using sputtering and thermal evaporation methods, and the annealing with sulfurization process was used in the vacuum chamber to the substrate temperature on the glass substrate, the annealing temperature and the composition ratio, and the characteristics thereof were investigated. The $CuInS_2$ thin film was manufactured by the sulfurization of a soda lime glass (SLG) Cu/In/S stacked [1] elemental layer deposited on a glass substrate by vacuum chamber annealing [2] with sulfurization for various times at a temperature of substrate temperature of $200^{\circ}C$. The structure and electrical properties of the film was measured in order to determine the optimum conditions for the growth of $CuInS_2$ ternary compound semiconductor $CuInS_2$ thin films with a non-stoichiometric composition. The physical properties of the thin film were investigated under various fabrication conditions [3,4], including the substrate temperature, annealing temperature and annealing time by X-ray diffraction (XRD), field Emission scanning electron microscope (FE-SEM), and Hall measurement systems. [5] The sputtering rate depending upon the DC/RF power was controlled so that the composition ratio of Cu versus In might be around 1:1, and the substrate temperature affecting the quality of the film was varied in the range of room temperature (RT) to $300^{\circ}C$ at intervals of $100^{\circ}C$, and the annealing temperature of the thin film was varied RT to $550^{\circ}C$ in intervals of $100^{\circ}C$.

• Journal of the Korean Society for Heat Treatment
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• v.17 no.4
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• pp.223-229
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• 2004

The effects of the cooling and annealing conditions on the microstructures and corrosion properties were investigated for the Cu-contained Zr-Nb alloy (Zr-1.1Nb-0.07Cu). After annealing at $1050^{\circ}C$ for 15 min, the specimens were cooled by three methods of water quenching, air cooling, and furnace cooling. Widmanstatten structures were developed in both air- and furnace-cooled specimens, and the Widmanstatten plate width of the furnace-cooled specimens was wider than that of the air-cooled ones. The weight gain in the furnace-cooling case was higher than that in the air-cooling case. This could be the reason why the diffusion time was more enough during the furnace cooling than the air cooling. The oxide of the furnace-cooled specimen was nonunformly formed just beneath the Widmanstatten plate boundaries, where ${\beta}_{Zr}$ phases were exised concentrately. Compared with the $640^{\circ}C$ annealing after the water quenching, the $570^{\circ}C$ annealing could make the ${\beta}_{Nb}$ phases and a concomitant reduction of the Nb in the matrix, and then it could improve the corrosion resistance with the increase of the annealing time. It would be concluded that the corrosion resistance of the Zr-1.1Nb-0.07Cu was good when the Nb concentration in the matrix was reached at an equilibrium level and then the ${\beta}_{Nb}$ phase was formed.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.36 no.6
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• pp.576-581
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• 2023

The Ga₂O₃ thin films were deposited using an RF sputtering system and the effect of crystallographic and optical properties under rapid thermal annealing conditions on Ga₂O₃ thin film was evaluated. A rapid thermal annealing method can fabricate a crystalline Ga₂O₃ thin film which is applied to various fields with a low cost and a high efficiency compared with the conventional post-annealing method. In this study, the Ga₂O₃ treated at 900℃ for 1 min showed the beta and gamma phases in XRD measurement. In optical properties, the crystalline Ga₂O₃ represented a high transmittance of more than 80% in the visible region and was calculated with a high optical bandgap energy of 4.58 eV. The beta and gamma phases Ga₂O₃ can be obtained by adjusting the rapid thermal annealing temperatures, and the various properties such as the optical bandgap energy can be controlled. Moreover, it is expected that crystalline Ga₂O₃ can be applied to various devices by controlling not only temperature but process time.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2003.10a
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• pp.633-636
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• 2003

In this work, We, for the first time, present the effects of the thermal annealing of the W/SiO$_2$ multi-layer quarter wavelength reflectors on the resonant properties of the ZnO-based SMR devices. In order to improve the resonant properties of the SMR devices, we annealed thermally the reflectors formed on a silicon substrate using a RF magnetron sputtering technique. As a result, the resonant properties of the SMR devices were observed to strongly depend on the annealing conditions applied to the reflectors. The SMR devices with the reflectors annealed at 40$0^{\circ}C$/30min showed excellent resonance properties as compared to those with the reflectors non-annealed (as-deposited). The newly proposed simple thermal annealing process will be very useful to more effectively improve the resonant properties of the future SMR devices with W/SiO$_2$ multi-layer quarter wavelength reflectors.

• Transactions of Materials Processing
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• v.31 no.4
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• pp.179-185
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• 2022

The influence of post-roll bonding heat treatment conditions such as temperature and time on the variation in the diffusion layer, generated at the bonding interface and the subsequent mechanical properties of the roll-bonded Ti grade 1/Al1050/Ti grade 1 sheets, was systematically investigated. The intermetallic compound (IMC) phase generated by post heat treatment conditions adopted in this study was obviously indexed as monolithic TiAl₃. Whereas the thickness of IMC layer generated by annealing at 500 ℃ was approximately 100 nm scale, it drastically increased above 1.5 ㎛ when annealed at 600 ℃. Uniaxial tensile and peel tests were then performed to compare mechanical properties. As a result, the bonding strength drastically increased above 7.9 N/mm by annealing at 600 ℃, which implies that proper annealing condition was a prerequisite, to improving interface bonding strength as well as global elongation properties for Ti/Al/Ti 3-ply sheet.

