• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2013년도 춘계학술대회 논문집
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• pp.641-642
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• 2013

• 대한치과교정학회지
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• 제46권2호
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• pp.65-72
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• 2016

Objective: The purposes of this study were to measure the orthodontic forces generated by thermoplastic aligners and investigate the possible influences of different activations for lingual bodily movements on orthodontic forces, and their attenuation. Methods: Thermoplastic material of 1.0-mm in thickness was used to manufacture aligners for 0.2, 0.3, 0.4, 0.5, and 0.6 mm activations for lingual bodily movements of the maxillary central incisor. The orthodontic force in the lingual direction delivered by the thermoplastic aligners was measured using a micro-stress sensor system for the invisible orthodontic technique, and was monitored for 2 weeks. Results: Orthodontic force increased with the amount of activation of the aligner in the initial measurements. The attenuation speed in the 0.6 mm group was faster than that of the other groups (p < 0.05). All aligners demonstrated rapid relaxation in the first 8 hours, which then decreased slowly and plateaued on day 4 or 5. Conclusions: The amount of activation had a substantial influence on the orthodontic force imparted by the aligners. The results suggest that the activation of lingual bodily movement of the maxillary central incisor should not exceed 0.5 mm. The initial 4 or 5 days is important with respect to orthodontic treatment incorporating an aligner.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 추계학술대회 논문집
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• pp.1376-1379
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• 2004

This study is designed integration and control system of GaAs bonding system consisted of multi-processing using DeviceNet and GEM-Protocol. Developing bonding system is composed of resin coating, pre-baking pre-aligner, bonding, material handler(flip robot), and wafer cassette, etc. This system has process-fluent of each a process and share information using GEM-protocol. This study devised virtual bonding simulator to control and to monitor bonding system efficiently. Also we can verify optimizing of system previously through a virtual bonding simulator.

• 반도체디스플레이기술학회지
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• 제9권3호
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• pp.47-51
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• 2010

This paper presents a wafer pre-alignment system which is improved using the image of the entire wafer area. In the previous method, image acquisition for wafer takes about 80% of total pre-alignment time. The proposed system uses only one image of entire wafer area via a high-resolution CMOS camera, and so image acquisition accounts for nearly 1% of total process time. The larger FOV(field of view) to use the image of the entire wafer area worsen camera lens distortion. A camera calibration using high order polynomials is used for accurate lens distortion correction. And template matching is used to find a correct notch's position. The performance of the proposed system was demonstrated by experiments of wafer center alignment and notch alignment.

• 반도체디스플레이기술학회지
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• 제9권1호
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• pp.11-16
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• 2010

Wafer Pre-Alignment is to find the center and the orientation of a wafer and to move the wafer to the desired position and orientation. In this paper, an area camera based pre-aligning method is presented that captures 8 wafer images regularly during 360 degrees rotation. From the images, wafer edge positions are extracted and used to estimate the wafer's center and orientation using least squares circle fitting. These data are utilized for the proper alignment of the wafer. For accurate alignments, camera calibration methods using high order polynomials are used for converting pixel coordinates into real-world coordinates. A complete pre-alignment system was constructed using mechanical and optical components and tested. Experimental results show that alignment of wafer center and orientation can be done with the standard deviation of 0.002 mm and 0.028 degree, respectively.

• 한국소음진동공학회논문집
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• 제12권1호
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• pp.65-72
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• 2002

Generally, there are laser operating equipments( aligner, stepper) and electronic microscope( SEM, TEM) as a high precision manufacturing and inspection equipment in semiconductor production companies, precision examination and measuring laboratories. Mostly, these equipments are characterized by projection and target part. The relative displacements between projection and target part are dominant roles in vibrational problem in these precision equipments. These relative displacements are determined by the position of incoming vibration and the difference of vibration response in projection and target part. In this study, the allowable vibrational limits are suggested and the vibrational reduction plans are proposed by measurement and analysis of vibration phenomenon in the Clean Room in PDP(plasma display panel) production building. The vibration performance is evaluated by comparison relative displacements between projection and target part before/after the vibration isolation plan.

