• 제목/요약/키워드: Amorphous silicon

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박막 실리콘 태양전지의 광열화현상 연구: 비정질 실리콘 태양전지 및 나노양자점 실리콘 박막 태양전지 (Study of Light-induced Degradation in Thin Film Silicon Solar Cells: Hydrogenated Amorphous Silicon Solar Cell and Nano-quantum Dot Silicon Thin Film Solar Cell)

  • 김가현
    • 한국태양에너지학회 논문집
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    • 제39권1호
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    • pp.1-9
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    • 2019
  • Light induced degradation is one of the major research challenges of hydrogenated amorphous silicon related thin film silicon solar cells. Amorphous silicon shows creation of metastable defect states, originating from elevated concentration of dangling bonds during light exposure. The metastable defect states work as recombination centers, and mostly affects quality of intrinsic layer in solar cells. In this paper we present results of light induced degradation in thin film silicon solar cells and discussion on physical origin, mechanism and practical solutions of light induced degradation in thin film silicon solar cells. In-situ light-soaking IV measurement techniques are presented. We also present thin film silicon material with silicon nano-quantum dots embedded within amorphous matrix, which shows superior stability during light-soaking. Our results suggest that solar cell using silicon nano-quantum dots in abosrber layer shows superior stability under light soaking, compared to the conventional amorphous silicon solar cell.

기계적 손상이 비정질 규소박막의 결정화에 미치는 영향 (Effect of mechanical damage on the crystallization of amorphous silicon thin film)

  • 문권진;김영관;윤종규
    • 한국결정성장학회지
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    • 제8권2호
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    • pp.299-306
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    • 1998
  • 비정질 규소가 결정질로 되기 위해서는 활성화가 필요하다. 이 활성화는 레이저 및 로내에서의 열처리로 열에너지를 가하면 달성될 수 있다. 이때 이 열에너지 외에 기계적 에너지 등을 가하면 활성화에 도움이 될 수 있을 것이다. 본 연구에서는 습식연마와 자기이온주입 등의 방법으로 기계적 손상을 주어서 이것이 LPCVD로 증착된 비정질 규소 박막의 결정화에 미치는 영향을 조사하였다. 결정성 확인을 위해서는 XRD와 라만분석법을 사용하였다. 본 연구의 결과, 기계적 손상이 비정질 규소 박막의 결정화를 증진시키는 것을 확인하였다.

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MILC 성장 속도에 비정질 실리콘의 기하학적 형상이 미치는 영향 (The Effect of Geometric Shape of Amorphous Silicon on the MILC Growth Rate)

  • 김영수;김민선;주승기
    • 한국재료학회지
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    • 제14권7호
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    • pp.477-481
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    • 2004
  • High quality polycrystalline silicon is very critical part of the high quality thin film transistor(TFT) for display devices. Metal induced lateral crystallization(MILC) is one of the most successful technologies to crystallize the amorphous silicon at low temperature(below $550^{\circ}C$) and uses conventional and large glass substrate. In this study, we observed that the MILC behavior changed with abrupt variation of the amorphous silicon active pattern width. We explained these phenomena with the novel MILC mechanism model. The 10 nm thick Ni layers were deposited on the glass substrate having various amorphous silicon patterns. Then, we annealed the sample at $550^{\circ}C$ with rapid thermal annealing(RTA) apparatus and measured the crystallized length by optical microscope. When MILC progress from narrow-width-area(the width was $w_2$) to wide-width-area(the width was $w_1$), the MILC rate decreased dramatically and was not changed for several hours(incubation time). Also the incubation time increased as the ratio, $w_1/w_2$, get larger. We can explain these phenomena with the tensile stress that was caused by volume shrinkage due to the phase transformation from amorphous silicon to crystalline silicon.

