• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2013.05a
• /
• pp.641-642
• /
• 2013

• The korean journal of orthodontics
• /
• v.46 no.2
• /
• pp.65-72
• /
• 2016

Objective: The purposes of this study were to measure the orthodontic forces generated by thermoplastic aligners and investigate the possible influences of different activations for lingual bodily movements on orthodontic forces, and their attenuation. Methods: Thermoplastic material of 1.0-mm in thickness was used to manufacture aligners for 0.2, 0.3, 0.4, 0.5, and 0.6 mm activations for lingual bodily movements of the maxillary central incisor. The orthodontic force in the lingual direction delivered by the thermoplastic aligners was measured using a micro-stress sensor system for the invisible orthodontic technique, and was monitored for 2 weeks. Results: Orthodontic force increased with the amount of activation of the aligner in the initial measurements. The attenuation speed in the 0.6 mm group was faster than that of the other groups (p < 0.05). All aligners demonstrated rapid relaxation in the first 8 hours, which then decreased slowly and plateaued on day 4 or 5. Conclusions: The amount of activation had a substantial influence on the orthodontic force imparted by the aligners. The results suggest that the activation of lingual bodily movement of the maxillary central incisor should not exceed 0.5 mm. The initial 4 or 5 days is important with respect to orthodontic treatment incorporating an aligner.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2004.10a
• /
• pp.1376-1379
• /
• 2004

This study is designed integration and control system of GaAs bonding system consisted of multi-processing using DeviceNet and GEM-Protocol. Developing bonding system is composed of resin coating, pre-baking pre-aligner, bonding, material handler(flip robot), and wafer cassette, etc. This system has process-fluent of each a process and share information using GEM-protocol. This study devised virtual bonding simulator to control and to monitor bonding system efficiently. Also we can verify optimizing of system previously through a virtual bonding simulator.

• Journal of the Semiconductor & Display Technology
• /
• v.9 no.3
• /
• pp.47-51
• /
• 2010

This paper presents a wafer pre-alignment system which is improved using the image of the entire wafer area. In the previous method, image acquisition for wafer takes about 80% of total pre-alignment time. The proposed system uses only one image of entire wafer area via a high-resolution CMOS camera, and so image acquisition accounts for nearly 1% of total process time. The larger FOV(field of view) to use the image of the entire wafer area worsen camera lens distortion. A camera calibration using high order polynomials is used for accurate lens distortion correction. And template matching is used to find a correct notch's position. The performance of the proposed system was demonstrated by experiments of wafer center alignment and notch alignment.

• Journal of the Semiconductor & Display Technology
• /
• v.9 no.1
• /
• pp.11-16
• /
• 2010

Wafer Pre-Alignment is to find the center and the orientation of a wafer and to move the wafer to the desired position and orientation. In this paper, an area camera based pre-aligning method is presented that captures 8 wafer images regularly during 360 degrees rotation. From the images, wafer edge positions are extracted and used to estimate the wafer's center and orientation using least squares circle fitting. These data are utilized for the proper alignment of the wafer. For accurate alignments, camera calibration methods using high order polynomials are used for converting pixel coordinates into real-world coordinates. A complete pre-alignment system was constructed using mechanical and optical components and tested. Experimental results show that alignment of wafer center and orientation can be done with the standard deviation of 0.002 mm and 0.028 degree, respectively.

• Transactions of the Korean Society for Noise and Vibration Engineering
• /
• v.12 no.1
• /
• pp.65-72
• /
• 2002

Generally, there are laser operating equipments( aligner, stepper) and electronic microscope( SEM, TEM) as a high precision manufacturing and inspection equipment in semiconductor production companies, precision examination and measuring laboratories. Mostly, these equipments are characterized by projection and target part. The relative displacements between projection and target part are dominant roles in vibrational problem in these precision equipments. These relative displacements are determined by the position of incoming vibration and the difference of vibration response in projection and target part. In this study, the allowable vibrational limits are suggested and the vibrational reduction plans are proposed by measurement and analysis of vibration phenomenon in the Clean Room in PDP(plasma display panel) production building. The vibration performance is evaluated by comparison relative displacements between projection and target part before/after the vibration isolation plan.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.19 no.6
• /
• pp.538-546
• /
• 2006

We report on characteristics of specially designed inductively-coupled-plasma chemical vapor deposition (ICP-CVD) system for top-emitting organic light emitting diodes (TOLEDs). Using high-density plasma on the order of $10^{11}$ electrons/$cm^3$ generated by linear-type antennas connected in parallel and specially designed substrate cooling system, a 100 nm-thick transparent $SiN_{x}$ passivation layer was deposited on thin Mg-Ag cathode layer at substrate temperature below $50\;^{\circ}C$ without a noticeable plasma damage. In addition, substrate-mask chucking system equipped with a mechanical mask aligner enabled us to pattern the $SiN_x$ passivation layer without conventional lithography processes. Even at low substrate temperature, a $SiN_x$ passivation layer prepared by ICP-CVD shows a good moisture resistance and transparency of $5{\times}10^{-3}g/m^2/day$ and 92 %, respectively. This indicates that the ICP-CVD system is a promising methode to substitute conventional plasma enhanced CVD (PECVD) in thin film passivation process.

• Journal of the Korean Society for Precision Engineering
• /
• v.19 no.12
• /
• pp.163-170
• /
• 2002

The quality of a precision product, in general, relies on the accuracy and precision of its manufacturing and inspection process. In many cases, the level of precision in the manufacturing and inspection system is also dependent on the positioning capability of tool with respect to the work piece in the process. Recently the positioning accuracy level has reached to the level of submicron and long range of motion is required. For example, for 1 GDARM lithography, 20nm accuracy and 300mm stroke needs. This paper refers to the lithography stage especially to fine stage. In this study, for long stroke and high accuracy, the dual servo system is proposed. For the coarse actuator, LDM (Linear DC Motor) is used and for fine one VCM is used. In this study, we propose the new structure of VCM for the fine actuator. It is 3 axis precision positioning stage for an aligner system. After we perform the optimal design of the stage to obtain the maximum force, which is related to the acceleration of the stage to accomplish throughput of product. And we controlled this fine stage with TDC. So we obtained 50nm resolution. So later more works will be done to obtain better accuracy.

• Transactions of the Korean Society of Machine Tool Engineers
• /
• v.17 no.1
• /
• pp.132-136
• /
• 2008

Axis of rotation error on rotary system are significant; such as the spindle radial error motion of a aligner, wire bonder and inspector machine which results in the poor state of manufactured goods. In this paper, the simple stage which consists of one PZT actuator and rotary encoder, is analyzed and measured by high resolution capacitance type displacement sensor. As the result of experiment, the paper discusses several issues that must be considered when designing rotary stage driven by PZT.

• Journal of Advanced Navigation Technology
• /
• v.13 no.3
• /
• pp.412-418
• /
• 2009

This study aims to develop a system that enables 20 to 25 wafers to be automatically aligned at the position of the corresponding serial number and facilitates the checkout of wafer processing by sensing them before and after semiconductor processing. It also suggests compensation algorithm and stepper motor control algorithm that carefully align notches. This study minimizes the rate of occurrence by adopting materials of which the surface has proper coefficient of friction when wafers are rotating and that do not rarely produce particles. This study completed the development of a slip resistance apparatus and carried out performance tests through mathematical verification. This system is expected to improve semiconductor yield due to anti-pollution technology in semiconductor processing and can be selectively applied to a large size wafer over 450mm in the future.