• 한국주조공학회지
• /
• 제22권4호
• /
• pp.174-183
• /
• 2002

Twin-roll process is a relatively new continuous casting process which can produce high-quality strip products directly, and solidification rate can reach $10^3$ to $10^4$ K/s, leading to fine and uniform microstructures with enhanced mechanical properties. The strip casting condition for producing fine Al-Sn alloy strip was obtained experimentally, and defects appearing on the strip was examined. Crack formation and surface quality of the strip was found to depend mainly on process parameters such as melt temperature, roller gap and rolling speed. Sn structure of network type was observed in Al-20Sn and Al-40Sn alloy strips, and cell spacing of Al-40Sn alloy was smaller than that of Al-20Sn. Banding strength of the heat treated specimens increased with increasing of soaking time and temperature, and bonding strength of Al-20Sn alloy was more superior than that of Al-40Sn alloy. However wear resistance of Al-40Sn alloy contained large amount of soft Sn which possess good anti-friction characteristics was superior than that of Al-20Sn alloy.

• 마이크로전자및패키징학회지
• /
• 제19권2호
• /
• pp.35-39
• /
• 2012

플립칩 접합시 발생하는 계면반응 거동과 접합특성을 계면에 생성되는 금속간화합물의 관점에서 접근하였다. 이를 위하여 Al/Cu와 Al/Ni의 under bump metallization(UBM) 층과 Sn-Cu계 솔더(Sn-3Cu, Sn-0.7Cu)와의 반응에 의한 금속간화합물의 형성거동 및 계면접합성을 분석하였다. Al/Cu UBM 상에서 Sn-0.7Cu 솔더를 리플로우한 경우에는 솔더/UBM 계면에서 금속간화합물이 형성되지 않았으며, Sn-3Cu를 리플로우한 경우에는 계면에서 생성된 $Cu_6Sn_5$ 금속간화합물이 spalling 되어 접합면이 분리되었다. 반면에 Al/Ni UBM 상에서 Sn-Cu계 솔더를 리플로우한 경우에는 0.7 wt% 및 3 wt%의 Cu 함량에 관계없이 $(Cu,Ni)_6Sn_5$ 금속간화합물이 계면에 형성되어 있었으며, 계면접합이 안정적으로 유지되었다.

• 대한금속재료학회지
• /
• 제48권3호
• /
• pp.248-255
• /
• 2010

The effect of various alloying elements and melt treatment on the microstructural control of Al-Sn metallic bearing alloy was investigated. The thickness of tin film crystallized around primary aluminum decreased with the addition of 5% Cu in Al-Sn alloy, with tin particles being reduced in size by intervening the Ostwald ripening. With the addition of Si in Al-10%Sn alloy, the tin particles were crystallized with eutectic silicon, resulting in uniform distribution of tin particles. With the addition of Cu and Si in Al-Sn alloy, both the tensile strength and yield strength increased, with the increasing rate of yield strength being less than that of tensile strength. Although the Al-10%Sn-7%Si alloy has similar tensile strength compared with Al-10%Sn-5%Cu, the former showed superior abrasion resistance, resulting from preventing the tin particles from movement to the abrasion surface.

• Journal of Welding and Joining
• /
• 제33권3호
• /
• pp.19-24
• /
• 2015

Joint properties of electric control unit (ECU) module using Sn-Cu-(X)Al(Si) lead-free solder alloy were investigated for automotive electronics module. In this study, Sn-0.5Cu-0.01Al(Si) and Sn-0.5Cu-0.03Al(Si) (wt.%) lead-free alloys were fabricated as bar type by doped various weight percentages (0.01 and 0.03 wt.%) of Al(Si) alloy to Sn-0.5Cu. After fabrications of lead-free alloys, the ball-type solder alloys with a diameter of 450 um were made by rolling and punching. The melting temperatures of 0.01Al(Si) and 0.03Al(Si) were 230.2 and $230.8^{\circ}C$, respectively. To evaluation of properties of solder joint, test printed circuit board (PCB) finished with organic solderability perseveration (OSP) on Cu pad. The ball-type solders were attached to test PCB with flux and reflowed for formation of solder joint. The maximum temperature of reflow was $260^{\circ}C$ for 50s above melting temperature. And then, we measured spreadability and shear strength of two Al(Si) solder materials compared to Sn-0.7Cu solder material used in industry. And also, microstructures in solder and intermetallic compounds (IMCs) were observed. Moreover, thickness and grain size of $Cu_6Sn_5$ IMC were measured and then compared with Sn-0.7Cu. With increasing the amounts of Al(Si), the $Cu_6Sn_5$ thickness was decreased. These results show the addition of Al(Si) could suppress IMC growth and improve the reliability of solder joint.

• 한국재료학회지
• /
• 제12권4호
• /
• pp.248-253
• /
• 2002

Effect of Sn addition on the fatigue properties of Al-Cu-Mn cast alloy was investigated by low and high cycle fatigue tests. Fatigue life showed the maximum value of 5450cycles in the Al-Cu-Mn alloy containing 0.10%Sn, but decreased rapidly beyond 0.20% of Sn additions. It was found that the fatigue strength was 132MPa and fatigue ratio was 0.31 in the alloy containing 0.10%Sn. Metallographic observation revealed that the fatigue crack initiated at the surface and propagated along the grain boundary. This propagation path was attributed to the presence of PFZ along the grain boundary. The tensile strength increased from 330MPa in 7he Sn-free Al-Cu-Mn cast alloy to 429MPa in the alloy containing 0.10%Sn. But above 0.20%Sn additions, tensile strength was decreased by the segregation of Sn.

