• Current Photovoltaic Research
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• v.8 no.2
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• pp.50-53
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• 2020

GaN based photoelectrode has shown good potential owing to its better chemical stability and tunable bandgap with materials such as InN and AlN. Tunable bandgap allows GaN to make the maximum utilization of solar spectrum, which could improve photoelectrode performance. However, the problems about low photoelectrode performance and photo-corrosion still remain. In this study, we attempt to investigate the photoelectrochemical (PEC) properties of phosphor application to InGaN photoelectrode. Experimental result shows YAG:Ce³⁺ and beta-SiALON phosphor result in the highest photoelectrode performance of InGaN.

• Electrical & Electronic Materials
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• v.9 no.6
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• pp.564-571
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• 1996

We calculated the drift-velocities of electrons and holes of I $n_{0.53}$(A $l_{x}$G $a_{1-x}$ )$_{0.47}$As, which is used for semiconductor materials of high performance HBTs, along with the various doping concentrations and Al mole fractions as well as the electric fields by Monte Carlo experiment. Especially, for the valence bands the accuracy of hole-drift-velocity was improved in the consideration of intervalley scattering due to the inelastic scattering of acoustic phonon. From the results the empirical formulas of the low- and high field mobility of electrons and holes were extracted by using nonlinear least square fitting method. The accuracy of the formulas was proved by comparing the formula of low-field electron mobility as well as drift-velocity of I $n_{0.53}$ G $a_{0.47}$As and of low-field hole mobility of GaAs with the measured values, where the error was below 10%. For the high-field mobilities of electron and hole the results calculated by the formulas were very well matched with the MC experimental results except at the narrow field range where the electrons produced the velocity overshoot and the corresponding error was about 30%.0%. 30%.0%.

• Membrane Journal
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• v.22 no.6
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• pp.424-434
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• 2012

In this study, a ceramic membrane was prepared by CVD. Tube type alpha alumina support was used for substrate and added the Ga salt in intermediate layer. Synthesized method was counter diffusion CVD method at $650^{\circ}C$ with tetramethylorthosilane (TMOS). Gas permeation was measured at $600^{\circ}C$ using single-component $H_2$, $N_2$, $CO_2$ and $CH_4$. During the steam treatment, $H_2/N_2$ permselectivity of non-Ga silica membrane was decreased 926 to 829 at $600^{\circ}C$. On the other hand $H_2/N_2$ permselectivity of added Ga silica membrane was stable 910 to 904 at $600^{\circ}C$. These results show that the metal-doped membranes improved steam stability for gas separation.

• Proceedings of the Materials Research Society of Korea Conference
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• 1999.11a
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• pp.69-69
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• 1999

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.148-148
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• 2011

일반적으로 LED 제작에 사용되는 c-plane GaN는 c축 방향으로 발생하는 분극의 영향을 받게 된다. 분극은 LED내 양자우물의 밴드를 기울게 하여 그 결과 전자와 홀의 재결합 확률을 감소시켜 낮은 내부양자효율을 가지게 된다. 이러한 문제를 해결하기 위한 여러 가지 방법들이 제시되었는데 그 중에서도 특히 a-plane 혹은 m-plane면과 같은 무분극 면을 사용하는 GaN LED가 주목받고 있다. 그 이유는 무분극 면은 분극이 발생하는 c축과 수직이기 때문에 분극의 영향을 받지 않아 높은 내부 양자효율을 가질수 있다. 본 연구에서는 MOCVD 장비를 사용하여 2인치 r-plane 사파이어 기판위에 3um두께의 a-plane GaN을 성장하였다. 그위에 2um정도로 Si을 도핑하여 n-type GaN 형성한후 단일 양자우물, 그리고 Mg을 도핑하여 p-type GaN을 성장하였다. 장파장대역의 a-plane LED의 특성을 알아보기 위해서 양자우물 형성시 In의 조성비를 높였다. 일반적인 포토리소그래피 공정과 Dry etching 공정을 사용하여 메사구조를 형성하였으며 Ti/Al/Pt/Au와 Ni/Au를 각각 n-type과 p-type의 전극 물질로 사용하였다. 제작된 LED의 특성을 파악하기 위해서 인가전류를 0부터 100mA까지 출력 스펙트럼을 측정하였으며 orange대역의 파장을 갖는 LED를 얻었다. 인가전류별 Peak 파장의 변화와 반측폭의 변화를 파악하여 장파장 대역의 a-plane LED의 특성을 확인하였다.

• Korean Journal of Materials Research
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• v.21 no.11
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• pp.634-638
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• 2011

We report growth of epitaxial AlN thin films on c-plane sapphire substrates by plasma-assisted molecular beam epitaxy. To achieve two-dimensional growth the substrates were nitrided by nitrogen plasma prior to the AlN growth, which resulted in the formation of a two-dimensional single crystalline AlN layer. The formation of the two-dimensional AlN layer by the nitridation process was confirmed by the observation of streaky reflection high energy electron diffraction (RHEED) patterns. The growth of AlN thin films was performed on the nitrided AlN layer by changing the Al beam flux with the fixed nitrogen flux at 860$^{\circ}C$. The growth mode of AlN films was also affected by the beam flux. By increasing the Al beam flux, two-dimensional growth of AlN films was favored, and a very flat surface with a root mean square roughness of 0.196 nm (for the 2 ${\mu}m$ ${\times}$ 2 ${\mu}m$ area) was obtained. Interestingly, additional diffraction lines were observed for the two-dimensionally grown AlN films, which were probably caused by the Al adlayer, which was similar to a report of Ga adlayer in the two-dimensional growth of GaN. Al droplets were observed in the sample grown with a higher Al beam flux after cooling to room temperature, which resulted from the excessive Al flux.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.306-307
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• 2011

