• Proceedings of the KIEE Conference
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• 2004.11a
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• pp.72-74
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• 2004

In this study, we used a inductively coupled plasma (ICP) source for etching $Al_2O_3$ thin films because of its high plasma density, low process pressure and easy control bias power. $Al_2O_3$ thin films were etched using $Cl_2/BCl_3$, $N_2/Cl_2/BCl_3$, and Ar/$Cl_2/BCl_3$ plasma. The experiments were carried out measuring the etch rates and the selectivities of $Al_2O_3$ to $SiO_2$ as a function of gas mixing ratio, rf power, and chamber pressure. When $Cl_2$ 50% was added to $Cl_2/BCl_3$ plasma, the etch rate of the $Al_2O_3$ films was 118 nm/min. We also investigated the effect of gas addition. In case of $N_2$ addition, the etch rate of the $Al_2O_3$ films decreased while $N_2$ was added into $Cl_2/BCl_3$ plasma. However, the etch rate increased slightly as Ar added into $Cl_2/BCl_3$ plasma, and then further increase of Ar decreased the etch rate. The maximum etch rate was 130 nm/min at Ar 20% in $Cl_2/BCl_3$ plasma, and the highest etch selectivity was 0.81 in $N_2$ 20% in $Cl_2/BCl_3$ plasma. And, we obtained the results that the etch rate increases as rf power increases and chamber pressure decreases. The characteristics of the plasmas were estimated using optical emission spectroscopy (OES).

• Journal of Powder Materials
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• v.26 no.5
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• pp.395-404
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• 2019

Aluminum nitride (AlN) has excellent electrical insulation property, high thermal conductivity, and a low thermal expansion coefficient; therefore, it is widely used as a heat sink, heat-conductive filler, and heat dissipation substrate. However, it is well known that the AlN-based materials have disadvantages such as low sinterability and poor mechanical properties. In this study, the effects of addition of various amounts (1-6 wt.%) of sintering additives $Y_2O_3$ and $Sm_2O_3$ on the thermal and mechanical properties of AlN samples pressureless sintered at $1850^{\circ}C$ in an $N_2$ atmosphere for a holding time of 2 h are examined. All AlN samples exhibit relative densities of more than 97%. It showed that the higher thermal conductivity as the $Y_2O_3$ content increased than the $Sm_2O_3$ additive, whereas all AlN samples exhibited higher mechanical properties as $Sm_2O_3$ content increased. The formation of secondary phases by reaction of $Y_2O_3$, $Sm_2O_3$ with oxygen from AlN lattice influenced the thermal and mechanical properties of AlN samples due to the reaction of the oxygen contents in AlN lattice.

• Journal of the Korean Ceramic Society
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• v.27 no.5
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• pp.583-588
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• 1990

Glass films in the binary system B2O3-SiO2 and Al2O3-SiO2 were prepared on soda-lime-silica slide glass by the dip-coating technique from TEOS and boric acid or aluminum nitrate. Thickness of the films varying with viscosity and withdrawal speed were measured and effect of composition and firing temperature on the properties such as transmittance and refractive index were investigated. nM2O3.(100-n)SiO2(M=B or Al) films containing up to 20mol% B2O3 and 40mol% Al2O3 were transparent. Maximum transmittance at visible range were obtained for the sample containing 15mol% Ba2O3 and 32.5mol% Al2O3 and heat-treated at 50$0^{\circ}C$, respectively. Refractive index of the film containing 15mol% B2O3 was mininum in the B2O3-SiO2 binary system and minimal refractive index was appeared at the film containing 32.5mol% Al2O3. In IP spectra, addition of B2O3 were increased absorption peak intensity of B-O and Si-O-B bond and addition of Al2O3 were decreased absorption peak intensity of Si-O bond, respectively.

• Journal of the Korean Ceramic Society
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• v.42 no.8 s.279
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• pp.582-587
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• 2005

AlN-BN ceramic composites were fabricated and their mechanical properties were investigated. The relative density of hot-pressed composites decreased with increasing BN content, but over $99\%$ could be obtained with 30 $vol\%$ BN in AlN. YAG was formed in the composites and monolithic AlN as a second phase by the reaction between $Y_2O_3$, added as sintering aid, and $Al_2O_3$. As expected, Vickers hardness and Young's modulus decreased with increasing BN content. The three-point flexural strength also showed similar behavior decreasing from 500 MPa of monolith down to 250 MPa by the addition 30 $vol\%$ BN. However, interestingly, the standard deviation of the strength values decreased significantly as BN was added to AlN. As a result, the Weibull modulus of the AlN-30 $vol\% BN composite was 21.3, which was extremely high. Fractography and crack path studies revealed that BN platelets induced grain pull-out and crack bridging in a bigger scale during crack propagation. Consequently, fracture toughness increased as more BN was added, reaching 4.5 $MPa\sqrt{m}$ at 40 $vol\%$ BN.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.25 no.4
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• pp.127-134
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• 2015

Aluminum nitride (AlN) single crystals have attracted much attention for a next-generation semiconductor application because of wide bandgap (6.2 eV), high thermal conductivity ($285W/m{\cdot}K$), high electrical resistivity (${\geq}10^{14}{\Omega}{\cdot}cm$), and high mechanical strength. The bulk AlN single crystals or thin film templates have been mainly grown by PVT (sublimation) method, flux method, solution growth method, and hydride vapor phase epitaxy (HVPE) method. Since AlN suffers difficulty in commercialization due to the defects that occur during single crystal growth, crystalline quality improvement via defects analyses is necessary. Etch pit density (EPD) analysis showed that the growth misorientations and the defects in the AlN surface exist. Transmission electron microscopy (TEM) and electron back-scattered diffraction (EBSD) analyses were employed to investigate the overall crystalline quality and various kinds of defects. TEM studies show that the morphology of the AlN is clearly influenced by stacking fault, dislocation, second phase, etc. In addition EBSD analysis also showed that the zinc blende polymorph of AlN exists as a growth defects resulting in dislocation initiator.