• Korean Journal of Materials Research
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• v.19 no.6
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• pp.313-318
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• 2009

Polymer Light Emitting Diodes (PLEDs) with an ITO/PEDOT:PSS/PVK/PFO-poss/LiF/Al structure were prepared on plasma-treated ITO/glass substrates using spin-coating and thermal evaporation methods. The annealing effects of the PFO-poss film when it acts as the emission layer were investigated by using electrical and optical property measurements. The annealing conditions of the PFO-poss emission film were 100 and $200^{\circ}C$ for 1, 2 and 3 hours, respectively. The luminance increased and the turn-on voltage decreased when the annealing temperature and treatment time increased. After examining the Luminance-Voltage (L-V) properties of the PLED, the maximum luminance was found to be 1497 cd/$m^2$ at 11 V for the device when it was annealed at $200^{\circ}C$ for 3 hours. The peak intensity of the PLED emission spectra at approximately 525 nm in wavelength increased when the annealing temperature and time of the PFO-poss film increased. These results suggest that the light emission color shifted from blue to green.

• Progress in Superconductivity and Cryogenics
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• v.8 no.3
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• pp.5-8
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• 2006

The effect of annealing time in Metal Organic Deposition(MOD) method was investigated at reduced total pressure. As the total annealing pressure was reduced, the growth rate of YBCO films increased from 0.14nm/sec at atmospheric pressure to 4.2nm/sec at 1 Torr. For the total pres sure of 700, 500, 300, 100, and 1 Torr, the optimal annealing times of 60, 40, 20, 10, 2minutes were found in our experimental conditions. When the an nealing time was short, poor crystallinity or un-reacted phase was obtained. Also, the degradation of YBCO films occurred when exposed longer to the humid ambient at the high annealing temperature. The reduced pressure was found effective to in crease the growth rate and to control the pore size of the YBCO films in MOD method. A fast growth of MOD-YBCO films was realized with high critical current density over $1MA/cm^2$ using reduced pressure annealing. Large pores, usually observed at atmospheric pressure in MOD method, disappeared and also, the number of pores was reduced.

• Nuclear Engineering and Technology
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• v.55 no.1
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• pp.209-214
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• 2023

The effect of thermal annealing on defect recovery of in-core neutron-irradiated 4H-SiC was investigated. Au/SiC Schottky diodes were manufactured using a 4H-SiC epitaxial wafer that was neutron-irradiated at the HANARO research reactor. The electrical characteristics of their epitaxial layers were analyzed under various conditions, including different neutron fluences (1.3 × 10¹⁷ and 2.7 × 10¹⁷ neutrons/cm²) and annealing times (up to 2 h at 1700 ℃). Capacity-voltage measurements showed high carrier compensation in the neutron-irradiated samples and a recovery tendency that increased with annealing time. The carrier density could be recovered up to 77% of the bare sample. Deep-level-transient spectroscopy revealed intrinsic defects of 4H-SiC with energy levels 0.47 and 0.68 eV below the conduction-band edge, which were significantly increased by in-core neutron irradiation. A previously unknown defect with a high electron-capture cross-section was discovered at 0.36 eV below the conduction-band edge. All defect concentrations decreased with 1700 ℃ annealing; the decrease was faster when the defect level was shallow.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2001.11a
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• pp.55-62
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• 2001

An electrolytic copper rod was drawn up to $90\%$ in area reduction and annealed under various conditions. The EBSD measurement of the drawn wire showed that in the center region the <111> + <100> fiber duplex texture was dominant, while in the middle and surface regions relatively defused textures developed with a little higher density in <11w>//wire axis. The inhomogeneous texture in the deformed wire gave rise to the inhomogeneous microstructure and texture after annealing. The annealing texture could be classified into the recrystallization texture developed during low temperatures and at the early stage at a high temperature and the growth texture developed after a prolonged annealing at the high temperature. The recrystallization temperature could be explained by the strain energy release maximization model and the growth texture was discussed based on the grain boundary mobility anisotropy.

• KIEE International Transactions on Electrophysics and Applications
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• v.3C no.2
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• pp.43-47
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• 2003

Lead zirconate titanate (PZT) thin films were fabricated by the pulsed laser ablation deposition (PLAD) method onto Pt/Ti/SiO$_2$/Si substrates. Crystalline phases as well as preferred orientations in PZT films were investigated by X-ray diffraction analysis (XRD). The well-crystallized perovskite phase and the (101) preferred orientation were obtained by two-step annealing at the conditions of $650^{\circ}C$, 1 hour. It was found that the temperature for the pulsed laser ablated PZT films annealed via a two-step annealing process can be reduced 20$0^{\circ}C$ compared to that of the conventional three-step annealing temperature profile for enhancing the transformation of the perovskite phase. The remanent polarization and the coercive field of this film were about 20 $\mu$C/$\textrm{cm}^2$ and 46 kV/cm, while the dielectric constant and loss values measured at 1 KHz were approximately 860 and 0.04, respectively. The interesting phenomena of this film, such as vertical shift in hysteresis curve, are also discussed.