• Title/Summary/Keyword: AlGaInP

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Simulation Study on Heterojunction InGaP/InAlGaP Solar Cell (InGaP/InAlGaP 이종 접합구조 태양전지 시뮬레이션 연구)

  • Kim, Junghwan
    • Journal of the Korean Vacuum Society
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    • v.22 no.3
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    • pp.162-167
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    • 2013
  • An epitaxial layer structure for heterojunction p-InGaP/N-InAlGaP solar cell has proposed. Simulation for current density-voltage characteristics has been performed on p-InGaP/N-InAlGaP structure and the simulation results were compared with p-InGaP/p-GaAs/N-InAlGaP structure and homogeneous InGaP pn junction structure. The simulation result showed that the maximum output power and fill factor have greatly increased by replacing n-InGaP with N-InAlGaP. The thicknesses of p-InGaP and n-InAlGaP were optimized for the epitaxial layer structure of p-InGaP/N-InAlGaP.

Growth of GaAs/AlGaAs structure for photoelectric cathode (광전음극 소자용 GaAs/AlGaAs 구조의 LPE 성장)

  • Bae, Sung Geun;Jeon, Injun;Kim, Kyoung Hwa
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.27 no.6
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    • pp.282-288
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    • 2017
  • In this paper, GaAs/AlGaAs multi-layer structure was grown by liquid phase epitaxy with graphite sliding boat, which can be used as a device structure of a photocathode image sensor. The multi-layer structure was grown on an n-type GaAs substrate in the sequence as follows: GaAs buffer layer, Zn-doped p-type AlGaAs layer as etching stop layer, Zn-doped p-type GaAs layer, and Zn-doped p-type AlGaAs layer. The Characteristics of GaAs/AlGaAs structures were analyzed by using scanning electron microscope (SEM), secondary ion mass spectrometer (SIMS) and hall measurement. The SEM images shows that the p-AlGaAs/p-GaAs/p-AlGaAs multi-layer structure was grown with a mirror-like surface on a whole ($1.25mm{\times}25mm$) substrate. The Al composition in the AlGaAs layer was approximately 80 %. Also, it was confirmed that the free carrier concentration in the p-GaAs layer can be adjusted to the range of $8{\times}10^{18}/cm^2$ by hall measurement. In the result, it is expected that the p-AlGaAs/p-GaAs/p-AlGaAs multi-layer structure grown by the LPE can be used as a device structure of a photoelectric cathode image sensor.

Surface Photovoltage Characteristics of ${In_{0.5}}({Ga_{1-x}}{Al_x})_{0.5}P$/GaAs Double Heterostructures (${In_{0.5}}({Ga_{1-x}}{Al_x})_{0.5}P$/GaAs 이중 이종접합 구조에 대한 표면 광전압 특성)

  • Kim, Ki-Hong;Choi, Sang-Soo;Bae, In-Ho;Kim, I n-Soo;Park, Sung-Bae
    • Korean Journal of Materials Research
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    • v.11 no.8
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    • pp.655-660
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    • 2001
  • Surface photovoltage spectroscopy was used to study $In_{0.5}(Ga_{1-x}Al_x)_{0.5}P/GaAs$ grown by metalorganic chemical vapor deposition(MOCVD). Energy gap related transition in GaAs and $In_{0.5}(Ga_{1-x}Al_x)_{0.5}P$ were observed. By measuring the frequency dependence of $In_{0.5}(Ga_{1-x}Al_x)_{0.5}P/GaAs$, we observed that SPV line shape does not chance, whereas the amplitude change. This results is due to the difference in the lifetimes of the photocarriers in GaAs and in $In_{0.5}(Ga_{1-x}Al_x)_{0.5}P$. We also have evaluated the parameters that describe the temperature dependences of the band gap.

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Fabrication of a depletion mode p-channel GaAs MOSFET using $Al_2O_3$ gate insulator ($Al_2O_3$ 게이트 절연막을 이용한 공핍형 p-채널 GaAs MOSFET의 제조)

  • Jun, Bon-Keun;Lee, Tae-Hyun;Lee, Jung-Hee;Lee, Yong-Hyun
    • Journal of Sensor Science and Technology
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    • v.8 no.5
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    • pp.421-426
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    • 1999
  • In this paper, we present p-channel GaAs MOSFET having $Al_2O_3$ as gate insulator fabricated on a semi-insulating GaAs substrate, which can be operated in the depletion mode. $1\;{\mu}m$ thick undoped GaAs buffer layer, $4000\;{\AA}$ thick p-type GaAs epi-layer, undoped $500{\AA}$ thick AlAs layer, and $50\;{\AA}$ thick GaAs cap layer were subsequently grown by molecular beam epitaxy(MBE) on (100) oriented semi-insulating GaAs substrate and this wafer was oxidized. AlAs layer was fully oxidized as a $Al_2O_3$ thin film. The I-V, $g_m$, breakdown charateristics of the fabricated GaAs MOSFET showed that wet thermal oxidation of AlAs/GaAs epilayer/S I GaAs was successful in realizing depletion mode p-channel GaAs MOSFET.

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Improvement of Brightness for AlGaInP High-brightness LEDs with Nano-scale Roughness on Top-GaP Surface (Top-GaP 상부에 나노 크기의 Roughness 처리에 의한 AlGaInP 고휘도 LED의 휘도 향상)

  • So, Soon-Jin;Ha, Hun-Sung;Park, Choon-Bae
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.21 no.1
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    • pp.68-72
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    • 2008
  • AlGaInP high-brightness LEDs(HB-LEDs) have gained importance a variety of application operating in the red, orange, yellow and yellow-green wavelength. The light generated from inside LED chips should be emitted to the air through the surfaces of the chips. However, because of the differences between the semiconductor and air or epoxy's refractive index, some of the light was blocked so that caused lowering external quantum efficiency. In this study, nano-scale roughness on the top-GaP layer of AlGaInP epitaxial wafer was fabricated to improve' the brightness of AlGaInP LEDs. Nano-scale roughness was made by ICP dry etcher. Our AlGaInP LEDs with nano-scale roughness has higher brightness (about 28.5 %) than standard AlGaInP LEDs.