고효율 실리콘 박막태양전지를 위한 신규 수소저감형 비정질실리콘 산화막 버퍼층 개발 (A Novel Hydrogen-reduced P-type Amorphous Silicon Oxide Buffer Layer for Highly Efficient Amorphous Silicon Thin Film Solar Cells)

  • 강동원
    • 전기학회논문지
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    • 제65권10호
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    • pp.1702-1705
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    • 2016
  • We propose a novel hydrogen-reduced p-type amorphous silicon oxide buffer layer between $TiO_2$ antireflection layer and p-type silicon window layer of silicon thin film solar cells. This new buffer layer can protect underlying the $TiO_2$ by suppressing hydrogen plasma, which could be made by excluding $H_2$ gas introduction during plasma deposition. Amorphous silicon oxide thin film solar cells with employing the new buffer layer exhibited better conversion efficiency (8.10 %) compared with the standard cell (7.88 %) without the buffer layer. This new buffer layer can be processed in the same p-chamber with in-situ mode before depositing main p-type amorphous silicon oxide window layer. Comparing with state-of-the-art buffer layer of AZO/p-nc-SiOx:H, our new buffer layer can be processed with cost-effective, much simple process based on similar device performances.

Enhanced Crystallization of Amorphous Silicon using Electric Field

  • Song, Kyung-Sub;Jun, Seung-Ik;Park, Sang-Hyun;Park, Duck-Kyun
    • 한국결정성장학회:학술대회논문집
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    • 한국결정성장학회 1997년도 Proceedings of the 12th KACG Technical Meeting and the 4th Korea-Japan EMGS (Electronic Materials Growth Symposium)
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    • pp.243-246
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    • 1997
  • A new technique for low temperature crystallization of amorphous silicon, called field aided lateral crystallization(FALC) was attempted. To demonstrate the concept of FALC, thin layer of nickel(30${\AA}$) was deposited on top of amorphous silicon film and the electric field was applied during the crystallization. The effects of electric field on the crystallization behavior of amorphous silicon film were investigated.

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Structural Effect on Backlight Induced-leakage Current in Amorphous Silicon Thin Film Transistor

  • Kim, Sho-Yeon;Kim, Tae-Hyun;Jeon, Jae-Hong;Choe, Hee-Hwan;Lee, Kang-Woong;Seo, Jong-Hyun
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권2호
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    • pp.1308-1311
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    • 2007
  • Leakage current produced by backside illumination on bottom-gated amorphous silicon thin film transistor has been investigated. The experimental results show that the leakage current of bottomgated structure is significantly dependent on the shape of amorphous silicon pattern. A proper design of amorphous silicon pattern has been suggested in viewpoint of reducing the leakage current as well as mass production.

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Solid-Phase crystallization of amorphous silicon films deposited by plasma-enhanced chemical vapor deposition

  • Lee, Jung-Keun
    • Journal of Korean Vacuum Science & Technology
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    • 제2권1호
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    • pp.49-54
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    • 1998
  • The effect of deposition paratmeters on the solid-phase crystallization of amorphous silicon films deposited by plasma-enhanced chemical vapor deposition has been investigated by x-ray diffraction. The amorphous silicon films were prepared on Si(100) wafers using SiH4 gas with and without H2 dilution at the substrate temperatures between 12$^{\circ}C$ and 38$0^{\circ}C$. The R. F. powers and the deposition pressures were also varied. After crystallizing at $600^{\circ}C$ for 24h, the films exhibited (111), (220), and (311) x-ray diffraction peaks. The (111) peak intensity increased as the substrate temperature decreased, and the H dilution suppressed the crystallization. Increasing R.F. powers within the limits of etching level and increasing deposition pressures also have enhanced the peak intensity. The peak intensity was closely related to the deposition rate, which may be an indirect indicator of structural disorder in amorphous silicon films. Our results are consistent with the fact that an increase of the structural disorder I amorphous silicon films enhances the grain size in the crystallized films.