Franz Keldysh Oscillation (FKO)은 p-n 접합 구조의 공핍층(depletion zone)에서 전기장(electric field)에 의해 발생되며, Photoreflectance (PR) spectroscopy를 통하여 관측된다. InAs/GaAs 양자점 태양전지(Quantum Dot Solar Cells, QDSCs)에서 PR 신호에 대한 Fast Fourier Transform (FFT)을 통하여 FKO 주파수들을 관측할 수 있고, 각각의 FKO 주파수들은 태양전지 구조에 대응하는 표면 및 내부전기장(internal electric field) 들로 분류할 수 있다. InAs/GaAs 양자점 태양전지에서 AlGaAs potential barrier의 두께에 따른 내부전기장의 변화를 조사하기 위해, GaAs-matrix에 8주기의 InAs 양자점 층이 삽입된 태양전지를 molecular beam epitaxy (MBE) 방법으로 성장하였다. 양자점의 크기는 2.0 monolayer (ML)이며, 각 양자점 층은 1.6 nm에서 6.0 nm의 AlGaAs potential barrier들로 분리되어 있다. 또한 양자점 층의 위치에 따라 내부전기장 변화를 조사하기 위해, p-i-n 구조에서 양자점 층이 공핍층 내에 위치한 경우와 p+-n-n+ 구조에서 양자점 층이 공핍 층으로부터 멀리 떨어진 n-base 영역에 삽입하여 실험결과를 비교분석하였다. PR 실험결과로부터, p-i-n 구조에서 InAs 양자점 태양전지의 내부전기장 변화는 potential barrier 두께에 따라 다소 복잡한 변화를 보였으며, 이는 양자점 층이 공핍층 내에 위치함으로써 격자 불일치(lattice mismatch)로 발생된 응력(strain)의 영향으로 설명할 수 있다. 이러한 결과들을 각각의 태양전지 구조에서 표면 및 내부전기장에 대해 계산된 값들에 근거하여, p+-n-n+ 구조에서 양자점 층이 공핍 층으로부터 멀리 떨어진 영역에 삽입된 경우의 결과와 비교해 보면 내부전기장의 변화는 더욱 분명해진다. 즉, 양자점 층의 potential barrier의 두께를 조절하거나, 양자점 층의 위치를 변화시킴으로써 양자점 태양전지의 내부전기장을 조작할 수 있으며, 이는 PR 실험을 통해 FKO를 관측함으로써 확인할 수 있다.

• ETRI Journal
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• v.27 no.3
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• pp.304-311
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• 2005

We report on the fabrication of an AlGaAs/InGaAs/GaAs pseudomorphic high electron mobility transistor (PHEMT) using a dielectric-defined process. This process was utilized to fabricate $0.12\;{\mu}m\;{\times}\;100 {\mu}m$ T-gate PHEMTs. A two-step etch process was performed to define the gate footprint in the $SiN_x$. The $SiN_x$ was etched either by dry etching alone or using a combination of wet and dry etching. The gate recessing was done in three steps: a wet etching for removal of the damaged surface layer, a dry etching for the narrow recess, and wet etching. A structure for the top of the T-gate consisting of a wide head part and a narrow lower layer part has been employed, taking advantage of the large cross-sectional area of the gate and its mechanically stable structure. From s-parameter data of up to 50 GHz, an extrapolated cut-off frequency of as high as 104 GHz was obtained. When comparing sample C (combination of wet and dry etching for the $SiN_x$) with sample A (dry etching for the $SiN_x$), we observed an 62.5% increase of the cut-off frequency. This is believed to be due to considerable decreases of the gate-source and gate-drain capacitances. This improvement in RF performance can be understood in terms of the decrease in parasitic capacitances, which is due to the use of the dielectric and the gate recess etching method.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.557-560
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• 2008

The main goal of this work is to fabricate light emitting diode (LED) module and apply it to mobile handset. We first fabricated the blue-color LED based on the AlInGaN cell structure with size of $200\;{\mu}m\;{\times}\;200\;{\mu}m$. Also we proposed a new $1.0\;mm\;{\times}\;0.5\;mm$ (1005size) packaging procedure for the LED cell. Thus the overall dimension of our LED cell was as small as $1.0\;mm\;{\times}\;0.5\;mm\;{\times}\;0.4\;mm$ ($W\;{\times}\;L\;{\times}\;T$). As far as we knew it was the first time that this small LED cell dimension had been fabricated and operated.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.27 no.1
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• pp.76-79
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• 2016

This paper describes the successful development and the performance of X-band 50 W pulsed power amplifier using a 50 W GaN-on-SiC high electron mobility transistor. The GaN HEMT with a gate length of $0.25{\mu}m$ and a total gate width of 12 mm were fabricated. The X-band pulsed power amplifier exhibited an output power of 50 W with a power gain of 6 dB in a frequency range of 9.2~9.5 GHz. It also shows a maximum output power density of 4.16 W/mm. This 50 W GaN HEMT and X-band 50 W pulsed power amplifier are suitable for the radar systems and related applications in X-band.