DC characteristics and reliability of InGaP/GaAs HBTs (InGaP/GaAs HBT 의 DC 특성과 신뢰도)

  • 최번재;최재훈;송정근
    • Proceedings of the IEEK Conference
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    • 1998.06a
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    • pp.401-404
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    • 1998
  • Recently, InGaP/GaAs HBTs have been much interested as a potential replacement for AlGaAs/GaAs HBTs because of their superior device and material properties. In this paper, DC characteristics of InGaP/GaAs HBTs and the temperature dependance as well as the reliability were investigated comparing with AlGaAs/GaAs HBTs. As a results InGaP/GaAs HBTs produced the superior performance to AlGaAs/GaAs HBTs.

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Development of Selective GaN etching Process for p-GaN/AlGaN/GaN E-mode FET Fabrication (p-GaN/AlGaN/GaN E-mode FET 제작을 위한 선택적 GaN 식각 공정 개발)

  • Jang, Won-Ho;Cha, Ho-Young
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.24 no.2
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    • pp.321-324
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    • 2020
  • In this work, we developed a selective etching process for GaN that is a key process in p-GaN/AlGaN/GaN enhancement-mode (E-mode) power switching field-effect transistor (FET) fabrication. In order to achieve a high current density of p-GaN/AlGaN/GaN E-mode FET, the p-GaN layer beside the gate region must be selectively etched whereas the underneath AlGaN layer should be maintained. A selective etching process was implemented by oxidizing the surface of the AlGaN layer and the GaN layer by adding O2 gas to Cl2/N2 gas which is generally used for GaN etching. A selective etching process was optimized using Cl2/N2/O2 gas mixture and a high selectivity of 53:1 (= GaN/AlGaN) was achieved.

Analysis of the Abnormal Voltage-Current Behaviors on Localized Carriers of InGaN/GaN Multiple Quantum well from Electron Blocking Layer

  • Nam, Giwoong;Kim, Byunggu;Park, Youngbin;Kim, Soaram;Kim, Jin Soo;Son, Jeong-Sik;Leem, Jae-Young
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.08a
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    • pp.219-219
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    • 2013
  • The effect of an electron blocking layer (EBL) on V-I curves in GaN/InGaN multiple quantum well is investigated. For the first time, we found that curves were intersected at 3.012 V and analyzed the reason for intersection. The forward voltage in LEDs with an p-AlGaN EBL is larger than without p-AlGaN EBL at low injection current because the Mg doping efficiency for p-GaN layer was higher than that of p-AlGaN layer. However, the forward voltage in LEDs with an p-AlGaN EBL is smaller than without p-AlGaN EBL at high injection current because the carriers overflow from the active layer when injection current increases in LEDs without p-AlGaN EBL and in case of LED with p-AlGaN EBL, the carriers are blocked by EBL.

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Contactless Electroreflectance Spectroscopy of In0.5(Ga1-xAlx)0.5P/GaAs Double Heterostructures (In0.5(Ga1-xAlx)0.5P/GaAs 이중 이종접합 구조의 Contactless Electroreflectance에 관한 연구)

  • Kim, Jeong-Hwa;Jo, Hyun-Jun;Bae, In-Ho
    • Journal of the Korean Vacuum Society
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    • v.19 no.2
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    • pp.134-140
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    • 2010
  • We have investigated the contactless electroreflectance (CER) properties of $In_{0.5}(Ga_{1-x}Al_x)_{0.5}P$/GaAs double heterostructures grown by metal-organic chemical vapour deposition (MOCVD). The CER measurements on the sample were studied as a function of temperature, modulation voltage ($V_{ac}$), and dc bias voltage ($V_{bias}$). Five signals observed at room temperature are related to the GaAs, $In_{0.5}Ga_{0.5}P$, $In_{0.5}(Ga_{0.73}Al_{0.27})_{0.5}P$, $In_{0.5}(Ga_{0.5}Al_{0.5})_{0.5}P$, and $In_{0.5}(Ga_{0.2}Al_{0.8})_{0.5}P$ transitions, respectively. From the temperature dependence of CER spectrum, the Varshni coefficients and broadening parameters were determined and discussed. In addition, we found that the behavior of the CER amplitude for the reverse bias is larger than that of the forward.

Comparison of Quantum Wells based on InGaAs(P)/InP and InGa(Al)As/InAlAs Material Systems in View of Carrier Escape Times for High-Saturation-Optical-Power Electroabsorption Modulators

  • Kim, Kang-Baek;Shin, Dong-Soo
    • Journal of the Optical Society of Korea
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    • v.11 no.3
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    • pp.133-137
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    • 2007
  • We compare electroabsorption modulators (EAMs) with multiple quantum wells (MQWs) based on InGaAs(P)/InP and InGa(Al)As/InAlAs material systems. We carefully choose the quantum-well structures so that the structures based on different material systems have similar band-offset energies and excition-peak wavelengths. Assuming the same light wavelength of $1.55{\mu}m$, we show the transfer functions of EAMs with each quantum-well structure and calculate the escape times of photogenerated charge carriers. As the heavy-hole escape time of the quantum well based on InGaAs(P)/InP is much longer than those of photogenerated charge carriers of InGa(Al)As/InAlAs, the EAM based on the InGa(Al)As/InAlAs material seems to be more suitable for high-optical-power operation.