• 한국응용과학기술학회지
• /
• 제33권2호
• /
• pp.401-410
• /
• 2016

금속 산화물과 혼합한 $Pt-Sn/Al_2O_3$ 촉매의 프로판 탈수소 반응 성능의 향상 가능성에 대해서 연구하였다. 금속 산화물로서 $Cu-Mn/{\gamma}-Al_2O_3$, $Ni-Mn/{\gamma}-Al_2O_3$, $Cu/{\alpha}-Al_2O_3$를 제조하여 $Pt-Sn/Al_2O_3$ 촉매와 혼합하고, 프로판 탈수소 반응 성능을 측정하였다. 이 결과들을 불활성 물질인 glass bead를 혼합한 $Pt-Sn/Al_2O_3$ 촉매를 기준샘플로 삼아 비교하였다. 촉매와 금속산화물을 환원처리하지 않고 반응 실험한 경우, $576.5^{\circ}C$에서 기준샘플의 전환율 8% 대비, $Cu-Mn/{\gamma}-Al_2O_3$를 혼합한 $Pt-Sn/Al_2O_3$ 촉매가 14.9%의 높은 전환율과 96.8%의 선택도를 보였다. 촉매와 금속산화물을 환원 처리하여 반응활성을 측정한 경우, $Cu/{\alpha}-Al_2O_3$과 $Pt-Sn/Al_2O_3$의 혼합촉매가 기준샘플대비 초기에 높은 수율을 보였다. 그러나, 촉매를 환원 처리한 경우 전반적으로 전환율 상승이 크지 않았고, 이것으로 $Cu-Mn/{\gamma}-Al_2O_3$의 격자산소가 탈수소반응의 전환율 증가 영향을 주었음을 알 수 있었다.

• 한국주조공학회지
• /
• 제34권6호
• /
• pp.187-193
• /
• 2014

In the present work, the effect of adding Ce on the corrosion behavior of Mg-4Al-2Sn-1Ca alloy was investigated. The studied alloys were fabricated by gravity casting method and a potentiodynamic polarization, A.C. impedance and hydrogen evolution tests were carried out in a 3.5% NaCl solution with pH 7.2 at room temperature to measure the corrosion properties of Mg-4Al-2Sn-1Ca-xCe alloys. The microstructure of the Mg-4Al-2Sn-1Ca alloy was composed of ${\alpha}$-Mg, Mg17Al12, Mg2Sn and CaMgSn phase. Also, a $Al_{11}Ce_3$ phase was newly formed by the addition of Ce. With an increase of the Ce contents, the microstructure became refined and the corrosion resistance improved.

• Corrosion Science and Technology
• /
• 제10권2호
• /
• pp.71-75
• /
• 2011

Corrosion properties of Al-0.3Ga-0.3Sn, Al-0.3Mn-0.3Ga, and Al-0.3Mn-0.3Sn alloys were examined to develop an anode material for Al-air battery with alkaline aqueous or ethanol electrolyte. The results of potentiodynamic polarization tests showed that the electrode potential of the Al alloys were lower than the pure Al, implying the cell voltage can be increased by using one of these alloys for an anode in 4 M KOH aqueous solution. The corrosion rate appeared to be increased by alloying Ga but to be reduced by Sn and Mn in the aqueous solution. The ethanol solution is expected to improve the cell performance in that the electrode potential and the corrosion rate of Al were lower in ethanol solution than in aqueous solution. However the Al-(Ga, Sn, Mn) alloys are not favorable in ethanol solution because of the high potential and corrosion rate.

• 열처리공학회지
• /
• 제27권4호
• /
• pp.185-190
• /
• 2014

The influences of small amount of Sn addition on microstructure and creep resistance of AZ91-0.4%Ca alloy have been investigated. The microstructure of the AZ91-0.4%Ca alloy was characterized by ${\alpha}$-(Mg) dendrite cells surrounded by eutectic ${\beta}(Mg_{17}Al_{12})$ and $Al_2Ca$ phases. The 0.5%Sn addition resulted in the formation of rod-shaped CaMgSn particles with the extinction of $Al_2Ca$. The Sn-containing alloy exhibited better creep resistance below $175^{\circ}C$, but the tendency was reversed above $200^{\circ}C$. The reason was discussed in relation to the change in thermal stability of ${\beta}$ phase in response to the Sn addition.

• 한국재료학회지
• /
• 제26권7호
• /
• pp.376-381
• /
• 2016

For the development of a low-melting point filler metal for brazing aluminum alloy, we analyzed change of melting point and wettability with addition of Sn into Al-20Cu-10Si filler metal. DSC results showed that the addition of 5 wt% Sn into the Al-20Cu-10Si filler metal caused its liquidus temperature to decrease by about 30 oC. In the wettability test, spread area of melted Al-Cu-Si-Sn alloy is increased through the addition of Sn from 1 to 5 wt%. For the measuring of the mechanical properties of the joint region, Al 3003 plate is brazed by Al-20Cu-10Si-5Sn filler metal and the mechanical property is measured by tensile test. The results showed that the tensile strength of the joint region is higher than the tensile strength of Al 3003. Thus, failure occurred in the Al 3003 plate.