Crystallization of Amorphous Silicon Films Using Joule Heating

  • Ro, Jae-Sang
    • 한국표면공학회지
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    • 제47권1호
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    • pp.20-24
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    • 2014
  • Joule heat is generated by applying an electric filed to a conductive layer located beneath or above the amorphous silicon film, and is used to raise the temperature of the silicon film to crystallization temperature. An electric field was applied to an indium tin oxide (ITO) conductive layer to induce Joule heating in order to carry out the crystallization of amorphous silicon. Polycrystalline silicon was produced within the range of a millisecond. To investigate the kinetics of Joule-heating induced crystallization (JIC) solid phase crystallization was conducted using amorphous silicon films deposited by plasma enhanced chemical vapor deposition and using tube furnace in nitrogen ambient. Microscopic and macroscopic uniformity of crystallinity of JIC poly-Si was measured to have better uniformity compared to that of poly-Si produced by other methods such as metal induced crystallization and Excimer laser crystallization.

Cl2/HBr/O2 고밀도 플라즈마에서 비정질 실리콘 게이트 식각공정 특성 (Characteristics of Amorphous Silicon Gate Etching in Cl2/HBr/O2 High Density Plasma)

  • 이원규
    • Korean Chemical Engineering Research
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    • 제47권1호
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    • pp.79-83
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    • 2009
  • 본 연구에서 고밀도 플라즈마 식각 장치를 사용한 비정질 실리콘 막의 게이트 전극선 형성공정에서 여러 가지 식각 변수가 치수 제어와 식각 속도 및 식각 선택비 등 식각 특성에 미치는 영향을 분석하였다. $Cl_2/HBr/O_2$로 구성된 식각 기체의 전체 유량을 증가시키면 비정질 실리콘의 식각 속도가 증가하나 식각 전후의 형상치수는 변화없이 거의 일정하였다. 전체 유량을 고정시키고 $Cl_2$와 HBr 간의 유량비를 변화시키면 HBr의 유량이 커질수록 비정질 실리콘의 식각 속도가 감소하였다. $O_2$의 유량을 증가시키면 산화막의 식각 속도가 상대적으로 낮아져 식각 선택비를 증가시켜 식각 공정의 안정성을 높이나 게이트 전극선을 경사지게 하는 특성을 보인다. Source power의 증가는 비정질 실리콘 식각 속도의 증가와 더불어 형상치수의 증가를 가져오며, bias power의 증가는 비정질 실리콘과 산화막의 식각 속도를 증가시키나 식각 선택비를 크게 감소시키는 경향을 보였다.

플라즈마 화학기상증착법을 이용한 비정질 규소 및 질화규소의 저온성막 연구 (Low-Temperature Processing of Amorphous Silicon and Silicon-Nitride Films Using PECVD Method)

  • 이호년
    • 한국산학기술학회논문지
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    • 제8권5호
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    • pp.1013-1019
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    • 2007
  • [ $150^{\circ}C$ ]의 저온에서 플라즈마 화학기상증착 (PECVD) 방법으로 비정질 규소 및 질화규소 박막을 성막 하였다. 비정질 질화규소 박막은 소스 가스의 수소 분율을 증가시킴에 따라 굴절률이 1.9에 접근하고 질소-수소 결합이 주도적이 되어 고온성막한 박막에 버금가는 특성을 보였다. 비정질 규소 박막은 소스 가스의 수소 분율을 높임에 따라 굴절률과 광학적 금지대역의 크기가 고온 성막된 박막의 값인 4.2와 1.8 eV에 근접한 값을 가지게 되었으며, $[Si-H]/([Si-H]+[Si-H_2])$의 값이 증가하여 양질의 박막특성을 얻을 수 있었다. RF 전력 및 증착 압력에 대해서 낮은 전력과 작은 압력에서 양질의 박막을 얻을 수 있었으며, 박막 특성은 RF 전력 보다는 증착 압력의 변화에 대해서 좀더 큰 의존성을 보였다. 박막트랜지스터 제작에 적용 가능한 양질의 비정질 규소 및 질화규소 박막을 저온에서 얻기 위해서는 소스 가스의 수소 분율을 높게 하는 것이 중요한 공통 인자로 파악되었다.

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