• 한국전기전자재료학회논문지
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• 제19권6호
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• pp.538-546
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• 2006

We report on characteristics of specially designed inductively-coupled-plasma chemical vapor deposition (ICP-CVD) system for top-emitting organic light emitting diodes (TOLEDs). Using high-density plasma on the order of $10^{11}$ electrons/$cm^3$ generated by linear-type antennas connected in parallel and specially designed substrate cooling system, a 100 nm-thick transparent $SiN_{x}$ passivation layer was deposited on thin Mg-Ag cathode layer at substrate temperature below $50\;^{\circ}C$ without a noticeable plasma damage. In addition, substrate-mask chucking system equipped with a mechanical mask aligner enabled us to pattern the $SiN_x$ passivation layer without conventional lithography processes. Even at low substrate temperature, a $SiN_x$ passivation layer prepared by ICP-CVD shows a good moisture resistance and transparency of $5{\times}10^{-3}g/m^2/day$ and 92 %, respectively. This indicates that the ICP-CVD system is a promising methode to substitute conventional plasma enhanced CVD (PECVD) in thin film passivation process.

• 한국정밀공학회지
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• 제19권12호
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• pp.163-170
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• 2002

The quality of a precision product, in general, relies on the accuracy and precision of its manufacturing and inspection process. In many cases, the level of precision in the manufacturing and inspection system is also dependent on the positioning capability of tool with respect to the work piece in the process. Recently the positioning accuracy level has reached to the level of submicron and long range of motion is required. For example, for 1 GDARM lithography, 20nm accuracy and 300mm stroke needs. This paper refers to the lithography stage especially to fine stage. In this study, for long stroke and high accuracy, the dual servo system is proposed. For the coarse actuator, LDM (Linear DC Motor) is used and for fine one VCM is used. In this study, we propose the new structure of VCM for the fine actuator. It is 3 axis precision positioning stage for an aligner system. After we perform the optimal design of the stage to obtain the maximum force, which is related to the acceleration of the stage to accomplish throughput of product. And we controlled this fine stage with TDC. So we obtained 50nm resolution. So later more works will be done to obtain better accuracy.

• 한국공작기계학회논문집
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• 제17권1호
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• pp.132-136
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• 2008

Axis of rotation error on rotary system are significant; such as the spindle radial error motion of a aligner, wire bonder and inspector machine which results in the poor state of manufactured goods. In this paper, the simple stage which consists of one PZT actuator and rotary encoder, is analyzed and measured by high resolution capacitance type displacement sensor. As the result of experiment, the paper discusses several issues that must be considered when designing rotary stage driven by PZT.

• 한국항행학회논문지
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• 제13권3호
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• pp.412-418
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• 2009

본 논문에서는 노치형 웨이퍼 20~25개를 일련번호가 같은 위치에 자동으로 정렬이 되도록 하여 반도체 공정 전, 후 감지기에 의해 웨이퍼의 공정상태 파악을 용이하게 하는 시스템 개발 및 정확하게 노치를 정렬하는 보정 알고리즘, 스테핑 모터 제어 알고리즘을 제안하였다. 웨이퍼 회전 시 표면 재질이 적당한 마찰 계수를 가지며 웨이퍼의 회전으로 파티클(Particle)이 발생하지 않는 소재를 사용하여 발생을 최소화 시킬 수 있었다. 또한 미끄럼 방지를 위한 기구설계 기술을 개발하였고, 수학적 검증을 통한 성능평가를 실시하였다. 본 연구 개발 시스템은 반도체 공정 진행 중 웨이퍼의 오염 방지로 반도체 수율을 향상 시킬 수 있으며, 향후 450mm 이상의 대형 웨이퍼 생성 시에도 탄력적으로 적용 할 수 있다.