• Journal of the Korean Ceramic Society
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• v.34 no.4
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• pp.406-412
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• 1997

Al2O3/SiC hybrid-composite has been fabricated by the conventional powder process. The addition of $\alpha$-Al2O3 as seed particles in the transformation of ${\gamma}$-Al2O3 to $\alpha$-Al2O3 provided a homogeneity of the microstructure. The grain growth of Al2O3 are significantly surpressed by the addition of nano-size SiC particles. Dislocation were produced due to the difference of thermal expansion coefficient between Al2O3 and SiC and piled up on SiC particles in Al2O3 matrix, resulting in transgranular fracture. The high fracture strength of the composite was contributed to the grain refinement and the transgranular fracture mode. The addition of SiC platelets to Al2O3/SiC nano-composite decreased the fracture strength, but increased the fracture toughness. Coated SiC platelets with nitrides such as BN and Si3N4 enhanced fracture toughness much more than non-coated SiC platelets by enhancing crack deflection.

• Journal of Korean Society of Environmental Engineers
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• v.34 no.5
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• pp.295-303
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• 2012

Removal of total nitrogen (T-N) and total phosphorus (T-P) was evaluated in a DEPHANOX process by adding Al(III) to the separator to maintain T-P in the final effluent below 0.2 mg/L. pH in each reactor was maintained 7~8 after addition of Al(III) to the levels of 5, 10, 15 mg/L. The removal efficiency of COD and T-N decreased at higher Al(III) dose, but T-P removal efficiency increased from 76.28 to 84.02, 94.66% at Al(III) dose of 5, 10, 15 mg/L, respectively. T-P in effluent showed 0.17 mg/L at Al(III) dose of 15 mg/L. Minimum 15 mg/L of Al(III) was required to maitain T-P below 0.2 mg/L in the final effluent.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.8
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• pp.13-19
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• 2001

We report on the fabrication and characterization of $Al_{0.3}Ga_{0.7}N$ HFETs with different barrier layer thickness which were grown using plasma-assisted molecular beam epitaxy (PAMBE). The barrier thickness of $Al_{0.3}Ga_{0.7}N$/GaN HFETs could be optimized in order to maximize 2 dimensional electron gas induced by piezoelectric effect without the relaxation of $Al_{0.3}Ga_{0.7}N$ layer. $Al_{0.3}Ga_{0.7}N$/GaN (20 nm/2 mm) HFET with 0.6 ${\mu}m$-long and 34 ${\mu}m$-wide gate shows saturated current density ($V_{gs}=1\;V$) of 1.155 A/mm and transconductance of 250 ms/mm, respectively. From high frequency measurement, the fabricated $Al_{0.3}Ga_{0.7}N$/GaN HFETs showed $F_t=13$ GHz and $F_{max}=48$ GHz, respectively. The uniformity of less than 5% could be obtained over the 2 inch wafer. In addition to the optimization of epi-layer structure, the relation between breakdown voltage and high frequency characteristics has been examined.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.8 no.1
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• pp.97-105
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• 1998

Antioxidation mechanism of Al metal powders on $Al_2O_3-C$ refractory was investigated in temperature range from 800 to $1400^{\circ}C$. The addition of 5 wt% Al metal powders suppressed the oxidation of carbon in $Al_2O_3$-C sample. The carbons were distributed uniformly on the surface and the interface of the $Al_2O_3$-C-Al. Reaction products of $Al_4C_3$ and AIN were found with a composition of Al-C at temperatures between 800 and $1200^{\circ}C$ and transformed to $Al_2O_3$ above $1400^{\circ}C$. Cavity structures related to the to the formation of $Al_4C_3$ were observed for the AI-C after heating at $1000^{\circ}C$ ofr 1 hour. Thermodynamic mechanism was considered to discuss the formation $Al_4C_3$, AlN and their transformation to $Al_2O_3$, which leads to the effect of oxidation resistance.

• Journal of the Korean Society for Heat Treatment
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• v.37 no.4
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• pp.163-171
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• 2024

SCR420H steel is a low-carbon chromium alloy steel designed for carburizing heat treatment. Recently, research is being conducted on high-temperature carburization heat treatment to reduce costs and CO₂ emissions by shortening the carburization time to meet the international carbon neutral policy. However, this high-temperature carburization heat treatment coarsens the steel grains and causes a decrease in mechanical properties. In this study, a large amount of Ti was added to increase the grain refinement effect in the high-temperature carburizing process. We investigated the microstructure and precipitates of SCR420H steel without Ti (Al steel) and with Ti (AlTi steel). Thermodynamic calculations showed that the AlN and (Ti,Nb)(C,N) precipitated in Al steel, while (Ti,Nb)(C,N) and Ti₄C₂S₂ precipitated in AlTi steel. Addition of Ti increases the fraction of bainite after reheating process. Transmission electron microscopy analysis shows that small amounts of AlN and (Ti,Nb)(C,N) precipitates are formed in the Al steel. The addition of Ti increases the density of (Ti,Nb)(C,N) precipitates and induces the formation of Ti₄C₂S₂ precipitates, increasing the grain coarsening temperature (GCT) under all heat treatment conditions. Higher reheating temperatures also resulted in higher GCT values due to increased precipitation.